An LED lamp panel, which comprises a substrate that is provided with a circuit layer, and the circuit layer is provided with bonding pads for connecting with a plurality of LED chips; the circuit layer is provided with a first reflective layer, and the first reflective layer is provided with a plurality of window structures, which are disposed in an array, and at least one pair of bonding pads for connecting with the LED chips is distributed in each of the window structures; the LED lamp panel further comprises a second reflective layer filled between the first reflective layer and the LED chips, and the reflectivity of the second reflective layer is greater than that of the first reflective layer. The LED lamp panel provided by the present disclosure is beneficial for die bonding and has a high lighting effect, an improved process yield, and a low manufacturing cost.
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H10H 29/24 - Ensembles de plusieurs dispositifs comprenant au moins un composant émetteur de lumière à semi-conducteurs couvert par le groupe comprenant plusieurs dispositifs émetteurs de lumière à semi-conducteurs
2.
LED LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREFOR
The present invention is applicable to the technical field of LED packaging, and provides an LED light-emitting device and a manufacturing method therefor. The LED light-emitting device comprises a support, an LED chip and a package adhesive layer. The support comprise a substrate and an enclosing dam, wherein the substrate has a front surface and a back surface opposite each other, and the enclosing dam has a bottom surface and a top surface opposite each other; the LED chip and the bottom surface of the enclosing dam are arranged on the front surface of the substrate, the enclosing dam surrounds the LED chip to form a chip mounting area for mounting the LED chip and bearing the package adhesive layer, and the package adhesive layer performs packaging above the LED chip; and the enclosing dam and the package adhesive layer are transparent or semitransparent, and transparent or semitransparent hollow particles are arranged at the top of the package adhesive layer. By means of the LED light-emitting device and the manufacturing method therefor provided in the present invention, the product brightness is high, and the user experience is good.
H01L 33/54 - Encapsulations ayant une forme particulière
H01L 33/56 - Matériaux, p.ex. résine époxy ou silicone
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs
3.
PACKAGING STRUCTURE, LED DEVICE, AND PACKAGING METHOD
A packaging structure, an LED device, and a packaging method. The packaging structure comprises a substrate (1), a transparent cover (2), and a dam (3) connected to the substrate (1), and the dam (3), the transparent cover (2), and the substrate (1) define a mounting area (7); the dam (3) comprises an outer retaining wall (32) and an inner retaining wall (31), and a slot (33) is formed between the outer retaining wall (32) and the inner retaining wall (31); the packaging structure further comprises a sealing member (5) provided in the slot (33), and the transparent cover (2) covers the inner retaining wall (31) and the mounting area (7), and is inserted into the slot (33); and the packaging structure further comprises protective members (4) provided at the edge of the transparent cover (2), and the protective members (4) are provided with blocking parts (41) used for blocking a gap between the transparent cover (2) and the outer retaining wall (32) and abutting parts (43) which are connected to the blocking parts (41) and can abut against the upper end of the transparent cover (2). Under the shielding of the inner retaining wall (31), the outer retaining wall (32), and the blocking parts (41), the sealing member (5) can avoid UV irradiation, and the packaging structure has the superiority of semi-inorganic packaging and full-inorganic packaging, overcomes the limitation of semi-inorganic packaging and full-inorganic packaging, and has better air tightness and stability.
H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs
H01L 33/54 - Encapsulations ayant une forme particulière
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
H01L 33/60 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique Éléments réfléchissants
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
A tiling piece (20), a tiling piece assembly, a tiled display screen (7), a middle frame (10), and a lamp panel assembly (9). The tiling piece (20) is provided with positioning pins (202), which are integrally formed with the tiling piece body and match corresponding positioning pin holes (102) in the middle frame (10); and the tiling piece body is provided with splicing through holes (201), which correspond to corresponding splicing screw holes (101) in the middle frame (10).
G09F 9/00 - Dispositifs d'affichage d'information variable, dans lesquels l'information est formée sur un support, par sélection ou combinaison d'éléments individuels
The present invention is applicable to the technical field of LEDs, and provides an LED lamp panel, comprising a substrate. The substrate is provided with a circuit layer; the circuit layer is provided with pads adapted to be connected to a plurality of LED chips; the circuit layer is provided with a first reflective layer; the first reflective layer is provided with a plurality of solder mask opening structures; the solder mask opening structures are arranged in an array, and at least one pair of pads adapted to be connected to the LED chips is distributed in each solder mask opening structure; the LED lamp panel further comprises a second reflective layer arranged between the first reflective layer and the LED chips; and the reflectivity of the second reflective layer is greater than that of the first reflective layer. The LED lamp panel provided by the present invention is beneficial to die bonding, the light effect of the LED lamp panel is high, the process yield is improved, and the manufacturing cost is low.
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/48 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
brevets
