This method for manufacturing a polishing member includes: a first application step of applying powder resin to a base material; a second application step of applying polishing particles toward the powder resin on the base material; a third application step of applying the powder resin again toward the polishing particles on the base material; and a heating step of heating the base material so that the powder resin is melted and the polishing particles are fixed to the base material.
B24D 3/00 - Propriétés physiques des corps ou feuilles abrasives, p. ex. surfaces abrasives de nature particulièreCorps ou feuilles abrasives caractérisés par leurs constituants
B05D 5/00 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces pour obtenir des effets, finis ou des structures de surface particuliers
B05D 7/24 - Procédés, autres que le flocage, spécialement adaptés pour appliquer des liquides ou d'autres matériaux fluides, à des surfaces particulières, ou pour appliquer des liquides ou d'autres matériaux fluides particuliers pour appliquer des liquides ou d'autres matériaux fluides particuliers
B24D 11/00 - Caractéristiques de construction des matériaux abrasifs flexiblesCaractéristiques particulières de la fabrication de ces matériaux
National University Corporation Tokai National Higher Education and Research System (Japon)
MIPOX CORPORATION (Japon)
Inventeur(s)
Harada, Shunta
Matsubara, Yasutaka
Murayama, Kenta
Mizutani, Seiya
Mizutani, Seij
Mizutani, Yuya
Abrégé
A polarization microscope 1 includes a sample stage 4 on which a sample 8 is placed, a polarizer 3 provided on a side of the sample 8 toward a light source, and an analyzer 6 provided on a side of the sample toward an observer. At least one of the polarizer 3 and the analyzer 6 is placed such that a polarization direction is inclined with respect to an optical main axis of the sample 8 or placed such that an angle formed by a polarization direction of the analyzer 6 and a polarization direction of the polarizer is deviated from a right angle.
WAFER SUBSTRATE COMPRISING IMPROVED ADHESION REGION, WAFER SUBSTRATE EQUIPPED WITH PROTECTIVE FILM LAYER, AND PRODUCTION METHOD FOR WAFER SUBSTRATE COMPRISING IMPROVED ADHESION REGION
The purpose of the present invention is to provide a wafer equipped with a protective film layer, where the intrusion of a solution is prevented and adhesion of the protective film layer to a wafer substrate that has been subjected to various surface treatments is improved. In order to achieve said purpose, the present invention employs a wafer substrate 1a that is used by providing a protective film layer for impeding the permeation of a solution into the surface thereof and that comprises an improved adhesion region 3, the wafer substrate being characterized by comprising the improved adhesion region 3, which is of the protective film layer and which enhances the adhesion of the protective film layer along the outer periphery of the wafer substrate that has been subjected to various surface treatments.
Provided is a probe cleaning sheet capable of exhibiting sufficient cleaning performance with respect to a probe, under a high-temperature inspection temperature range. The probe cleaning sheet includes a cleaning layer for removing foreign matter adhered to the tip end portion of a probe. The probe cleaning sheet also includes: a foamed resin layer of a polyimide resin having resistance to temperatures exceeding 200 degrees; and a polishing layer that is formed on the foamed resin layer and that comprises polishing particles and an epoxy resin.
NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM (Japon)
MIPOX CORPORATION (Japon)
Inventeur(s)
Harada Shunta
Matsubara Yasutaka
Murayama Kenta
Mizutani Seiya
Mizutani Seiji
Mizutani Yuya
Abrégé
A polarizing microscope 1 comprises a sample stage 4 for carrying a sample 8, a polarizer 3 provided on a light source side of the sample 8, and an analyzer 6 provided on a viewing side of the sample 8. The polarizer 3 and/or the analyzer 6 is installed so that the polarization direction thereof is inclined relative to the optical main axis of the sample 8, or installed so that the angle formed by the polarization direction of the analyzer 6 and the polarization direction of the polarizer 3 is other than a right angle.
A sheet metal file includes a main body composed of a sheet metal member that is flexible, and cutting edges raised by setting on a surface, on a first side, of the main body. The sheet metal file is allowed to smooth an object to be smoothed. The main body is an elastic member. The cutting edges are formed so that a driving depth with respect to the main body is in a range of 20 to 40% of a thickness of the main body. The sheet metal file is allowed to smooth an object to be smoothed with the surface of the main body on which the cutting edges are raised facing a curved surface of the object to be smoothed and with the main body bent along the curved surface.
03 - Produits cosmétiques et préparations de toilette; préparations pour blanchir, nettoyer, polir et abraser.
07 - Machines et machines-outils
08 - Outils et instruments à main
Produits et services
(1) Abrasive paper [sandpaper], abrasive strips, abrasive sheets, abrasive paper, an abradant, namely sandcloth, polishing stones and carbides of metal used as abrasives, polishing paper, polishing preparations for wooden floors, polishing preparations for automobiles, polishing preparations for furniture, polishing preparations for musical instruments, polishing preparations for metal for use in the automotive, aerospace, shipbuilding industries, polishing preparations for metal products, namely, automotive parts.
(2) Abrasive disc for metal polishing, abrasive disc for wood polishing, abrasive disc for polishing resin molded products, abrasive disc for precision machinery, sword polishing machine, grinding machines, machine parts, namely, grindstones, sharpening wheels being parts of machines, machines and apparatus for polishing [electric], namely polishing machines for use in polishing wood, plastic, metal, glass, porcelain, and ceramic tiles, painted and lacquered surfaces, plaining machines for metal working, ski edge sharpening tools [electric].
(3) Hand held tools for polishing discs.
8.
Multi-stage batch polishing method for end surface of optical fiber connector, and polishing film
A polishing method and a polishing film are provided for automatically performing multi-stage batch polishing on an end surface of a workpiece. An end surface of a workpiece and a polishing plate are moved relative to each other while bringing the end surface of the workpiece into contact with a polishing film of the polishing plate. The end surface is moved in a circular motion with a diameter 2 R relative to the polishing film; the center of the circular motion is moved linearly by a distance S on the polishing film; the polishing film is provided with first, second, and third polishing surfaces; and the polishing film is further provided with cleaning surfaces between the polishing surfaces so that the range of the distance S in which one rotation in the circular motion crosses over different polishing surfaces is reduced, or does not cross over different polishing surfaces.
B24B 19/22 - Machines ou dispositifs conçus spécialement pour une opération particulière de meulage non couverte par d'autres groupes principaux caractérisés par le fait qu'ils sont spécialement étudiés en fonction des propriétés de la matière des objets non métalliques à meuler
B24B 19/00 - Machines ou dispositifs conçus spécialement pour une opération particulière de meulage non couverte par d'autres groupes principaux
B24B 21/00 - Machines ou dispositifs utilisant des bandes de meulage ou de polissageAccessoires à cet effet
B24B 51/00 - Systèmes pour la commande automatique d'une série d'opérations successives du meulage d'une pièce
B24B 47/12 - Entraînement ou transmission des machines ou dispositifs à meulerÉquipement à cet effet pour entraîner dans leur mouvement de rotation ou de va-et-vient les arbres porte-meules ou les arbres porte-pièces par une transmission mécanique ou par l'énergie électrique
B24D 13/14 - Meules dont le corps comporte des parties flexibles au travail, p. ex. meules souples de polissageAccessoires pour le montage de ces meules travaillant par leur face frontale
9.
Polishing sheet equipped with nano-silica polishing particles, and polishing method and manufacturing method for optical fiber connector using polishing sheet
A polishing sheet capable of reducing recesses formed at the core of the end surface of an optical fiber, and a manufacturing method for an optical fiber connector using the polishing sheet are provided. The method includes a step of the final polishing of an optical fiber ferrule assembly in which an optical fiber protrudes from the end surface of a ferrule, the protruding optical fiber having a recess in the tip end core. During the final polishing step, the optical fiber having the recess in the core is inserted into a flocked portion of a flocked polishing sheet. The optical fiber ferrule assembly and the flocked polishing sheet are disposed opposite one another and moved relatively to each other in order to polish the optical fiber. Fibers constituting the flocked portion have silica particles with an average particle diameter from 0.01 μm to 0.1 μm adhered to the surface.
G02B 6/38 - Moyens de couplage mécaniques ayant des moyens d'assemblage fibre à fibre
B24B 19/22 - Machines ou dispositifs conçus spécialement pour une opération particulière de meulage non couverte par d'autres groupes principaux caractérisés par le fait qu'ils sont spécialement étudiés en fonction des propriétés de la matière des objets non métalliques à meuler
B24B 49/12 - Appareillage de mesure ou de calibrage pour la commande du mouvement d'avance de l'outil de meulage ou de la pièce à meulerAgencements de l'appareillage d'indication ou de mesure, p. ex. pour indiquer le début de l'opération de meulage impliquant des dispositifs optiques
G01N 21/892 - Recherche de la présence de criques, de défauts ou de souillures dans un matériau mobile, p. ex. du papier, des textiles caractérisée par la crique, le défaut ou la caractéristique de l'objet examiné
G01B 11/30 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la rugosité ou l'irrégularité des surfaces
G01N 21/88 - Recherche de la présence de criques, de défauts ou de souillures
12.
POLISHING SHEET EQUIPPED WITH NANO-SILICA POLISHING PARTICLES, AND POLISHING METHOD AND MANUFACTURING METHOD FOR OPTICAL FIBER CONNECTOR USING POLISHING SHEET
Provided are a polishing sheet capable of reducing recesses formed at a core of the end surface of an optical fiber, and a manufacturing method for an optical fiber connector using the polishing sheet. The manufacturing method for the optical fiber connector includes a step of the final polishing of an optical fiber ferrule assembly in which an optical fiber is polished and thereby protruding from the end surface of a ferrule, the protruding optical fiber having a recess in the tip end core formed by the polishing. During the final polishing step, the optical fiber having the recess in the core is inserted into an embedded portion of an embedded polishing sheet with the optical fiber ferrule assembly and the embedded polishing sheet disposed opposite each other; the optical fiber ferrule assembly and the embedded polishing sheet are moved relatively to each other in order to polish the optical fiber. In order to reduce the depth of the recess during the polishing, fibers constituting the embedded portion have silica grains with an average grain diameter from 0.01 μm to 0.1 μm adhered to the surface.
Provided are a grinding method and a grinding film which are for automatically performing multi-stage batch grinding on an end surface of a workpiece such as an optical fiber connector. This grinding method includes moving an end surface of a workpiece and a grinder relative to each other within a plane parallel to a reference surface while bringing the end surface of the workpiece into contact with a grinding film disposed on the grinder to perform multi-stage batch grinding on the workpiece, wherein the end surface of the workpiece is moved in a circular motion with a diameter 2R relative to the grinding film; the center of the circular motion is moved linearly in one direction by a predetermined distance S on the grinding film; the grinding film is provided with first, second, and third grinding surfaces along the direction of the linear movement; the length in the direction of the linear movement of each of the grinding surfaces is equal to or greater than the diameter 2R of the circular motion; and the grinding film is further provided with a first cleaning surface between the first and second grinding surfaces and a second cleaning surface between the second and third grinding surfaces so that the range of the predetermined distance S in which one rotation in the circular motion crosses over different grinding surfaces is reduced, or so that one rotation in the circular motion does not cross over different grinding surfaces.
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (Japon)
FUJI ELECTRIC CO., LTD. (Japon)
Inventeur(s)
Mizutani, Seiji
Nakagawa, Kenji
Kato, Tomohisa
Takenaka, Kensuke
Abrégé
Provided is a method which enables observation of a minor crystal defect in a visible light region and which comprises: irradiating a substrate with polarized parallel light; and evaluating the crystal quality of at least one portion of the substrate through an image obtained from the light having transmitted through or been reflected by the substrate. The half value of width HW, the divergence angle DA, and the central wavelength CWL of the parallel light satisfy the following conditions, respectively. 3 ≤ HW ≤ 100, 0.1 ≤ DA ≤ 5, 250 ≤ CWL ≤ 1600, wherein the units of the central wavelength CWL and the half value of width HW are each nm, and the unit of the divergence angle DA is mrad.
Method for manufacturing a circular wafer by polishing the periphery, including a notch or orientation flat, of a wafer comprising crystal material, by use of polishing tape
Provided is a method for producing a circular wafer using a grinding tape to grind the edge of a wafer comprising a crystalline material. A primary grinding step is provided for contacting a grinding body to the peripheral portion of a wafer placed centered on a horizontal stage and rotating the stage, thus grinding the peripheral portion. The radius of the wafer is measured, and a radius is set that is no greater than the measured smallest radius, and the difference Δr between the set radius and the measured wafer radius along the peripheral portion is determined. The portions of the peripheral portion at which Δr is greater than a predetermined value are determined and a secondary grinding step is provided for contacting the peripheral portion and the grinding body, rotating the stage forwards and backwards in a predetermined range of rotational angles, and grinding the peripheral portion.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
03 - Produits cosmétiques et préparations de toilette; préparations pour blanchir, nettoyer, polir et abraser.
04 - Huiles et graisses industrielles; lubrifiants; combustibles
07 - Machines et machines-outils
08 - Outils et instruments à main
09 - Appareils et instruments scientifiques et électriques
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler
Produits et services
Detergents for use in manufacturing processes, namely, Substrate detergents for use in manufacturing processes of hard disks; chemical polishing slurry, namely, polishing slurry for use in magnetic hard disk substrate surfaces or semiconductor wafer surfaces Polishing abrasive grain, namely, Polishing abrasive grain for use in polishing magnetic hard disk substrate surfaces or semiconductor wafer surfaces; Abrasive paper [ Lubricants for use in surface treatment processes, namely, Lubricants for use in surface treatment processes of hard disk; Solid coating film lubricants ] Polishing machines; Glass substrate polishing machines; Polishing machines for manufacturing hard disks; Polishing machines, namely, chemical and physical semiconductor substrate polishers; Polishing machines, namely, chemical and physical glass substrate polishers; Polishing machines, namely, semiconductor wafer surface polishers; Cleaning machines for surfaces of liquid crystal panels; Machines for burnishing with tape hard disk substrate surfaces or semiconductor wafer surfaces; Optical fiber end surface polishing machines; Single crystal substrate polishing machines [ Abrading tools ] [ Display screen protective films, namely, Display screen protective covers adapted for use with telecommunication machines and apparatus; Display screen protective films, namely, display screen protective covers adapted for use with electronic machines and apparatus, namely, electronic dictionaries, desk calculators, and car navigation systems; Surface protective films, namely, fitted plastic films known as skins for covering and providing a scratch proof barrier or protection for telecommunication machines, namely, facsimile machines; surface protective films, namely, fitted plastic films, known as skins for covering and providing a scratch proof barrier or protection for electronic machines, namely, image formation readers ] Conductive films, namely, Conductive films for touch panels; Plastic polishing films, namely, polishing films for use in polishing magnetic hard disk substrate surfaces or semiconductor wafer surfaces; Plastic polishing films for use in polishing optical fiber end surface or optical connector end surface; Cassette-type plastic polishing films for use in polishing optical fiber end surface or optical connector end surface; Plastic polishing films for use in polishing probes used in electrical inspection of circuit boards
17.
METHOD FOR PRODUCING CIRCULAR WAFER BY MEANS OF USING GRINDING TAPE TO GRIND EDGE OF WAFER COMPRISING CRYSTALLINE MATERIAL AND HAVING NOTCHED SECTION SUCH AS ORIENTATION FLAT
Provided is a method for producing a circular wafer by using a grinding tape to grind the edge of a wafer comprising a crystalline material. The present invention includes: a primary grinding step for contacting a grinding body to the peripheral portion of a wafer placed centered on a horizontal stage having a vertical rotational axis and rotating the stage, thus grinding the peripheral portion; a step for measuring the radius of the wafer, setting a radius that is no greater than the measured smallest radius, and determining the difference (Δr) between the set radius and the measured wafer radius along the peripheral portion; a step for determining the portions of the peripheral portion at which Δr is greater than a predetermined value; and a secondary grinding step for contacting the peripheral portion and the grinding body, rotating the stage forwards and backwards in a predetermined range of rotational angles, and grinding the peripheral portion. The grinding body contains a grinding tape disposed at a flat grinding pad and demarcating a flat grinding surface, and in the secondary grinding step, the stage and grinding surface are rocked relative to each other along a horizontal axis line, reducing the speed of the forward and backward rotation of the stage within a range of rotational angles corresponding to the determined section of the peripheral portion.
B24B 9/00 - Machines ou dispositifs pour meuler les bords ou les biseaux des pièces ou pour enlever des bavuresAccessoires à cet effet
B24B 21/16 - Machines ou dispositifs utilisant des bandes de meulage ou de polissageAccessoires à cet effet pour meuler d'autres surfaces d'un profil particulier
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
03 - Produits cosmétiques et préparations de toilette; préparations pour blanchir, nettoyer, polir et abraser.
Produits et services
COATED ABRASIVES; NAMELY, PAPER, CLOTH AND PLASTIC BACKED BONDED ABRASIVE DISCS, SHEETS, STRIPS, ROLLS AND BELTS; AND BONDED ABRASIVE; NAMELY, GRINDING AND CUT-OFF WHEELS AND THEIR ACCESSORIES
A sheet metal file includes a main body composed of a sheet metal member that is flexible, and cutting edges raised by setting on a surface, on a first side, of the main body. The sheet metal file is allowed to smooth an object to be smoothed. The main body is an elastic member. The cutting edges are formed so that a driving depth with respect to the main body is in a range of 20 to 40% of a thickness of the main body. The sheet metal file is allowed to smooth an object to be smoothed with the surface of the main body on which the cutting edges are raised facing a curved surface of the object to be smoothed and with the main body bent along the curved surface.
