Abrégé

Disclosed in the present application are a metal foil, a circuit board, a copper-clad laminate, a negative electrode material for a battery, and a battery. The metal foil comprises a first surface and an opposing second surface, where the average grain size of a metal on the first surface is less than the average grain size of a metal on the second surface. With respect to the metal foil, circuit board, copper-clad laminate, negative electrode material for a battery, and battery of the present application, by means of sensible planning the average grain sizes of the metal foil, the metal foil has been made to possess good corrosion resistance and anti-side corrosion properties, over-etching by an etching solution causing a metal circuit to have an upside-down trapezoidal shape can be effectively prevented, the quality of the metal foil is effectively improved, and the electrical properties of a circuit board are guaranteed.

Classes IPC  ?

• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique

Abrégé

Disclosed in the present application are a metal foil, a circuit board, a copper-clad laminate, a battery negative electrode material, and a battery. The metal foil comprises a first surface and a second surface which are opposite to one another; the average grain size of the metal within an H thickness range of the metal foil is 0.1-0.8 μm, the H thickness range being the positions at 0.5-2.5 μm from the first surface in the direction of the second surface. In the metal foil, the circuit board, the copper-clad laminate, the battery negative electrode material, and the battery provided in the embodiments of the present application, a browned copper foil with an L value of 20-35 is obtained by designing the grain size of the metal foil surface; when laser drilling is performed on the copper foil, the obtained holes have smooth edges, the holes have an ideal shape, and trapezoidal or inverted trapezoidal holes do not occur, thus ensuring laser drilling quality and efficiency.

Classes IPC  ?

• H05K 1/05 - Substrat en métal isolé

Abrégé

Disclosed in the present application are a metal foil, a circuit board, a copper-clad laminate, a negative-electrode material of a battery, and a battery. The metal foil comprises a first surface and a second surface opposite each other, wherein a metal average grain size of the first surface is greater than a metal average grain size of the second surface, and the ratio X of the metal average grain size of the first surface to the metal average grain size of the second surface is 1.5-20. With regard to the metal foil, circuit board, copper-clad laminate, negative-electrode material of a battery, and battery provided in the embodiments of the present application, by means of designing the structure of the metal foil and controlling the speed at which the metal foil is etched, the situation in which the electrical performance of the metal foil is affected due to the fact that a metal circuit is trapezoidal because of incomplete etching is avoided.

Classes IPC  ?

• H05K 1/05 - Substrat en métal isolé
• H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
• H05K 3/06 - Élimination du matériau conducteur par voie chimique ou électrolytique, p. ex. par le procédé de photo-décapage
• H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
• H01L 23/488 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes formées de structures soudées
• H01M 4/66 - Emploi de matériaux spécifiés
• H01M 4/78 - Formes autres que planes ou cylindriques, p. ex. hélicoïdales

Abrégé

Disclosed in the present application are a metal foil, a circuit board, a copper-clad laminate, a battery negative electrode material, and a battery. The metal foil comprises a first surface and a second surface which are opposite to one another, a plurality of protrusions are provided on the second surface, and the ratio a of the maximum width to the maximum vertical height of the protrusions satisfies 1/5≤a≤1/2. In the metal foil, the circuit board, the copper-clad laminate, the battery negative electrode material, and the battery provided in the embodiments of the present application, defining the shape and size of the protrusions on the second surface of the metal foil effectively increases the peel force between the metal foil and a substrate and reduces the degradation rate of the circuit board, thus increasing the product yield rate of the circuit board.

Classes IPC  ?

• H05K 1/05 - Substrat en métal isolé

Abrégé

Disclosed in the present application are a metal foil, a circuit board, a copper-clad laminate, a negative electrode material for a battery, and a battery. The metal foil comprises a first surface and an opposing second surface; a plurality of protrusions are present on the second surface, the maximum vertical height of the protrusions is 0.2-3 μm, and the average grain size of metal grains in the protrusions is 0.05-1.5 μm. With respect to the metal foil, circuit board, copper-clad laminate, negative electrode material for a battery, and battery of the present application, by means of the design of the protrusions and the average grain size on the metal foil, the metal foil is made to have good corrosion resistance, side corrosion of a circuit can be mitigated, product yield is effectively improved, and the electrical performance of a circuit board is further ensured.

Classes IPC  ?

• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique

Abrégé

Disclosed in the present application are a metal foil, a circuit board, a copper-clad laminate, a negative-electrode material of a battery, and a battery. The metal foil comprises a first surface and a second surface opposite each other, wherein there are several protrusions on the second surface, and the protrusions include first-type protrusions and second-type protrusions; a ratio a of the maximum width to maximum vertical height of the first-type protrusions satisfies 1≤a≤4, and the first-type protrusions account for 50-90% of all the protrusions; and a ratio b of the maximum width to maximum vertical height of the second-type protrusions satisfies 1/5≤b≤1/3, and the second-type protrusions account for 10-70% of all the protrusions. In the metal foil, circuit board, copper-clad laminate, negative-electrode material of a battery, and battery provided in the embodiments of the present application, the proportion of spiky protrusions is reduced, the overall height of the protrusions is reduced, and the content of gently undulating protrusions is increased, thereby reducing the high-frequency transmission signal loss caused by a skin effect on the circuit board, effectively improving the quality of the metal foil, and guaranteeing the electrical performance of the circuit board.

Classes IPC  ?

• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique

Abrégé

The present application belongs to the technical field of electromagnetic shielding functional materials, and specifically relates to an electromagnetic shielding film and a circuit board. The electromagnetic shielding film comprises an insulating layer and a shielding layer, which are arranged in a stacked manner, wherein after the electromagnetic shielding film is press-fitted on a circuit board body, a dyne value of a surface on the side of the insulating layer that is away from the shielding layer is greater than or equal to 30 mN/m; and a contact angle θ of a surface on the side of the insulating layer that is away from the shielding layer is less than or equal to 130 degrees. By means of numerous studies, the inventor has found that the technical problem of screen printing on a surface of an electromagnetic shielding film being unstable is accidentally solved by means of setting a corresponding contact angle (an infiltration angle) and a dyne value, the screen printing of the shielding film meeting the conditions of the technical solution in the present application has relatively high stability, and no blur is caused to the screen printing on the surface of the shielding film which has been subjected to high-temperature press fitting; and the thickness of the screen printing is relatively uniform, and the color difference deviation is relatively small. Moreover, the screen printing is firmly bonded with a bonding layer on a surface of an insulating layer and thus does not easily fall off, thereby facilitating processing in subsequent processes of a circuit board.

Classes IPC  ?

• H05K 9/00 - Blindage d'appareils ou de composants contre les champs électriques ou magnétiques

Abrégé

A thin film resistor, a laminate, and a thin film resistor element. The thin film resistor comprises a first conductive layer and a first resistance layer covering one side surface or two side surfaces of the first conductive layer; the surface area of the side of the first conductive layer close to the first resistance layer is S1, the horizontal total area of crystal grains in the side of the first conductive layer close to the first resistance layer is S2, and the range of the numerical ratio of S1 to S2 is: 1.2≤S1/S2≤6.2. By controlling the ratio of the surface area of the side of the first conductive layer close to the first resistance layer to the horizontal total area of the crystal grains in the side of the first conductive layer close to the first resistance layer, a thin film resistor having good sheet resistance uniformity is obtained. The thin film resistor further has good adhesion to a circuit board, thereby satisfying application requirements of the circuit board. In addition, the thin film resistor involves low manufacturing costs and small production difficulty.

Classes IPC  ?

• H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants
• H01B 5/14 - Conducteurs ou corps conducteurs non isolés caractérisés par la forme comprenant des couches ou pellicules conductrices sur supports isolants
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

The present application relates to a composite substrate and a preparation method therefor, and a circuit board. The composite substrate comprises a base layer and a first resistor layer, which is arranged on at least one surface of the base layer, wherein the thickness of the first resistor layer satisfies the following relational expression: d=1.2/R+K, where d is the thickness of the first resistor layer, R is sheet resistance, and the value range of K is -0.3 to 3. In the present application, by means of controlling the resistance value R of a resistor layer and the thickness d of the resistor layer to satisfy a certain linear relational expression, a composite substrate, which satisfies the equation, has good resistance stability; moreover, the preparation of the composite substrate by using the method disclosed in the present application has a simple process flow, which simplifies a preparation process, thereby improving the production efficiency of the composite substrate.

Classes IPC  ?

• H05K 1/03 - Emploi de matériaux pour réaliser le substrat
• H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique

Abrégé

A composite foil and the use thereof. The composite foil comprises a substrate layer and a conductive layer on at least one side surface of the substrate layer; and the composite foil is provided with a pore structure, wherein the diameter-to-depth ratio of pores satisfies 1/200≤D/H≤110, D being the diameter, and H being the depth. By means of providing the composite foil with the pore structure which has a specific diameter-to-depth ratio, the weight of the foil is reduced, the energy density is improved, and the elongation percentage and stripping force of the foil are also improved; by means of the improvement in the elongation percentage, stress concentration is avoided, and thus the safety performance of a battery is improved; moreover, by means of the provision of the pore structure, the risk of a separator being pierced through by lithium dendrites is reduced, and thus the safety performance of the battery is further improved.

Classes IPC  ?

• H01M 4/80 - Plaques poreuses, p. ex. supports frittés
• H01M 4/66 - Emploi de matériaux spécifiés
• H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium

Abrégé

Provided are a thin-film resistor and a circuit board. The thin-film resistor comprises a substrate layer and a first resistor layer, wherein at least one side surface of the substrate layer has several protrusions; the first resistor layer is located on the side surface of the substrate layer that has the protrusions; the ratio of the surface area of the side surface of the substrate layer that has the protrusions to the projection area of the substrate layer is 1.3-10; and the first resistor layer is located on the side surface of the substrate layer that has the protrusions, and is configured in the same shape as the substrate layer. The above definitions improve the uniformity of the first resistor layer deposited on a surface of the substrate layer, thereby improving the sheet-resistance uniformity of the first resistor layer, facilitating the preparation of an embedded resistor having relatively high precision, and facilitating the performance of a circuit board and even an electronic element.

Classes IPC  ?

• H01C 1/012 - MontageSupport l'élément de base s'étendant le long de la résistance pour la rendre rigide ou la renforcer
• H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

A thin-film resistor and a circuit board. The thin-film resistor comprises a substrate layer and a first resistor layer, wherein the first resistor layer is stacked on at least one side surface of the substrate layer; a protrusion structure, which protrudes towards the first resistor layer, is provided on the side of the substrate layer that is close to the first resistor layer; and two bottom angles of the protrusion structure include an acute angle, and the square resistance of the first resistor layer is 1 Ω to 2000 Ω. Bottom angles of a protrusion structure are defined, so as to solve the technical problems in the prior art of the resistance value of a resistor layer being non-uniform and the resistance thereof being poor in terms of stability, and optimize the square-resistance uniformity of a thin-film resistor, such that the thin-film resistor achieves the technical effects of the resistance value being more uniform and the resistance stability being higher.

Classes IPC  ?

• H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants
• H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p. ex. une résistance, un condensateur, une inductance imprimés

Abrégé

A thin-film resistor and a circuit board. The thin-film resistor comprises: a substrate layer and a first resistor layer, wherein the first resistor layer is stacked on at least one surface of the substrate layer; a protrusion structure is provided on the side of the substrate layer that is close to the first resistor layer; and the maximum plane width X of the bottom of the protrusion structure satisfies 0.1 μm≤X≤50 μm, the maximum plan width of the bottom of the protrusion structure refers to the maximum horizontal-distance value of the bottom of the protrusion structure in a widthwise direction, and the bottom width of the protrusion structure refers to the horizontal distance between the lowest position adjacent to one side edge of the protrusion structure and the lowest position adjacent to the other side edge of the protrusion structure. The maximum plane width of the bottom of a protrusion structure is defined, such that the sheet-resistance uniformity and resistance stability of a first resistor layer are improved.

Classes IPC  ?

• H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants
• H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p. ex. une résistance, un condensateur, une inductance imprimés

Abrégé

zzz/D≤30. The present application, by means of controlling the range of the ratio of roughness of an electrically conductive layer to the maximum value of crystal grains, increases sheet resistance uniformity of the film resistor, and further increases adhesion between the film resistor and a circuit board, thereby improving the yield of the finished product.

Classes IPC  ?

• H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants
• H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p. ex. une résistance, un condensateur, une inductance imprimés

Abrégé

Provided in the present invention are a composite metal foil and a printed circuit board. The composite metal foil comprises: a conductive layer and a resistance layer which are stacked, the conductive layer comprising a body layer and a plurality of piled-up lumps, the surface of the side of the body layer close to the resistance layer being provided with a plurality of crystal grains, the piled-up lumps being located on part of the surfaces of the crystal grains, the body layer and the piled-up lumps being in contact with the resistance layer, the grain size of the crystal grains of the body layer being 0.5μm-15μm, and the surface roughness Ra of the side of the resistance layer facing away from the conductive layer being 0.1μm-5μm. The composite metal foil of the present invention can improve the resistance uniformity of the resistance layer, and can achieve stable electrical connection with circuit boards.

Classes IPC  ?

• H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants
• H01C 1/012 - MontageSupport l'élément de base s'étendant le long de la résistance pour la rendre rigide ou la renforcer
• H01C 1/16 - Réseaux de résistances non prévus ailleurs
• H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

Abrégé

The present invention provides a composite substrate and a circuit board. The composite substrate comprises a first resistor layer and a base substrate layer. The first resistor layer is stacked on at least one side surface of the base substrate layer. The side surface of the base substrate layer facing the first resistor layer is provided with a plurality of protrusions. The degree of roughness Ra of the side surface of the base substrate layer having the protrusions is 0.5 μm to 5 μm, and the quantity of the protrusions is 0.1×103/mm to 3×103/mm. The present invention defined above improves the uniformity of the first resistor layer deposited on the surface of the base substrate layer, further improving the uniformity of the sheet resistance of the first resistor layer, which facilitates the preparation of an embedded resistor having high precision and is beneficial to the performance of the circuit board and even electronic components.

Classes IPC  ?

• H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants
• H01C 1/012 - MontageSupport l'élément de base s'étendant le long de la résistance pour la rendre rigide ou la renforcer
• H01C 1/16 - Réseaux de résistances non prévus ailleurs

Abrégé

Provided in the present invention are a composite base material and a circuit board. The composite base material comprises a substrate layer and a resistance layer, wherein the surface of one side of the substrate layer close to the resistance layer is provided with a plurality of protrusions, and the roughness Rz of the surface of one side of the substrate layer close to the resistance layer is 1-15 μm. By means of the technical solutions disclosed by the present application, sheet resistance uniformity of the resistance layer of the composite base material is improved, thereby facilitating preparation of an embedded resistor with relatively high precision, and facilitating improvement of performances of the circuit board and even electronic components.

Classes IPC  ?

• H01C 7/00 - Résistances fixes constituées par une ou plusieurs couches ou revêtementsRésistances fixes constituées de matériaux conducteurs en poudre ou de matériaux semi-conducteurs en poudre avec ou sans matériaux isolants
• H01C 1/012 - MontageSupport l'élément de base s'étendant le long de la résistance pour la rendre rigide ou la renforcer

Abrégé

A film, a stacked body, a template, a laminate and a preparation method. The film is provided with first recesses (11) and second recesses (12), wherein both the first recesses and the second recesses include openings; and the openings of the second recesses are located in surfaces of the first recesses. By means of forming the first recesses in a surface of the film and forming the finer second recesses in the surfaces of the first recesses, a metal layer formed on the surface of the film having such a dual-recess structure has an excellent stripping force; and a circuit with a relatively small spacing and width can be prepared on the surface of the film, thereby ensuring the performance of a circuit board.

Classes IPC  ?

• H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
• H05K 1/03 - Emploi de matériaux pour réaliser le substrat