A dual-system cooling apparatus includes a first cooling system having a first enclosure that encloses a first cavity and a second cooling system having a second enclosure that encloses a second cavity and has a capillary structure on an inner surface of the second enclosure. The first enclosure is positioned over the second enclosure. A first working fluid of the first cooling system is different from a second working fluid of the second cooling system.
A heat transfer device includes a first thermally conductive casing configured to contact a heat source and a second casing mounted thereon to define a liquid-tight chamber. A thermally conductive protrusion extends into the chamber. First and second capillary structures are disposed on the first casing and the protrusion, respectively, and are thermally coupled. A first heat pipe extends through the second casing and is in fluid communication with the chamber. A second heat pipe extends through the second casing, is isolated from the chamber, and is spaced from the first casing.
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
F28D 1/053 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes pour une seule des sources de potentiel calorifique, les deux sources étant en contact chacune avec un côté de la paroi de la canalisation, dans lesquels l'autre source de potentiel calorifique est une grande masse de fluide, p. ex. radiateurs domestiques ou de moteur de voiture avec des canalisations d'échange de chaleur immergées dans la masse du fluide avec canalisations tubulaires les canalisations étant rectilignes
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28F 3/02 - Éléments ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des évidements, avec des ondulations
3.
THIN HEAT PIPE WITH SINTERED POWDERED WICK STRUCTURE
A thin heat pipe including a thin heat pipe container, wick structure, working fluid, and vapor flow passage section is provided. The thin heat pipe container includes a lower inner wall and upper inner wall. The wick structure is disposed on the lower inner wall and includes a first wick structure portion connected to a second wick structure portion. The vapor flow passage section is configured for vapor to flow therethrough. A thickness of the second wick structure portion is lesser than a thickness of the first wick structure portion and the second wick structure portion does not contact, contact points between the upper inner wall and lower inner wall. The wick structure defines the vapor flow passage section. The first wick structure contacts the upper inner wall and second wick structure. Working fluid is pulled from vapor condenser sections to high temperature sections via the wick structure.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
F25J 1/00 - Procédés ou appareils de liquéfaction ou de solidification des gaz ou des mélanges gazeux
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
A fan blade device includes a fan blade having a hub portion and a plurality of blade portions connected to the hub portion, each blade portion having a front surface and a back surface opposite to each other, a plurality of first airflow guiding structures disposed on the front surface and including first guiding protrusions with first microchannels formed between adjacent protrusion parts, and a plurality of second airflow guiding structures disposed on the back surface and including second guiding protrusions with second microchannels formed between adjacent protrusion parts.
A modular cooling fan assembly includes at least two fan bodies each having an outer frame having a male connector component, and at least one connecting member having two sets of female connector components, wherein the male connector component includes a probe assembly and a ball catch assembly, wherein the female connector component includes a conductive contact configured to engage with the probe assembly to establish an electrical connection, and a limiting block configured to movably connect with the ball catch assembly, and wherein the conductive contacts of the two sets of female connector components are electrically connected to each other.
A fan assembly, comprising at least two fan bodies each having an outer frame having a connection structure, and at least one connecting member having two sets of contact structures, wherein the connection structure includes a conductive probe and a locking protrusion, wherein the contact structure includes a conductive contact configured to mate with the conductive probe, and a limiting groove configured to mate with the locking protrusion, and wherein the conductive contacts of the two sets of contact structures are electrically connected to each other.
A heat dissipation module includes a fan assembly and a securing device. The fan assembly includes a fan including a fan frame and a fan blade. The fan blade is rotatably disposed in the fan frame. The fan frame includes a first assembling portion and a second assembling portion and both of them are arranged along an axial direction of the fan blade. The fan assembly further includes a fastener that movably extends through the first assembling portion and the second assembling portion. The fan assembly also includes a stopper that is mounted into the fastener and located between the first assembling portion and the second assembling portion. The fastener extends through the first assembling portion and the second assembling portion and is fastened to the securing device.
A fan device includes a fan frame including a base and a frame body, a fan blade rotatably disposed on the base, and at least one first mating structure and at least one second mating structure respectively disposed on the base and the frame body. The first mating structure is configured to attract the second mating structure so that the frame body is detachably secured to the base. The base includes a shell portion and at least one first assembly portion connected to the shell portion and extending toward the frame body. The frame body includes a frame portion and at least one second assembly portion connected to the frame portion and extending toward the base. The first mating structure has a mating recess, and the second mating structure includes a first protrusion portion, a second protrusion portion, and a disc portion disposed between the first and second protrusion portions.
A heat dissipation device includes a liquid-cooling radiator assembly, a fan mounting structure disposed on the liquid-cooling radiator assembly, a plurality of recesses formed on an outer side of the mounting structure, and a plurality of contact terminals mounted in the recesses, respectively. The heat dissipation device further includes a power connector disposed on one side of the mounting structure and electrically connected to the contact terminals, and at least two fans arranged side-by-side and mounted to the fan mounting structure, each fan having a plurality of spring pins. When the fans are secured to the fan mounting structure, each of the spring pins is in electrical contact with a corresponding contact terminal to form a power supply path among the power connector, the contact terminals, and the spring pins.
A three-dimensional heat transfer device includes a first thermally conductive casing, a second thermally conductive casing. The second thermally conductive casing is attached to the first thermally conductive casing to form a liquid-tight chamber. The heat transfer device further includes thermally conductive protrusions, first capillary structures that are disposed on the first thermally conductive casing, second capillary structures that are disposed on the thermally conductive protrusions and are thermally coupled with the first capillary structure, and first heat pipes that are extended through the first through holes and are in contact with the second capillary structures. In at least one the first pipes, a fourth capillary structures are disposed on an inner wall of the first heat pipe and is in contact with the second capillary.
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
A fan module for cooling electronic devices comprises a first fan and a second fan detachably coupled together. The first fan includes a first housing having latching slots, a first engagement member defining a first engagement slot with a first opening oriented toward a corresponding latching slot, and a first fan blade disposed within the first housing. The second fan includes a second housing, a second engagement member detachably fitted in the first engagement slot of the first engagement member, and a second fan blade disposed within the second housing. A latching member is disposed in the corresponding latching slots and configured to prevent the second engagement member from disengaging from the first engagement member. When assembled, the rotational axes of the fan blades are aligned to direct airflow from the first fan into the airflow path of the second fan, providing enhanced cooling performance.
A fan assembly includes a fan blade assembly and a fan frame, and the fan blade assembly includes a fan blade frame having an inner surface and a outer surface, a middle tube with a first magnet block mounted at a bottom portion thereof, a bearing disposed within the middle tube, a shaft disposed within the bearing, one end of the shaft is disposed on the inner surface of the fan blade frame, fan blades disposed on outer surface of the fan blade frame, and a magnetic assembly disposed within the fan blade assembly, and a fan frame includes a support frame with a support tube extending therefrom, the middle tube is configured to insert into the support tube, a second magnet block disposed within the support tube, a motor assembly mounted to an exterior of the support tube, the motor assembly including a PCB board mounted to a bottom portion thereof, wherein the first magnet block and the second magnet block are configured to magnetically attract one another when the middle tube is placed into the support tube.
A vapor chamber includes a first cover, a second cover and a partition. The second cover and the first cover are bonded together to form a heat dissipation space. The second cover has at least two through holes. The at least two through holes correspond to the heat dissipation space. The at least two through holes are configured for at least two pipes to be inserted therein. The partition is located in the heat dissipation space, and protrudes from the first cover. The partition divides the heat dissipation space into an air tight subspace and an open subspace which are not in fluid communication with each other. The partition surrounds the open subspace. The open subspace is in fluid communication with the at least two through holes.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
14.
HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREFOR
A heat dissipation device includes a thermally-conductive base that defines a heat absorbing surface and a heat dissipation surface opposite to the heat absorbing surface. The thermally-conductive base includes a plurality of accommodation holes extending between the heat absorbing surface and the heat dissipation surface. The heat dissipation device further includes a plurality of heat pipes each being disposed within a respective accommodation hole. Each of the heat pipes includes a first surface and a second surface that faces away from the first surface. The first surface and the heat dissipation surface being directly connected to each other and are substantially coplanar. The heat absorbing surface includes a thermal contact region configured for direct thermal engagement with the heat source and a peripheral region extending beyond the thermal contact region. The heat pipes distributed between the thermal contact region and the peripheral region in unequal numbers.
A heat dissipation device includes a plate body configured to be thermally coupled to a heat-generating element, a plate cover mounted to the plate body, the plate body and the plate cover together defining a vapor chamber, at least one internal wick structure disposed within the vapor chamber, a plurality of support columns disposed within the vapor chamber, and a plurality of heat pipes, each heat pipe extending through a corresponding through hole formed in the plate cover. The heat pipe is bonded to the plate cover by soldering a welding ring at an interface between the heat pipe and the corresponding through hole, the welding ring comprising a silver-copper alloy containing about 66% to about 76% silver and about 24% to about 34% copper.
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
A fin structure includes an inlet fin assembly and an outlet fin assembly. The inlet fin assembly includes a plurality of inlet fins arranged side by side, and a first air channel is formed between two of the plurality of inlet fins that are adjacent to each other. The outlet fin assembly includes a plurality of outlet fins arranged side by side, and a second air channel is formed between two of the plurality of outlet fins that are adjacent to each other. The inlet fin assembly is connected to the outlet fin assembly, and the plurality of first air channels are in fluid communication with the plurality of second air channels. A thermal conductivity of the inlet fin assembly is greater than a thermal conductivity of the outlet fin assembly.
F28F 3/04 - Éléments ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des évidements, avec des ondulations les moyens faisant partie intégrante de l'élément
F28F 21/08 - Structure des appareils échangeurs de chaleur caractérisée par l'emploi de matériaux spécifiés de métal
A light emitting fan may include a fan frame, a fan assembly, a first and a second light guide ring, a light emitting assembly, and a plurality of fixing assemblies. The fan frame includes a bottom plate, an inner annular side plate, an outer fan frame, and a plurality of anti-vibration mounts. The fan assembly is rotatably disposed on the bottom plate. The inner annular side plate, the first and the second light guide rings, and the light emitting assembly are disposed between the bottom plate and the outer fan frame. Each plurality of fixing assemblies includes a locking assembly, disposed on the first light guide ring, and a receiving assembly, disposed on the second light guide ring or the fan frame, and is configured to enable the first light guide ring to lock to the second light guide ring or the fan frame, via a pushing force.
A light emitting fan including a first light guide, light source component, chassis, second light guide, plurality of blades rotatably mounted to the chassis, cover, and at least one fastening assemblage is provided. The first light guide has a plurality of different first light emitting surfaces. The second light guide has a plurality of different second light emitting surfaces. The at least one fastening assemblage comprises a first cavity structure, a second cavity structure, and a pair of arms. The first cavity structure is integrated with the cover, the second cavity structure is integrated with the chassis, and the pair of arms is integrated with the first light guide. The at least one fastening assemblage removably interlocks the cover and light source component with the first light guide and removably interlocks the chassis and second light guide with the first light guide.
A three-dimensional heat conducting structure includes a vapor chamber that has a casing with at least one through hole and is in fluid communication with an interior of the casing. At least one heat pipe having an open end that is inserted into the through hole and is in fluid communication with the interior of the casing. Further, a rim that is disposed on an outer surface of the vapor chamber, wherein gaps between the rim and the heat pipe are sealed by laser welding, and a welding ring is soldered to further secure the connection between the heat pipe and the vapor chamber.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
A method for manufacturing a liquid dispenser includes machining a flow tube to form a manifold that includes a plurality of liquid dispensing holes and a plurality of fixing parts, performing precision processing on the liquid dispensing holes and the fixing parts to adjust dimensions thereof, performing a first cleaning process on the manifold, clamping the manifold in a jig at a clamping position of the manifold, welding a liquid inlet adapter and a liquid outlet adapter at opposite ends of the manifold, respectively, and performing a second cleaning process on the liquid dispenser, wherein the second cleaning process is simpler than the first cleaning process.
A fan assembly includes two fan apparatuses and at least one connector. Each of the two fan apparatuses includes a frame, a fan blade and at least one first terminal. The frame has at least one first engagement recess. The fan blade is rotatably disposed on the frame. The at least one first terminal is located in the at least one first engagement recess. The at least one connector includes a first assembly block and two second terminals. The first assembly block includes two first engaging portions connected to each other. The two second terminals are respectively mounted on the two first engaging portions. The two first engaging portions of the first assembly block are respectively engaged with the at least two first engagement recesses of the two frames, and the two second terminals are respectively plugged and electrically connected to the at least two first terminals.
A heat dissipating device has a thermal board, at least one cooling fin, and a working fluid. The thermal board has at least one chamber and a passive one-way valve section. Each of the at least one chamber has a first inlet and at least one first outlet. Each of the at least one cooling fin has an inner space, at least one second inlet, and a second outlet. The second inlet is connected to the first outlet. The second outlet is connected to the first inlet. The working fluid is filled in the chamber and the inner space. The passive one-way valve section is configured to limit the working fluid to cycle in the chamber and the inner space along a single direction. The heat dissipating device facilitates the cycling capability of two phases flow coolant and provides a heat dissipating capability.
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
H01L 23/427 - Refroidissement par changement d'état, p. ex. caloducs
23.
HEAT DISSIPATION DEVICE AND A HEAT-CONDUCTING PLATE THEREOF
A heat dissipation device includes a heat-conducting plate having a plate body and a cover mounted to the plate body. The plate body and the cover together define a vapor chamber. At least one partition rib is provided in the plate body to divide the vapor chamber into at least two first partition chambers. A first end of the partition rib is connected to a sidewall of the vapor chamber, and a second end of the partition rib extends into the vapor chamber and is spaced apart from an opposite sidewall of the vapor chamber by a gap. A second partition chamber is formed between the second end of the partition rib and the opposite sidewall and is in fluid communication with the at least two first partition chambers, and the partition rib tapers from the first end towards the second end.
A thermal test vehicle including a base plate, first cold plate, heat resistor, second cold plate, plurality of insulation layers, and one or more sensors is provided. The first cold plate is positioned within the base plate and the heat resistor is positioned over the first cold plate and the second cold plate is positioned over the heat resistor. The plurality of insulation layers includes a second insulator plate. The second insulator plate is positioned between the heat resistor and the second cold plate. The second insulator plate transfers at least an other portion of heat flux from the heat resistor to the second cold plate. At least a portion of heat flux from the heat resistor is transferred from a heat source to the first cold plate. The one or more sensors is positioned within at least one of the second cold plate and first cold plate.
H05B 3/26 - Éléments chauffants ayant une surface s'étendant essentiellement dans deux dimensions, p. ex. plaques chauffantes non flexibles le conducteur chauffant monté sur une base isolante
A plurality of fans for use in a fan module that is configured to allow tool-free assembly and disassembly, at least one of the fans includes either a first connector and a second connector, two first connectors, or two second connectors, where the first connector and the second connector are complementary. The first connector includes a plurality of conductive pins, and the second connector includes a plurality of contact foils. The first connector of the fan is coupled to the second connector of an adjacent fan to establish both electrical and mechanical connections between the adjacent fans. An external power connector includes either the first connector or the second connector. The external power connector is coupled to a complementary connector of an outermost fan body to supply power to the fan module.
A heat dissipation device includes a plurality of cooling fans and at least one fastening device that includes a main body, a fastening kit having two arms each includes two first connecting parts, a second connecting part, and a pressing structure, a first end of the two first connecting parts connect to opposite ends of the second connecting part and a second end of the two first connecting parts connect to an outer surface of the main body, the pressing structure disposes on the second connecting part and protrudes out of the outer surface of the main body, and each arm includes two snap-fit joints, and a contact plate disposed on an inner surface of the main body, the contact plate includes plurality of contact pins that are disposed on opposite ends of the contact plate, wherein, the snap-fit joints are configured to snap fit to the cooling fans so that the contact pins are electrically connected to the cooling fans.
A heat dissipation device includes a plurality of cooling fans and at least one fastening device. Each cooling fan includes at least one contact region having a plurality of conductive pins and at least one first magnet. Each fastening device includes a housing having at least one cavity formed within, a contact plate disposed within the cavity, the contact plate includes a plurality of conductive contacts that are disposed on a side of the contact plate, and at least one second magnet disposed within the cavity, wherein the fastening device is configured to connect the cooling fans via the first magnet and the second magnet.
A light emitting multi fan device may include a mount rack, fan frame, light guide plate, plurality of fans, and plurality of fixing assemblies. The plurality of fans is rotatably coupled to a rack frame of the mount rack. The fan frame is coupled to the mount rack and respectively surrounds each plurality of fans. The light guide plate is coupled to the fan frame and the rack frame. Each plurality of fixing assemblies includes a locking element and a receiving through hole. The locking element protrudes from the fan frame and the receiving through hole extends through the rack frame. The plurality of fixing assemblies is configured to enable the fan frame to lock the light guide plate between the fan frame and the rack frame via a pushing force.
A manufacturing method of three dimensional heat dissipation device includes a step of manufacturing a thermally conductive casing, a step of manufacturing a preliminary three dimensional heat dissipation device and a step of manufacturing a final three dimensional heat dissipation device. The step of manufacturing a thermally conductive casing is to manufacture the thermally conductive casing with an airtight chamber. The step of manufacturing a preliminary three dimensional heat dissipation device is to install at least one round heat pipe on the thermally conductive casing to form the preliminary three dimensional heat dissipation device. The step of manufacturing a final three dimensional heat dissipation device is to fix the preliminary three dimensional heat dissipation device and shape the round heat pipe to a flat heat pipe via a shaping tool so as to form the final three dimensional heat dissipation device.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
F28F 9/26 - Dispositions pour raccorder des sections différentes des éléments d'échangeurs de chaleur, p. ex. de radiateur
This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
A communication-type thermal conduction device includes a vapor chamber with a heat conduction chamber and at least one first capillary structure. A bridging recess portion is formed on a side of the heat conduction chamber, and the first capillary structure is stacked within the heat conduction chamber and extends to the bridging recess portion. The communication-type thermal conduction device further includes a heat pipe with a heat pipe body and at least one capillary structure. The heat pipe body is stacked on the first capillary structure of the heat conduction chamber at the bridging recess portion, and the second capillary structure is stacked within the heat pipe body and is connected to the first capillary structure.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
A heat dissipation device includes a vapor chamber, a heatsink, and a heat dissipation plate. The vapor chamber includes a first plate, a second plate that is connected to the first plate to form a chamber between the first and second plates, and a plurality of first support structures disposed within the chamber, opposite ends of each of the first support structures are connected to the first plate and the second plate respectively, the first support structures are disposed with at least two rows and at least two columns, wherein any two adjacent rows of the first support structures are staggered. The heat dissipation plate is disposed in between the heatsink and the vapor chamber so that the heatsink and the vapor chamber are connected to each other via the heat dissipation plate.
A heat pipe includes a pipe body having an evaporation section, a condensation section, and a transmission section, the evaporation section and the condensation section are respectively connected to opposite ends of the transmission section, and a composite capillary structure including a first capillary structure and at least one second capillary structure, the first capillary structure having a grooved shape and being disposed on an inner surface of the pipe body, the second capillary structure being at least partially disposed on the first capillary structure, the first capillary structure and the at least one second capillary structure extending from the evaporation section to the condensation section, wherein the composite capillary structure has a variable thickness within the evaporation section.
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
A high heat cooling device includes a heat-conducting chamber body that has a heat-absorbing surface, a first chamber, and a second chamber. The first chamber is closer to the heat-absorbing surface than the second chamber. At least one isolation ring is disposed in the first chamber of the heat-conducting chamber body, dividing the first chamber into a primary hot zone and a secondary hot zone. The primary hot zone is not in fluid communication with the secondary hot zone, and the primary hot zone is surrounded by the isolation ring and is in communication with the second chamber.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
F28D 21/00 - Appareils échangeurs de chaleur non couverts par l'un des groupes
A vapor chamber may include a first plate, evaporator wick structure, second plate, condenser wick structure, and plurality of heat pipes. The first plate includes a first inner surface, a first outer surface, and plurality of chamber walls extending from the first inner surface and having second and third chamber walls. The evaporator wick structure is disposed on the first inner surface. The condenser wick structure is disposed on a second inner surface of the second plate. The second plate is coupled to the plurality of chamber walls and plurality of heat pipes. At least one set of the heat pips is disposed through one chamber wall and another set of the heat pipes is disposed through the opposite chamber wall. Each of the heat pipes includes an inner chamber surface and pipe wick structure. The pipe wick structure is disposed on the inner chamber surface and coupled to the evaporator wick structure.
A vapor chamber includes a first plate having a condensing surface, a second plate configured to assemble with the first plate to form a chamber, the condensing surface is facing the second plate, the second plate having a heat absorbing surface facing away from the condensing surface, and the heat absorbing surface is configured to thermally coupled to a heat source, and a condensing assembly being disposed on the condensing surface so that outer surfaces of the condensing assembly and the condensing surface are integrated to form a thermal exchange surface, the thermal exchange surface is configured to condense a vaporized cooling fluid into liquid.
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
A fan device includes a frame, a stability maintenance assembly, a shaft, an impeller, and a driving assembly. The frame includes a base and a bearing seat protruding from the base and having an accommodation space. The stability maintenance assembly is disposed in the accommodation space and includes a bearing and a magnet arranged coaxially. The bearing is located above the magnet and magnetized by the magnet. The shaft is disposed through the magnet and the bearing. The impeller is fixed to the shaft so as to be rotatable relative to the frame via the shaft and the bearing. The driving assembly includes a stator and a rotor. The stator is sleeved on the bearing seat of the frame, the rotor is mounted on the impeller and surrounds the stator, and the driving assembly is configured to drive the impeller to rotate relative to the frame.
F04D 29/66 - Lutte contre la cavitation, les tourbillons, le bruit, les vibrations ou phénomènes analoguesÉquilibrage
H02K 5/16 - Moyens de support des paliers, p. ex. supports isolants ou moyens pour ajuster les paliers dans leurs flasques
H02K 7/08 - Association structurelle avec des paliers
H02K 21/22 - Moteurs synchrones à aimants permanentsGénératrices synchrones à aimants permanents avec des induits fixes et des aimants tournants avec des aimants tournant autour des induits, p. ex. volants magnétiques
A three-dimensional (3D) heat transfer device that includes a thermal conductive shell body having a liquid-tight chamber, at least one first pipe having a first end connected to the thermal conductive shell body and in communicate with the liquid-tight chamber, and at least one second pipe having at least two portions that are connected to the thermal conductive shell and in communicate with the liquid-tight chamber.
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
A multi fan device may include a plurality of fans. Each plurality of fans includes a fan base, fan, connector assembly, fastener assembly, and fan frame. The fan is rotatably coupled to the fan base. The fan frame is coupled to the fan base with the connector assembly and fastener assembly therebetween. The fan frame and the fan base, define a receiving side and a connection side. The receiving side includes a first connector end and first fastener end, and the connection side includes a second connector end and second fastener end. The connector assembly is configured to enable each plurality of fans to electrically couple together at the first connector end and the second connector end via a pushing force. The fastener assembly is configured to enable each plurality of fans to join together at the first fastener end and the second fastener end via an electromagnetic force.
A flat blower fan device may include a volute and impeller. The impeller is rotatably disposed in the volute. The volute includes a center opening, an impeller chamber, discharge outlet, and lip protrusion. The discharge outlet is disposed at a side of the volute, and the lip protrusion is disposed at a perimeter edge of the center opening. The lip protrusion is configured to enable a beveled zone to be formed at a protrusion side of the lip protrusion during rotation of the impeller. The beveled zone is configured to enable a constricted chamber zone to be formed within the impeller chamber. The constricted chamber zone is formed at a chamber side of the beveled zone. An air pressure in the constricted chamber zone is lower and an airflow is faster than the air pressure and the airflow in the impeller chamber before the airflow enters the constricted chamber zone.
A multi fan device may include a plurality of fans. Each plurality of fans includes a fan base, fan frame, and connector component. The fan base includes a connector. The fan frame is coupled to the fan base and define a top side, receiving side, and connector side. The receiving side extends from a first side edge of the top side, the connector side extends from a second side edge of the top side. The connector is disposed between the fan frame and fan base at the first side edge and the connector component is rotatably coupled between the fan frame and fan base at the second side edge. The connector is electrically coupled to the connector component, and the connector component is configured to enable each plurality of fans to electrically couple together at the second side edge and the first side edge via an electromagnetic force.
The present disclosure is directed to a heat pipe assembly having a first heat pipe and at least one second heat pipe. The first heat pipe includes an inner wall surface, an outer wall surface, and at least one opening. The inner wall surface surrounds a first cavity, and the outer wall surface faces away from the inner wall surface. The at least one opening penetrates the inner wall surface and the outer wall surface. The at least one second heat pipe includes a second cavity and a connecting port. The connecting port connects the second cavity to the first cavity through the at least one opening.
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
A heat pipe including a pipe body, a first capillary structure and a second capillary structure. The pipe body has an evaporation portion and a condensation portion. The condensation portion is connected to the evaporation portion. The first capillary structure is disposed in the evaporation portion. The second capillary structure is disposed in the condensation portion and is connected to an end of the condensation portion that is located away from the evaporation portion. The second capillary structure is not in direct contact with the first capillary structure.
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
A heat pipe including a pipe body, a first capillary structure and a second capillary structure. The pipe body has an evaporation portion and a condensation portion. The condensation portion is connected to the evaporation portion. The first capillary structure is disposed in the evaporation portion. The second capillary structure is disposed in the condensation portion and is connected to an end of the condensation portion that is located away from the evaporation portion. The second capillary structure is not in direct contact with the first capillary structure.
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
A multi fan assembly may include a multi fan mount rack and a plurality of fan modules. The multi fan mount rack includes a housing and a mount bracket fixedly disposed to the housing. The mount bracket and housing define a mount space therewithin. Each plurality of fan modules includes a fan frame and a fan assembly rotatably disposed within the fan frame. The fan frame comprises at least two interlocking members, each, respectively disposed protruding from a top plane of the fan frame. The at least two interlocking members is configured to lock each plurality of fan modules to the multi fan mount rack within the mount space, wherein each plurality of fan modules is locked to the multi fan mount rack via a pushing force.
A light emitting fan may include a fan frame, a fan assembly, a first and a second light guide ring, a light emitting assembly, and a plurality of fixing assemblies. The fan frame includes a bottom plate, an inner annular side plate, an outer fan frame, and a plurality of anti-vibration mounts. The fan assembly is rotatably disposed on the bottom plate. The inner annular side plate, the first and the second light guide rings, and the light emitting assembly are disposed between the bottom plate and the outer fan frame. Each plurality of fixing assemblies includes a locking assembly, disposed on the first light guide ring, and a receiving assembly, disposed on the second light guide ring or the fan frame, and is configured to enable the first light guide ring to lock to the second light guide ring or the fan frame, via a pushing force.
This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
A light emitting fan including a first light guide, light source component, chassis, second light guide, plurality of blades rotatably mounted to the chassis, cover, and at least one fastening assemblage is provided. The first light guide has a plurality of different first light emitting surfaces. The second light guide has a plurality of different second light emitting surfaces. The at least one fastening assemblage comprises a first cavity structure, a second cavity structure, and a pair of arms. The first cavity structure is integrated with the cover, the second cavity structure is integrated with the chassis, and the pair of arms is integrated with the first light guide. The at least one fastening assemblage removably interlocks the cover and light source component with the first light guide and removably interlocks the chassis and second light guide with the first light guide.
A vapor chamber includes a first cover, a second cover and a partition. The second cover and the first cover are bonded together to form a heat dissipation space. The second cover has at least two through holes. The at least two through holes correspond to the heat dissipation space. The at least two through holes are configured for at least two pipes to be inserted therein. The partition is located in the heat dissipation space, and protrudes from the first cover. The partition divides the heat dissipation space into an air tight subspace and an open subspace which are not in fluid communication with each other. The partition surrounds the open subspace. The open subspace is in fluid communication with the at least two through holes.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
A heat pipe has a tube and an evaporator wick. The tube has multiple groove structures, an evaporator section, and a condenser section. The groove structures are disposed on an inner surface of the tube and extend to two opposite ends of the tube to reduce flow resistance of liquid phase working fluid. The evaporator wick is disposed in the evaporator section. The evaporator wick is made of metal powder and sintered to adhere to the groove structures. The evaporator wick is uniform in thickness and uniformly adheres to the groove structures. The evaporator wick vaporizes the working fluid in the evaporator section. As a result, the heat pipe has good manufacturing process repeatability and is reliable, easy to manufacture, and low-cost.
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
A heat pipe including an outer pipe, a composite capillary structure and an inner pipe. The outer pipe includes a vaporization section, a condensation section and a transmission section. The vaporization section and the condensation section are connected to two opposite sides of the transmission section. The outer pipe has an accommodating chamber. The accommodating chamber extends from the vaporization section to the condensation section. The composite capillary structure is located in the accommodating chamber of the outer pipe. The inner pipe is located in the accommodating chamber in the transmission section. The inner pipe divides the accommodating chamber in the transmission section into an inner channel and an outer channel. The inner channel and the outer channel are in fluid communication with the accommodating chamber in the vaporization section and the condensation section. The composite capillary structure is partially located in the outer channel.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
A fin structure includes an inlet fin assembly and an outlet fin assembly. The inlet fin assembly includes a plurality of inlet fins arranged side by side, and a first air channel is formed between two of the plurality of inlet fins that are adjacent to each other. The outlet fin assembly includes a plurality of outlet fins arranged side by side, and a second air channel is formed between two of the plurality of outlet fins that are adjacent to each other. The inlet fin assembly is connected to the outlet fin assembly, and the plurality of first air channels are in fluid communication with the plurality of second air channels. A thermal conductivity of the inlet fin assembly is greater than a thermal conductivity of the outlet fin assembly.
F28F 7/00 - Éléments non couverts par les groupes , ou
F28F 3/04 - Éléments ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des évidements, avec des ondulations les moyens faisant partie intégrante de l'élément
F28F 21/08 - Structure des appareils échangeurs de chaleur caractérisée par l'emploi de matériaux spécifiés de métal
A fan assembly includes two fan apparatuses and at least one connector. Each of the two fan apparatuses includes a frame, a fan blade and at least one first terminal. The frame has at least one first engagement recess. The fan blade is rotatably disposed on the frame. The at least one first terminal is located in the at least one first engagement recess. The at least one connector includes a first assembly block and two second terminals. The first assembly block includes two first engaging portions connected to each other. The two second terminals are respectively mounted on the two first engaging portions. The two first engaging portions of the first assembly block are respectively engaged with the at least two first engagement recesses of the two frames, and the two second terminals are respectively plugged and electrically connected to the at least two first terminals.
A thin heat pipe including a thin heat pipe container, wick structure, working fluid, and vapor flow passage section is provided. The thin heat pipe container includes a lower inner wall and upper inner wall. The wick structure is disposed on the lower inner wall and includes a first wick structure portion connected to a second wick structure portion. The vapor flow passage section is configured for vapor to flow therethrough. A thickness of the second wick structure portion is lesser than a thickness of the first wick structure portion and the second wick structure portion does not contact, contact points between the upper inner wall and lower inner wall. The wick structure defines the vapor flow passage section. The first wick structure contacts the upper inner wall and second wick structure. Working fluid is pulled from vapor condenser sections to high temperature sections via the wick structure.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
F25J 1/00 - Procédés ou appareils de liquéfaction ou de solidification des gaz ou des mélanges gazeux
H01L 23/427 - Refroidissement par changement d'état, p. ex. caloducs
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
55.
Heat dissipation device and manufacturing method therefor
A heat dissipation device includes a thermally-conductive base and at least one heat pipe. The thermally-conductive base has a heat absorbing surface, a heat dissipation surface and at least one accommodation hole. The heat dissipation surface faces away from the heat absorbing surface, and the at least one accommodation hole extends from the heat absorbing surface to the heat dissipation surface. The at least one heat pipe is located in the at least one accommodation hole and has a first surface and a second surface which are exposed to outside. The second surface faces away from the first surface, and the first surface and the heat dissipation surface are substantially coplanar and directly connected to each other so as to form a same plane together.
A heat dissipating device has a thermal board, at least one cooling fin, and a working fluid. The thermal board has at least one chamber and a passive one-way valve section. Each of the at least one chamber has a first inlet and at least one first outlet. Each of the at least one cooling fin has an inner space, at least one second inlet, and a second outlet. The second inlet is connected to the first outlet. The second outlet is connected to the first inlet. The working fluid is filled in the chamber and the inner space. The passive one-way valve section is configured to limit the working fluid to cycle in the chamber and the inner space along a single direction. The heat dissipating device facilitates the cycling capability of two phases flow coolant and provides a heat dissipating capability.
H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
H01L 23/427 - Refroidissement par changement d'état, p. ex. caloducs
A vapor chamber includes a first cover and a second cover. The first cover has a thermal contact surface. The thermal contact surface is configured to be thermally coupled to a heat source. The second cover and the first cover are joined together to form an air tight space. The air tight space is configured to accommodate a cooling fluid. The thermal contact surface faces away from the air tight space. The second cover has a first surface, a second surface and at least one first support protrusion structure. The first surface faces away from the first cover. The second surface faces the first cover. The at least one first support protrusion structure protrudes from the second surface of the second cover and is in physical contact with the first cover.
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
58.
HEAT DISSIPATING APPARATUS AND MANUFACTURING METHOD THEREOF
A heat dissipating apparatus includes a carrier layer, a basal capillary layer and a capillary post. The carrier layer has a heat exchange surface and a carrier surface. The carrier surface faces away from the heat exchange surface. The basal capillary layer has a first surface and a second surface opposite to each other. The basal capillary layer is stacked on the carrier layer so that the first surface of the basal capillary layer contacts the carrier surface of the carrier layer. The capillary post protrudes from the second surface of the basal capillary layer.
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
A three-dimensional heat exchanger includes a thermally conductive casing, a thermally conductive structure, a first heat pipe and a second heat pipe. The thermally conductive casing includes a bottom plate and a thermally conductive protrusion structure. The bottom plate has a first inner surface. The thermally conductive protrusion structure has a second inner surface. The thermally conductive structure is disposed on the thermally conductive protrusion structure, and has a top surface. The first heat pipe contacts the first inner surface. The second heat pipe contacts the second inner surface. An end of the first heat pipe and an end of the second heat pipe have a bottom surface, respectively. A distance between the two bottom surfaces and the second inner surface is larger than a distance between the top surface and the second inner surface.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
A three-dimensional heat transfer device includes a first thermally conductive casing, a second thermally conductive casing, a first capillary structure, a second capillary structure and a heat pipe. The second thermally conductive casing has a through hole. The second thermally conductive casing is mounted on the first thermally conductive casing so as to form a liquid-tight chamber. The first capillary structure is disposed on the first thermally conductive casing. The second capillary structure is disposed on the first thermally conductive casing. Projections of the first capillary structure and the second capillary structure on the outer surface and an extension surface of the outer surface are located in an extent of the outer surface, and the second capillary structure is located closer to the second thermally conductive casing than the second capillary structure. The heat pipe is disposed through the through hole and in contact with the second capillary structure.
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
F28D 1/053 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes pour une seule des sources de potentiel calorifique, les deux sources étant en contact chacune avec un côté de la paroi de la canalisation, dans lesquels l'autre source de potentiel calorifique est une grande masse de fluide, p. ex. radiateurs domestiques ou de moteur de voiture avec des canalisations d'échange de chaleur immergées dans la masse du fluide avec canalisations tubulaires les canalisations étant rectilignes
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28F 3/02 - Éléments ou leurs ensembles avec moyens pour augmenter la surface de transfert de chaleur, p. ex. avec des ailettes, avec des évidements, avec des ondulations
A three-dimensional heat transfer device includes a vapor chamber and a plurality of flatten heat pipes. The flatten heat pipes are disposed on the vapor chamber and arranged along an extension direction of a short side of the vapor chamber. Major axes of cross-sections of the flatten heat pipes are parallel to a long side of the vapor chamber.
F28D 15/02 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs
F28D 9/00 - Appareils échangeurs de chaleur comportant des ensembles de canalisations fixes en forme de plaques ou de laminés pour les deux sources de potentiel calorifique, ces sources étant en contact chacune avec un côté de la paroi d'une canalisation
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
F28D 21/00 - Appareils échangeurs de chaleur non couverts par l'un des groupes
A heat pipe including a pipe body, a first capillary structure and a second capillary structure. The pipe body has an evaporation portion and a condensation portion. The condensation portion is connected to the evaporation portion. The first capillary structure is disposed in the evaporation portion. The second capillary structure is disposed in the condensation portion and is connected to an end of the condensation portion that is located away from the evaporation portion. The second capillary structure is not in direct contact with the first capillary structure.
F28D 15/04 - Appareils échangeurs de chaleur dans lesquels l'agent intermédiaire de transfert de chaleur en tubes fermés passe dans ou à travers les parois des canalisations dans lesquels l'agent se condense et s'évapore, p. ex. tubes caloporteurs avec des tubes ayant une structure capillaire
brevets