Feeders at a placement machine are replaced, automatically, according to a new protocol in which a partially-depleted feeder is temporarily moved from its slot to an external storage, a full replacement feeder is put in its slot, and the partially-depleted feeder is returned to a spare slot of the placement machine, from where its remaining components are picked.
The invention relates to a holding device (10) for holding a plurality of feeder devices (140) for providing electronic components (110) to a pick and place machine, the holding device (10) comprising a basic body (20) with a holding volume (22) for holding the plurality of feeder devices (140) and at least one opening device (40) for opening and closing the holding volume (22), wherein the holding device (10) comprises a detection device (60) and a control device (70), wherein the detection device (60) is designed to detect a transport device (160) separate from the holding device (10) for transporting at least one feeder device (140) and the control device (70) is designed to automatically open and close the opening device (40) on the basis of the detected transport device (160). The invention also relates to a holding process (200).
A placement head for automatically placing electronic components on a component carrier. The placement head has a chassis; a first rotor assembly that is mounted so that it is rotatable relative to the chassis about a first axis of rotation and that has a first quantity of first handling devices; and a second rotor assembly that is mounted so that it is rotatable relative to the chassis about a second axis of rotation and that has a second quantity of second handling devices. Each handling device includes a sleeve to which a component holding device for temporarily picking up a component can be attached, and a drive device with a linear drive for moving the sleeve along its longitudinal axis, and a rotary drive for rotating the sleeve about its longitudinal axis. Furthermore, a placement machine with such a placement head and a method for automatic assembly of a component carrier using such a placement head.
A handling device (100) for automatically exchanging component feeders (390) at a pick and place station (4000) for assembling component carriers with electronic components is described. The handling device (100) comprises (a) a chassis (110); (b) a drive (120) with a stationary drive component (122) attached to the chassis (110) and a movable drive component (126) which can be spatially positioned along a y-direction; (c) a first coupling device (130a) which is attached to the movable drive component (126) and which has a first coupling element (234) and a first actuator (232); (d) a second coupling device (130b), which is also attached to the movable drive component (126) and which comprises a second coupling element (234) and a second actuator (232); and (e) a control device (102), which is configured to individually actuate the first actuator (232) and to individually actuate the second actuator (232). The first coupling element (234) is configured to couple with a first component feeder (190a) when the first actuator (232) is actuated, and the second coupling element (234) is configured to couple with a second component feeder (190b) when the second actuator (232) is actuated. Furthermore, a robotic system (150) with such a handling device (100) is described.
B66F 9/06 - Dispositifs pour lever ou descendre des marchandises volumineuses ou lourdes aux fins de chargement ou de déchargement se déplaçant, avec leurs charges, sur des roues ou sur un dispositif analogue, p. ex. chariots élévateurs à fourche
B66F 9/075 - Caractéristiques de construction ou détails
B66F 9/12 - Plates-formesFourchesAutres organes soutenant ou saisissant la charge
B66F 9/18 - Moyens pour saisir ou maintenir la charge
A holding plate for providing components to a pick and place machine comprises at least two support devices for vertically supporting carrier plates for components in a predetermined horizontal position, a limiting device per support device for horizontally limiting the respective carrier plate, wherein the holding plate has a pin holding volume for at least partially holding pins of the components inserted through the carrier plate, and wherein the holding plate comprises at least one fastening device for fastening the respective carrier plate.
H01L 21/673 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants utilisant des supports spécialement adaptés
A method and a pick and place line for predicting a time for replenishing pick and place material (C) comprises (a) detecting a current filling level of component material from a first component feeder; (b) determining the planned pick and place operations which are still required in order to populate all component carriers (PCB) of a current batch production in a first pick and place station; (c) determining a position of a component carrier along the transport path which has been populated in a second pick and place station and which is still to be populated in the first pick and place station; and (d) predicting the time for replenishing pick and place material at the first feed track based on the detected current filling level, the determined planned populated operations and the determined current position.
The invention relates to a camera (130) for detecting objects (192), the camera (130) comprising (a) an illumination device (240) for illuminating an object (192) which is located in an object plane (230a) of the camera (130); and (b) a camera sensor (285) for capturing an image of the object (192) illuminated by the illumination device (240). The illumination device (240) has (a1) a first illumination structure (350) with a plurality of first light sources (351) for illuminating the object (192) with a first illumination light (352) at a first illumination angle; (a2) a second illumination structure (360) having a plurality of second light sources (361) for illuminating the object (192) with a second illumination light (362) at a second illumination angle that is different from the first illumination angle; and (a3) an optical lens array (354) with a plurality of individual lenses (355) for collimating the first illumination light (352) and for collimating the second illumination light (362). Each individual lens (355) is assigned at least a first light source (351) and each individual lens (355) is assigned at least two second light sources (361). The invention further relates to a camera system (125) with two such cameras (130) and an automated placement machine having at least one such camera (130).
H04N 23/58 - Moyens permettant de modifier le champ de vision de la caméra sans déplacer le corps de la caméra, p. ex. par nutation ou pivotement des optiques ou des capteurs d'images
H04N 23/90 - Agencement de caméras ou de modules de caméras, p. ex. de plusieurs caméras dans des studios de télévision ou des stades de sport
8.
SUPPORT PIN FOR SUPPORTING A SUBSTRATE IN A PLACEMENT AREA OF A PLACEMENT MACHINE AND PLACEMENT MACHINE
The invention relates to a support pin (10) for supporting a substrate (80) in a placement area of a placement machine (100) and a placement machine (100) with at least one placement head (101), a magazine (104) with a plurality of such support pins (10) and a placement board (103).
Described is an apparatus (100) and a method for exchanging a component part feed device (285) on a pick-and-place machine (BA1, BA2, BA3). The apparatus (100) has: (a) a trolley (210) configured to move autonomously on a ground surface (193); (b) a positioning system (230) comprising a static positioning component (232), which is spatially fixedly attached to the trolley (210), and a positioning component (234), which is movable relative to the static positioning component (232); and (c) an exchanging device (240), which is attached to the movable positioning component (234) and which is configured to releasably attach a component part feed device (285) to the pick-and-place machine (BA1, BA2, BA3), or remove said component part feed device from the pick-and-place machine (BA1, BA2, BA3), in a linear exchanging direction (240a) parallel to a y axis. The positioning system (230) is configured such that the movable positioning component (234) is rotatable about a vertical z axis (S), and linearly movable along the vertical z axis (S), relative to the static positioning component (232).
The invention relates to a method (200) for supplying SMT-components (12) within feeder cartridges (10) to a placement device (150) for the SMT-components (12), the placement device (150) having multiple slots (152) for installing the feeder cartridges (10) to transfer the SMT-components (12) from each of the feeder cartridges (10) to the placement device (150), the method (200) comprising the following steps:
Determining (202) a run-out-time (t1) for a first feeder cartridge (10) within a first slot (152) of the placement device (150) by a supply system (100),
Supplying (204) a second feeder cartridge (10) to a second slot (152) of the placement device (150) by the supply system (100) before the run-out-time (t1) of the first feeder cartridge (10) is reached, wherein the second feeder cartridge (10) includes the same SMT-components (12) as the first feeder cartridge (10).
The invention relates to a method (200) for supplying SMT-components (12) within feeder cartridges (10) to a placement device (150) for the SMT-components (12), the placement device (150) having multiple slots (152) for installing the feeder cartridges (10) to transfer the SMT-components (12) from each of the feeder cartridges (10) to the placement device (150), the method (200) comprising the following steps:
Determining (202) a run-out-time (t1) for a first feeder cartridge (10) within a first slot (152) of the placement device (150) by a supply system (100),
Supplying (204) a second feeder cartridge (10) to a second slot (152) of the placement device (150) by the supply system (100) before the run-out-time (t1) of the first feeder cartridge (10) is reached, wherein the second feeder cartridge (10) includes the same SMT-components (12) as the first feeder cartridge (10).
Furthermore, the invention relates to a supply system (100) for supplying feeder cartridges (10) with SMT-components (12) to a placement device (150) for the SMT-components (12), a computer program product (300) and a computer-readable medium (400).
A method for delivering components in feeder cassettes to at least one placement device by a delivery system, the method includes the following method steps:
Detection of a mandatory exchange period (t1) for each of the feeder cassettes by the delivery system,
Comparison of the recorded mandatory exchange periods (t1), wherein time conflicts (K) between the recorded mandatory exchange periods (t1) are determined by the delivery system during the comparison,
Determination of an optional exchange period (t2) for at least one of the feeder cassettes with a determined time conflict (K) by the delivery system,
Delivery of components in feeder cassettes to the at least one placement device within the at least one optional exchange period (t2) by the delivery system.
A device (150) for supplying components (197) for a placement machine (100) is described, wherein the components (197) are provided in the form of a continuous material (295). The device (150) has (a) a chassis (252); (b) a transport device (260) attached to the chassis (252) for transporting the continuous material (295) along a transport track towards a pick-up position; and (c) a cutting device (270) which is configured to cut off a section (296) at a leading end of the continuous material (295), wherein the cut-off section (296) represents a supplied component (197). Also described is a placement system (BS) having such a component supplying device (150), and a method for supplying components (197) cut off from a continuous material (295) to a placement machine.
Data associated with an electronics component within a placement process performed by a placement machine is recorded by using the camera to image a machine-readable code located on the component tape which expresses data associated with an electronics component to be picked up by the placement head. The camera could be located within the feeder or the placement head.
The invention relates to a support pin (10) for supporting a substrate (80) in a placement area of a placement machine (100) and a placement machine (100) with at least one placement head (101), a magazine (104) with a plurality of such support pins (10) and a placement board (103).
A placement head for automatically placing electronic components on a component carrier. The placement head has a chassis; a first rotor assembly that is mounted so that it is rotatable relative to the chassis about a first axis of rotation and that has a first quantity of first handling devices; and a second rotor assembly that is mounted so that it is rotatable relative to the chassis about a second axis of rotation and that has a second quantity of second handling devices. Each handling device includes a sleeve to which a component holding device for temporarily picking up a component can be attached, and a drive device with a linear drive for moving the sleeve along its longitudinal axis, and a rotary drive for rotating the sleeve about its longitudinal axis. Furthermore, a placement machine with such a placement head and a method for automatic assembly of a component carrier using such a placement head.
a) in the form of a closed tape, wherein at least a part of the closure foil (225) is releasably connected to the receiving structure (110). Further, a device (430) is described for portion-wise transferring components (298) from one such magazine (200) into a reservoir (490) for a component supply device. Further, a method is described for portion-wise transferring components from one such magazine (200) into the one such reservoir (490).
B65B 57/06 - Dispositifs de commande automatique, de vérification, d'alarme ou de sécurité sensibles à l'absence, à la présence, à l'alimentation anormale ou à la mauvaise présentation du matériau d'attache ou d'emballage des réceptacles ou des paquets et dont le fonctionnement commande ou arrête l'alimentation des objets ou matériaux à emballer
B65B 25/00 - Emballage d'autres objets présentant des problèmes particuliers
H05K 13/00 - Appareils ou procédés spécialement adaptés à la fabrication ou l'ajustage d'ensembles de composants électriques
B65B 15/04 - Fixation d'une série d'objets, p. ex. des petites pièces électriques, sur bande continue
17.
Use of placeable marker components for a staged placement of components on a carrier
A method and a placement machine for equipping a carrier with components. The procedure includes: (a) positioning of the carrier in a first spatial location within the placement machine, such that components in a first section of the carrier are placeable by a placement head of the placement machine; (b) placement, by means of the placement head, of a multitude of marker components on the carrier in an overlap area of the carrier; (c) transferring of the carrier along a transport direction into a second spatial location within the placement machine, the second spatial location being selected such that components in a second section of the carrier are placeable by the placement head and that the marker components placed in the overlap area are optically detectable by a camera; (d) second optical detection by means of the camera of the marker components placed in the overlap area; and (e) placement of a multitude of components on the carrier in predefined placement positions within the second section, the spatial locations of the placement positions on the carrier depending at least on the result of the second optical detection of the placed marker components.
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
18.
Modular-design component handling device with component gripping tools protruding from a rotation axis
A holding and drive device including a frame; a rotation structure which is attached to the frame in such a manner that it can rotate around a rotation axis; a rotation drive for rotating the rotation structure around the rotation axis; and a rotation structure interface attached to or formed on the rotation structure, to which a tool device including a plurality of sleeves can be detachably attached, which are configured for the detachable attachment of a respective component holding device protruding from the rotation axis with a radial direction component or of another tool element. A corresponding tool device, a corresponding supplementary tool device, and a component handling device constructed from these components.
A device for transferring chips from a wafer to a placement head of an automatic placement machine. The device includes a removal tool rotatable about a first axis of rotation (i) for the removing of singulated chips from the wafer, (ii) for turning the chips to provide them as FCOB chips at a first collection position, and (iii) for transferring, at a common transfer position, the chips to a turning tool rotatable about a second axis of rotation; and the rotatable turning tool (i) for receiving of chips from the removal tool, and (ii) for again turning the received chips, in order to provide them as COB chips at a second collection position. The removal tool has a plurality of first grippers, which are arranged protruding radially from the first axis of rotation in a first plane. The turning tool has a plurality of second grippers, which are arranged radially protruding from the second axis of rotation in a second plane. At least one rotatable tool of the removal tool and the turning tool has a first interface, at which a supplementary tool with a plurality of further grippers can be mounted, which are arranged radially protruding from a center axis in a further plane. The first interface is designed such that the center axis coincides with the first or second axis of rotation. A chip transfer system with such a device and with such a supplementary tool, a placement system with such a system, and a method for replacing a gripper in such a system.
H01L 21/687 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension en utilisant des moyens mécaniques, p. ex. mandrins, pièces de serrage, pinces
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
09 - Appareils et instruments scientifiques et électriques
37 - Services de construction; extraction minière; installation et réparation
Produits et services
Manufacturing machines; Machinery for electronic production; Industrial robots for manufacturing; Automated assembly machines; Machines for the assembly of semiconductor components; Machines for the processing of semiconductor wafers; Machines for the production of semiconductors; Machines for packaging semiconductors; Machines for handling parts in the production of electrical circuits and components; Wire bonding machines; Wire connection machines; Machines for packing electronic components; Machines for packing semiconductor devices; Printing machines; Screen printing machines; Screen mounting apparatus for mounting screens in frames; Parts and fittings for the aforesaid goods. Software; Software packages; Sensor software; Data-processing software; Embedded software packages; Software-programmable microprocessors; Software for enterprise technology; Software for augmented reality; Software for communication; Software for manufacturing technology; Software for computer-aided manufacturing; Software for predictive maintenance; Software for error diagnostics and corrections; Software for controlling industrial processes; Software for network and device security; Software for computer-aided software development; Software for cloud computing services; Software for the maintenance and operation of computer systems; Software for use in the manufacture and processing of electronic assemblies, electronic components and semiconductor wafers; Industrial controls with graphical user interface; Software for managing mobile devices; Software for searching and retrieving information; Testing apparatus for electronic components; Testing apparatus for semiconductor devices. Installation, maintenance and predictive maintenance of machines, manufacturing machines, machines for electronics production, industrial robots for production, machines for electronic production, automated assembly machines, machines for mounting electronic components, machines for packing semiconductor devices, machines for the production of semiconductor devices, machines for processing semiconductor wafers, machines for the production of semiconductors.
37 - Services de construction; extraction minière; installation et réparation
Produits et services
Manufacturing machines; Machinery for electronic production; Industrial robots for manufacturing; Automated assembly machines; Machines for the assembly of semiconductor components; Machines for the processing of semiconductor wafers; Machines for the production of semiconductors; Machines for packaging semiconductors; Machines for handling parts in the production of electrical circuits and components; Wire bonding machines; Wire connection machines; Machines for packing electronic components; Machines for packing semiconductor devices; Printing machines; Screen printing machines; Screen mounting apparatus for mounting screens in frames; Parts and fittings for the aforesaid goods. Installation, maintenance and predictive maintenance of machines, manufacturing machines, machines for electronics production, industrial robots for production, machines for electronic production, automated assembly machines, machines for mounting electronic components, machines for packing semiconductor devices, machines for the production of semiconductor devices, machines for processing semiconductor wafers, machines for the production of semiconductors.
09 - Appareils et instruments scientifiques et électriques
37 - Services de construction; extraction minière; installation et réparation
Produits et services
Manufacturing machines; machinery for electronic production;
industrial robots for manufacturing; automated assembly
machines; machines for the assembly of semiconductor
components; machines for the processing of semiconductor
wafers; machines for the production of semiconductors; wire
bonding machines; wire connection machines; machines for
packing electronic components; machines for packing
semiconductor devices; printing machines; machines for
handling parts in the production of electrical circuits and
components; screen mounting apparatus for mounting screens
in frames; machines for packaging semiconductors; parts and
fittings for the aforesaid goods. Software; software packages; sensor software;
data-processing software; embedded software packages;
software-programmable microprocessors; software for
enterprise technology; software for augmented reality;
software for communication; software for manufacturing
technology; software for computer-aided manufacturing;
software for predictive maintenance; software for error
diagnostics and corrections; software for controlling
industrial processes; software for network and device
security; software for computer-aided software development;
software for cloud computing services; software for the
maintenance and operation of computer systems; software for
use in the manufacture and processing of semiconductor
wafers; software drivers for enabling the
inter-communication of computer hardware and electronic
devices; industrial controls with graphical user interface;
software for managing mobile devices; software for searching
and retrieving information; testing apparatus for electronic
components; testing apparatus for semiconductor devices. Installation, maintenance and predictive maintenance of
machines, manufacturing machines, machines for electronics
production, industrial robots for production, automated
assembly machines, machines for mounting of semiconductor
devices, machines for processing of semiconductor wafers,
machines for the production of semiconductors, machines for
packing electronic components, machines for packing
semiconductor devices.
09 - Appareils et instruments scientifiques et électriques
37 - Services de construction; extraction minière; installation et réparation
Produits et services
manufacturing machines for electronics boards and components; machinery for production of electronics boards and components; automated assembly machines for electronics boards; machines for the assembly of semiconductor components; machines for the processing of semiconductor wafers; machines for the production of semiconductors; wire bonding machines; wire connection machines; machines for packing electronic components; machines for packing semiconductor devices; printing machines; machines for handling parts in the production of electrical circuits and components; screen mounting apparatus for mounting screens in frames; machines for packaging semiconductors; parts and fittings for the aforesaid goods software packages comprised of software for monitoring and controlling apparatus for manufacturing electronics boards and components; software for monitoring and controlling electronic and optical sensors; data-processing software; embedded software packages comprised of software for monitoring and controlling apparatus for manufacturing electronics boards and components; software-programmable microprocessors; software for enterprise technology, namely, a storefront and a customer product database; augmented reality software for designing, displaying and interaction with manufacturing apparatus for electronics boards and components; communication software for enabling transfer of information between manufacturing machinery and servers; software for manufacturing technology, namely, software to monitor and control factory processes; computer-aided manufacturing (CAM) software for general use; software for predictive maintenance; software for manufacturing error diagnostics and corrections; software for controlling industrial processes; software for network and device security; software for computer-aided software development; downloadable cloud-computing software for integration and networking of machinery for production of electronics boards and components; software for the maintenance and operation of computer systems; software for use in the manufacture and processing of semiconductor wafers; software drivers for enabling the inter-communication of computer hardware and electronic devices; video graphics controllers and graphic display terminals for industrial machinery controls; software for managing mobile devices; software for searching and retrieving information; testing apparatus for electronic components; testing apparatus for semiconductor devices Installation, maintenance and predictive maintenance of electronics board and component manufacturing machines, machines for electronics production, automated electronics board assembly machines, machines for mounting of semiconductor devices, machines for processing of semiconductor wafers, machines for the production of semiconductors, machines for packing electronics components, machines for packing semiconductor devices
09 - Appareils et instruments scientifiques et électriques
37 - Services de construction; extraction minière; installation et réparation
Produits et services
Manufacturing machines; Machinery for electronic production; Industrial robots for manufacturing; Automated assembly machines; Machines for the assembly of semiconductor components; Machines for the processing of semiconductor wafers; Machines for the production of semiconductors; Wire bonding machines; Wire connection machines; Machines for packing electronic components; Machines for packing semiconductor devices; Printing machines; Machines for handling parts in the production of electrical circuits and components; Screen mounting apparatus for mounting screens in frames; Machines for packaging semiconductors; Parts and fittings for the aforesaid goods. Software; Software packages; Sensor software; Data-processing software; Embedded software packages; Software-programmable microprocessors; Software for enterprise technology; Software for augmented reality; Software for communication; Software for manufacturing technology; Software for computer-aided manufacturing; Software for predictive maintenance; Software for error diagnostics and corrections; Software for controlling industrial processes; Software for network and device security; Software for computer-aided software development; Software for cloud computing services; Software for the maintenance and operation of computer systems; Software for use in the manufacture and processing of semiconductor wafers; Software drivers for enabling the inter-communication of computer hardware and electronic devices; Industrial controls with graphical user interface; Software for managing mobile devices; Software for searching and retrieving information; Testing apparatus for electronic components; Testing apparatus for semiconductor devices. Installation, maintenance and predictive maintenance of machines, manufacturing machines, machines for electronics production, industrial robots for production, automated assembly machines, machines for mounting of semiconductor devices, machines for processing of semiconductor wafers, machines for the production of semiconductors, machines for packing electronic components, machines for packing semiconductor devices.
25.
Placement machine and method for equipping a substrate with unhoused chips
A placement machine for equipping a substrate with unhoused chips is described. The placement machine has a chassis on which is mounted a feed device, providing a wafer which has a multiplicity of chips. A lifting device is mounted on the chassis, and a substrate-receiving device for receiving the substrate is mounted on the lifting device is movable relative to the chassis by the lifting device. The substrate-receiving device has a one-piece support element, which constitutes at least an upper part of the substrate-receiving device, wherein the substrate to be equipped can be laid on the one-piece support element; and a transport device for transporting the substrate on an upper side of the one-piece support element along a transport direction. The transport device is spatially integrated in the one-piece support element on the upper side of the one-piece support element.
H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p. ex. avec une résistance
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitementAppareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
A method for equipping printed circuit boards on an equipping machine, the printed circuit boards being of a first length, and the equipping machine being realized to equip printed circuit boards of a second length, the second length being more than twice as great as the first length. The equipping machine has an input section (1) and an equipping section (2), the equipping section (2) being disposed after the input section (1) in a direction of conveyance (F) of the printed circuit boards, disposed after the input section (1) in a direction of conveyance of the printed circuit boards, the printed circuit boards of the first length and the printed circuit boards of the second length being transportable, in their longitudinal direction, from the input section (1) into the equipping station (2).
A belt conveyor (10) for an automatic placement machine (50) that includes at least a rotatably mounted pinwheel (12) for conveying a belt (11), a drive (14) with at least one gear wheel (16) for driving the pinwheel (12) and a position-determining device (20) for determining a rotational position of the pinwheel (12), the position-determining device (20) having a first sensor device (30) with at least one magnetoresistive sensor arrangement (31). The disclosure further includes an automatic placement machine (50) having at least one belt conveyor (10).
B65G 23/06 - Tambours, rouleaux ou roues avec saillies s'engageant dans des butées sur les courroies ou les chaînes, p. ex. des roues dentées
G01D 5/16 - Moyens mécaniques pour le transfert de la grandeur de sortie d'un organe sensibleMoyens pour convertir la grandeur de sortie d'un organe sensible en une autre variable, lorsque la forme ou la nature de l'organe sensible n'imposent pas un moyen de conversion déterminéTransducteurs non spécialement adaptés à une variable particulière utilisant des moyens électriques ou magnétiques influençant la valeur d'un courant ou d'une tension en faisant varier la résistance
B65H 20/20 - Progression des bandes par des moyens pénétrant dans la bande, p. ex. des ergots
H05K 13/08 - Contrôle de la fabrication des ensembles
28.
Optical measurement of a component having structural features present at opposite sides
A method for mounting an electronic component (180) onto a component carrier (179) is described. The method comprises (a) optically capturing a first image from a first side of the component (180), at which first side a first structural feature (185) of the component (180) is discernible, by means of a first camera (120), (b) optically capturing a second image from a second side of the component (180), at which second side a second structural feature (186) of the component (180) is discernible, by means of a second camera (160), wherein the first side and the second side are situated opposite one another and wherein the second structural feature (186) is configured to be connected at a predetermined position on the component carrier (175), (c) orienting the electronic component (180) such that a center of the first structural feature (185) is aligned with a desired position relative to the component carrier (175), wherein the second structural feature (186) can be correspondingly offset from the predetermined position, and (d) mounting the electronic component (180) onto the component carrier (175), wherein the center of the first structural feature (185) is aligned relative to the component carrier (175), wherein the second structural feature (186) is offset from the predetermined position. Moreover, a method for checking the functionality of an optoelectronic component in advance of a population of a component carrier and an automatic placement machine for mounting an optically measured electronic component are also described.
It is described a method for changing parameters for controlling a transfer of solder paste onto a printed circuit board (150, 250). The described method comprises (a) identifying first subareas (256, 258) of the printed circuit board (150, 250), which exhibit a first repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board (150, 250), (b) identifying second subareas (252, 254) of the printed circuit board (150, 250), which exhibit a second repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board (150, 250), wherein the first repeatability is smaller than the second repeatability, (c) transferring solder paste onto the printed circuit board (150, 250) at least at the second subareas (252, 254) of the printed circuit board (150, 250), (d) measuring the amount of solder paste which has been transferred to the second subareas (252, 254), and (e) changing the parameters for controlling a transfer of solder paste onto the printed circuit board (150, 250) in response to the measured amount of solder paste which has been transferred to the second subareas (252, 254). It is further described a corresponding processing device, a system comprising such a processing device and a computer program for controlling and/or for carrying out such a method.
B05D 1/26 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par application de liquides ou d'autres matériaux fluides, à partir d'un orifice en contact ou presque en contact avec la surface
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
B23K 3/06 - Dispositifs d'alimentation en métal d'apportCuves de fusion du métal d'apport
C23C 2/00 - Procédés de trempage à chaud ou d'immersion pour appliquer le matériau de revêtement à l'état fondu sans modifier la forme de l'objet immergéAppareils à cet effet
