Mektec Corporation

Japon

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Type PI
        Brevet 117
        Marque 15
Juridiction
        États-Unis 116
        International 8
        Europe 5
        Canada 3
Date
Nouveautés (dernières 4 semaines) 2
2026 octobre (MACJ) 1
2026 septembre 1
2026 juillet 3
2026 juin 2
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Classe IPC
H05K 1/02 - Circuits imprimés Détails 55
H05K 1/03 - Emploi de matériaux pour réaliser le substrat 25
H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés 20
H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés 17
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés 17
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Classe NICE
09 - Appareils et instruments scientifiques et électriques 12
12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules 10
17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler 7
07 - Machines et machines-outils 5
Statut
En Instance 18
Enregistré / En vigueur 114
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1.

FLEXIBLE PRINTED CIRCUIT

      
Numéro d'application 19629439
Statut En instance
Date de dépôt 2026-03-26
Date de la première publication 2026-10-01
Propriétaire
  • MEKTEC CORPORATION (Japon)
  • ISUZU MOTORS LIMITED (Japon)
Inventeur(s)
  • Matsuba, Nobuo
  • Takeda, Shogo
  • Hosono, Yusuke
  • Omori, Atsushi
  • Unno, Michihiro
  • Abe, Takatoshi

Abrégé

The present invention provides a flexible printed circuit having a structure capable of favorably suppressing breakage of a circuit body. A flexible printed circuit, includes: a flexible circuit body having a substrate, wiring formed on the substrate, and an insulating coating covering the wiring; and a reinforcing plate laminated on the circuit body, in which the circuit body includes a first portion and a second portion extending from the first portion with a smaller width than the first portion, the reinforcing plate is laminated on at least the first portion among the first portion and the second portion, and when viewed in a thickness direction of the circuit body, the reinforcing plate is disposed at a position offset toward inward side of the circuit body with respect to a boundary point P1 between the first portion and the second portion in an outline of the circuit body.

Classes IPC  ?

2.

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

      
Numéro d'application JP2026005712
Numéro de publication 2026/186464
Statut Délivré - en vigueur
Date de dépôt 2026-02-17
Date de publication 2026-09-10
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Koshida Kaita
  • Chokki Kenta
  • Yoshida Tomohiko
  • Ichibangase Tomoya

Abrégé

The purpose of the present invention is to provide: a method for manufacturing a printed circuit board capable of obtaining an aluminum-base printed circuit board comprising a highly reliable interlayer connection path; and said printed circuit board. A method for manufacturing a printed circuit board according to an embodiment of the present invention comprises: a step for preparing a double-sided aluminum foil-clad substrate (10); a step for forming a through hole (TH) that penetrates the double-sided aluminum foil-clad substrate in the thickness direction or a bottomed hole (BVH) in which an aluminum foil (13) is exposed at the bottom; a step for subjecting an aluminum foil (12) and the aluminum foil (13) to a zincate treatment; a step for subjecting the aluminum foils (12, 13) having been subjected to the zincate treatment to a plating treatment to form a barrier plating layer (15); a step for subjecting the through hole or the bottomed hole to a conductive treatment; and a step for subjecting the through hole or the bottomed hole having been subjected to the conductive treatment to a plating treatment to form a plating layer that electrically connects the aluminum foil (12) and the aluminum foil (13).

Classes IPC  ?

  • H05K 3/42 - Trous de passage métallisés
  • H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés

3.

FLEXIBLE PRINTED CIRCUIT BOARD MODULE AND BATTERY DEVICE

      
Numéro d'application 19445077
Statut En instance
Date de dépôt 2026-01-09
Date de la première publication 2026-07-30
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Nakayama, Kenichi
  • Kanayama, Tomoki
  • Yamada, Shuzo
  • Suzuki, Takamasa

Abrégé

A flexible printed circuit board module is a flexible printed circuit board module attachable to a battery including a plurality of cells, including: a flexible printed circuit board; a plurality of bus bars; and a case, in which the flexible printed circuit board includes a line, the plurality of bus bars is electrically connected to the line, the flexible printed circuit board and the plurality of bus bars are attached to the case, and the flexible printed circuit board is disposed between the battery and the case.

Classes IPC  ?

  • H01M 50/519 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant des circuits imprimés
  • H01M 10/48 - Accumulateurs combinés à des dispositions pour mesurer, tester ou indiquer l'état des éléments, p. ex. le niveau ou la densité de l'électrolyte
  • H01M 50/209 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules prismatiques ou rectangulaires
  • H01M 50/507 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant un arrangement de plusieurs barres omnibus réunies dans une structure de conteneur, p. ex. modules de barres omnibus

4.

WIRING MATERIAL

      
Numéro d'application JP2026001028
Numéro de publication 2026/155189
Statut Délivré - en vigueur
Date de dépôt 2026-01-15
Date de publication 2026-07-23
Propriétaire
  • NOK CORPORATION (Japon)
  • MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Shigeoka, Takeshi
  • Watanabe, Junichi

Abrégé

This wiring material comprises: a flexible base material that is long in a first direction; and a plurality of wires that are installed on the base material and extend in the first direction. In a first region, which is a part of the base material in the first direction, a plurality of slits along the first direction are formed in parallel in a second direction intersecting the first direction.

Classes IPC  ?

5.

WIRING MATERIAL AND PRODUCTION METHOD FOR WIRING STRUCTURE

      
Numéro d'application JP2026001037
Numéro de publication 2026/155192
Statut Délivré - en vigueur
Date de dépôt 2026-01-15
Date de publication 2026-07-23
Propriétaire
  • NOK CORPORATION (Japon)
  • MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Kashiwagi, Daisuke
  • Mizuno, Shu
  • Shigeoka, Takeshi
  • Sato, Yohei
  • Sakata, Yuichi
  • Takao, Yuki

Abrégé

The present invention is a band-like wiring material that is formed by coating a plurality of pieces of wiring with an insulating coating part, the wiring material including a first portion and a second portion that are at different positions as seen in plan view, the rigidity of the first portion being greater than the rigidity of the second portion.

Classes IPC  ?

6.

REINFORCING PLATE AND ELECTRICAL COMPONENT

      
Numéro d'application 19178264
Statut En instance
Date de dépôt 2025-04-14
Date de la première publication 2026-06-11
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Saigusa, Masaya
  • Aita, Hironori
  • Kiyomoto, Shuichi

Abrégé

A reinforcing plate to be bonded to a flexible printed circuit board, the reinforcing plate having heat resistance sufficient to withstand a reflow soldering process and configured to include a molded article made of a thermoplastic resin. An electrical component includes the reinforcing plate and the flexible printed circuit board to which the reinforcing plate is bonded.

Classes IPC  ?

7.

SUBSTRATE-INTEGRATED WAVEGUIDE

      
Numéro d'application JP2025030836
Numéro de publication 2026/115833
Statut Délivré - en vigueur
Date de dépôt 2025-09-02
Date de publication 2026-06-04
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Kumagai Kenji

Abrégé

[Problem] To provide a substrate-integrated waveguide in which the width of a waveguide can be reduced while transmission characteristics are maintained. [Solution] A substrate-integrated waveguide 1 comprises: a dielectric part 10; a lower conductive layer 21 which is disposed on the lower surface of the dielectric part 10; an upper conductive layer 22 which is disposed on the upper surface of the dielectric part 10; a post column PC1 in which a plurality of conductive posts 41 are disposed along the longitudinal direction of the dielectric part 10; a post column PC2 in which a plurality of conductive posts 42 are disposed along the longitudinal direction and which is provided parallel to the post column PC1; and an inner conductive layer 31 which is disposed inside the dielectric part 10, is electrically connected to the lower conductive layer 21 and the upper conductive layer 22 via the post columns PC1, PC2, and includes a gap G1 which extends along the longitudinal direction and is provided on the post column PC1 side.

Classes IPC  ?

8.

BATTERY MONITORING MODULE

      
Numéro d'application 19378731
Statut En instance
Date de dépôt 2025-11-04
Date de la première publication 2026-05-07
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Tomita, Shunsuke
  • Kanayama, Tomoki
  • Watanabe, Tsukasa
  • Atarashi, Shogo

Abrégé

A battery monitoring module includes: a flexible printed circuit board having a main part and a branched part branched from the main part; a bus bar that is connected to wiring provided to the flexible printed circuit board and is welded to an electrode of a cell in the branched part; and a cover that protects the flexible printed circuit board, in which the cover integrally includes a first cover part that covers the main part and a second cover part that covers the branched part, and the second cover part is capable of exposing a region in which the bus bar is arranged, by rotating an end opposite the first cover part side in the second cover part in a direction approaching the first cover part while the first cover part covers the main part.

Classes IPC  ?

  • H01M 10/42 - Procédés ou dispositions pour assurer le fonctionnement ou l'entretien des éléments secondaires ou des demi-éléments secondaires

9.

INSPECTION SYSTEM AND INSPECTION METHOD

      
Numéro d'application JP2025013727
Numéro de publication 2026/078916
Statut Délivré - en vigueur
Date de dépôt 2025-04-04
Date de publication 2026-04-16
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Mizuno Shu
  • Matsuda Fumihiko
  • Nakagawa Yasuyuki
  • Fukuda Toshihiro

Abrégé

[Problem]: To provide an inspection system and an inspection method capable of easily and efficiently performing short-circuit inspection and conduction inspection of a printed wiring board. [Solution] An inspection system 1 according to an embodiment is for performing short-circuit inspection and conduction inspection of a flexible printed wiring board 300, the flexible printed wiring board 300 including a plurality of wiring parts, each wiring part having a terminal 310, a terminal 320, and wiring 330 electrically connecting the terminal 310 and the terminal 320. An inspection jig 11 has a plurality of probes 112 capable of respectively coming into contact with the terminals 310 of the plurality of wiring parts. A short-circuit jig 12 is configured separately from the inspection jig 11 and has a first probe and a second probe electrically connected to each other, the first probe and the second probe being capable of respectively coming into contact with adjacent terminals 320 of the flexible printed wiring board 300.

Classes IPC  ?

  • G01R 31/52 - Test pour déceler la présence de courts-circuits, de fuites de courant ou de défauts à la terre
  • G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
  • G01R 31/54 - Test de la continuité
  • H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés

10.

VOLTAGE MONITORING MODULE, BATTERY MODULE, AND SUPPORT CASE

      
Numéro d'application 19188954
Statut En instance
Date de dépôt 2025-04-24
Date de la première publication 2026-01-15
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Hosokawa, Takuya
  • Kiya, Kenji
  • Kanayama, Tomoki

Abrégé

A voltage monitoring module includes a flexible printed circuit board and a support case supporting the flexible printed circuit board. The flexible printed circuit board includes a body and a branch branched from the body and having an extension extending in a first direction which is the longitudinal direction of the body. The branch has, at a tip end portion thereof, a connection terminal to be connected to a cell terminal of a battery cell. The support case includes a first case, a second case on which the body is to be mounted and which is provided movably in the first direction relative to the first case, and a movement restrictor that restricts movement of the second case after the second case has moved to a final set position.

Classes IPC  ?

  • H01M 50/503 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie caractérisées par la forme des interconnecteurs
  • G01R 31/36 - Dispositions pour le test, la mesure ou la surveillance de l’état électrique d’accumulateurs ou de batteries, p. ex. de la capacité ou de l’état de charge
  • G01R 31/3835 - Dispositions pour la surveillance de variables des batteries ou des accumulateurs, p. ex. état de charge ne faisant intervenir que des mesures de tension
  • H01M 10/48 - Accumulateurs combinés à des dispositions pour mesurer, tester ou indiquer l'état des éléments, p. ex. le niveau ou la densité de l'électrolyte
  • H01M 50/209 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules prismatiques ou rectangulaires
  • H01M 50/284 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports comprenant l’insertion de cartes de circuits, p. ex. de cartes de circuits imprimés
  • H01M 50/519 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant des circuits imprimés

11.

STRETCHABLE CIRCUIT BOARD

      
Numéro d'application 19188923
Statut En instance
Date de dépôt 2025-04-24
Date de la première publication 2025-12-25
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Kaneko, Takumi

Abrégé

Provided is a stretchable circuit board including a first stretchable base; a stretchable conductive layer; a second stretchable base; an adhesive; biological electrodes; external terminals; and terminal attachment members, in which each biological electrode and each external terminal are included in the stretchable conductive layer, the second stretchable base is disposed so as to face the first stretchable base with the stretchable conductive layer interposed therebetween, the adhesive is configured to fix the stretchable circuit board to a biological body, each terminal attachment member is attached to an attachment portion of a corresponding connection terminal of external device to electrically connect the external terminals to the connection terminals of the external device, at least a biological-body-side surface of each terminal attachment member is exposed on the adhesive, and each terminal attachment member is movable in an in-plane direction of the stretchable circuit board.

Classes IPC  ?

  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

12.

COUPLING WAVEGUIDE AND WAVEGUIDE COUPLING METHOD

      
Numéro d'application JP2024039156
Numéro de publication 2025/197174
Statut Délivré - en vigueur
Date de dépôt 2024-11-01
Date de publication 2025-09-25
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Kumagai Kenji

Abrégé

[Problem] To provide a coupling waveguide that can be easily manufactured and with which deterioration of transmission characteristics can be avoided. [Solution] A coupling waveguide 1 according to an embodiment that comprises: a waveguide 10 configured to propagate radio waves and provided with an opening window W1 for emitting the radio waves to the outside; a waveguide 20 provided with an opening window W2 for absorbing radio waves from the outside, configured to propagate the radio waves absorbed from a second opening window, and coupled to the waveguide 10 such that the opening window W2 at least partially overlaps the opening window W1; and an anisotropic conductive film 30 that covers the opening window W1 and the opening window W2, and bonds together the waveguide 10 and the waveguide 20.

Classes IPC  ?

  • H01P 1/04 - Joints fixes
  • H01P 3/12 - Guides d'ondes creux
  • H01P 5/02 - Dispositifs de couplage du type guide d'ondes à coefficient de couplage invariable

13.

COUPLED WAVEGUIDE AND WAVEGUIDE COUPLING METHOD

      
Numéro d'application 19081906
Statut En instance
Date de dépôt 2025-03-17
Date de la première publication 2025-09-18
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Kumagai, Kenji

Abrégé

To provide a coupled waveguide that can be easily manufactured and avoid degradation of transmission characteristics. A coupled waveguide of an embodiment includes a waveguide configured to propagate electric waves and provided with a first opening window that radiates the electric waves to outside, a waveguide provided with a second opening window that absorbs electric waves from outside, configured to propagate the electric waves absorbed through the second opening window, and coupled to the waveguide such that the second opening window at least partially overlaps the first opening window, and an anisotropic conductive film covering the first opening window and the second opening window and bonding the waveguide and the waveguide.

Classes IPC  ?

14.

WETNESS DETECTION SENSOR SHEET, WETNESS DETECTION SENSOR SHEET SET, AND WETNESS DETECTION SYSTEM

      
Numéro d'application 19004200
Statut En instance
Date de dépôt 2024-12-27
Date de la première publication 2025-09-18
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Tominaga, Azumi

Abrégé

Provided with a wetness detection sensor sheet, the wetness detection sensor sheet being configured to be worn by a wearer as part of or together with an absorbable product, including: a sensor device; and a water-conducting sheet, the sensor device includes an antenna portion and a communication portion, and is configured to be capable of wireless communication; the water-conducting sheet is placed on one or both sides of the sensor device in an overlapping manner, and is configured to extend from a stomach side to a back side through below a crotch of the wearer when the wearer wears the absorbable product; and the sensor device is provided on a side closer to a region of the water-conducting sheet corresponding to the stomach side or a region of the water-conducting sheet corresponding to the back side with respect to a region of the water-conducting sheet corresponding to below the crotch.

Classes IPC  ?

  • G01N 22/04 - Recherche de la teneur en eau
  • G08B 21/20 - Alarmes de situation réagissant à l'humidité
  • H04W 4/80 - Services utilisant la communication de courte portée, p. ex. la communication en champ proche, l'identification par radiofréquence ou la communication à faible consommation d’énergie

15.

FLEXIBLE PRINTED WIRING BOARD

      
Numéro d'application JP2024039155
Numéro de publication 2025/187118
Statut Délivré - en vigueur
Date de dépôt 2024-11-01
Date de publication 2025-09-11
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Mizuno Shu

Abrégé

[Problem] To provide a flexible printed wiring board capable of obtaining a stable characteristic impedance even when a signal line approaches another conductor when bending. [Solution] This flexible printed wiring board 1 comprises: a flexible insulation film 2; a signal line 3 that is disposed on the upper surface 2a of the insulation film 2; a ground conductor 4 that is disposed on the upper surface 2a of the insulation film 2 so as to be adjacent to the signal line 3 and that has a thickness greater than the thickness of the signal line 3; and an insulation coating part 6 that covers the signal line 3 and the ground conductor 4. The insulation coating part 6 fills a groove G1 defined by the signal line 3, the ground conductor 4, and the insulation film 2, and the upper surface of the insulation coating part 6 covering the signal line 3, over the width W of the signal line 3, is located above the upper surface of at least the portion of the ground conductor 4 that is adjacent to the signal line 3.

Classes IPC  ?

  • H05K 1/02 - Circuits imprimés Détails
  • H05K 3/06 - Élimination du matériau conducteur par voie chimique ou électrolytique, p. ex. par le procédé de photo-décapage
  • H05K 3/46 - Fabrication de circuits multi-couches

16.

VOLTAGE MONITORING MODULE AND BATTERY UNIT

      
Numéro d'application 18958904
Statut En instance
Date de dépôt 2024-11-25
Date de la première publication 2025-05-29
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Hosokawa, Takuya
  • Kiya, Kenji
  • Kanayama, Tomoki

Abrégé

Provided is a voltage monitoring module for monitoring a voltage of a battery pack configured such that a plurality of sections, each of which includes a plurality of battery cells arranged in a first direction, is arranged in the first direction, including: a plurality of flexible printed boards, in which each of the plurality of flexible printed boards has a body portion and a plurality of branch portions; the body portion extends in the first direction; each of the plurality of branch portions is branched from the body portion; each of the plurality of branch portions is provided with a connection terminal on a tip end side; and the plurality of flexible printed boards is each arranged corresponding to each of the plurality of sections, and the connection terminal is connected to a terminal of the plurality of battery cells of the section corresponding to the flexible printed board.

Classes IPC  ?

  • G01R 31/3835 - Dispositions pour la surveillance de variables des batteries ou des accumulateurs, p. ex. état de charge ne faisant intervenir que des mesures de tension

17.

MEKTEC HyBF

      
Numéro d'application 019193289
Statut Enregistrée
Date de dépôt 2025-05-26
Date d'enregistrement 2025-09-19
Propriétaire MEKTEC CORPORATION (Japon)
Classes de Nice  ?
  • 07 - Machines et machines-outils
  • 09 - Appareils et instruments scientifiques et électriques
  • 12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules
  • 17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler

Produits et services

Machine tools; motors, except for land vehicles; machine coupling, except for land vehicles; machine belts, except for land vehicles; incubators for eggs; agricultural machines and implements; construction machines; engines, except for land vehicles; joints, except those for land vehicles; transmission components, except for land vehicles; vending machines; engine parts for automobiles; ball bearings; roller bearings; exhaust pipes for land vehicles; transmission belts, other than for land vehicles; engines for aircraft; transmission parts for aircraft; transmission parts for ships. Flexible printed circuits; keyboard controllers; switches, electric; capacitors; busbars; electronic connectors; power distribution machines and apparatus; panel keyboard; printed circuit board; materials testing instruments and machines; flexible printed circuit board; scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking [supervision], life-saving and teaching apparatus and instruments; apparatus for recording, transmission or reproduction of sound or images; mechanisms for coin-operated apparatus; cash registers; calculating machines; data processing equipment; computers; fire-extinguishing apparatus; Electric circuits; rectifiers; electronic components; apparatus and instruments for conducting, distributing, transforming, accumulating, regulating or controlling electricity; magnetic recording media; acoustic disks; compact disks, DVDs and other digital recording media; computer software; data processing apparatus and computers; flexible circuits; printed circuits; Multilayer flexible printed circuit boards; multilayer circuits and surface mount device boards; Chips [integrated circuits]; Integrated circuits; Integrated circuit cards [smart cards]; electronic controllers for automobiles. Two-wheeled motor vehicles, bicycles and their parts and fittings; automobiles and their parts and fittings; aircraft and their parts and fittings; vessels and their parts and fittings; railway rolling stock and their parts and fittings; motors for land vehicles; Plastic products and technical products for vehicles, namely, parts and fittings for vehicles, of plastic, internal fittings parts for vehicles, of plastic, transmission components for vehicles, of plastic, structural parts for vehicles, of plastic, transmission mechanisms for vehicles, of plastic; Engines for automobiles; transmission parts for automobiles; suspension parts for automobiles; engines for railway cars; engines for two-wheeled motor vehicles; engines for land vehicles; transmission parts for railway cars; transmission parts for bicycles; transmission parts for vehicles; suspension parts for aircraft; suspension parts for ships; suspension parts for railway cars; suspension parts for bicycles; suspension parts for vehicles; bushings for vehicles; bearings, machine elements for land vehicles; clutches for land vehicles; gears for vehicles; transmission belts for land vehicles; shock absorbers for vehicles; dust covers of plastic or rubber for automobile parts. Rubber, gutta-percha, gum, asbestos and mica; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; Flexible pipes, not of metal; acrylic resins, semi-finished products; adhesive bands other than stationery and not for medical or household purposes; anti-dazzle films for windows [tinted films]; floating Anti-pollution barriers; asbestos cloth; asbestos coverings; asbestos fabrics; asbestos felt; asbestos mill boards; asbestos packing; asbestos paper; asbestos safety curtains; asbestos sheets; asbestos slate; bags [envelopes, pouches] of rubber, for packaging; balata; bands of rubber for unscrewing jar lids; bark coverings for sound insulation; boiler composition to prevent the radiation of heat; brake lining materials; semi-processed plastics; sealing, packing and insulation material; non-metallic flexible tubes; gaskets; dust proofing seals; o-rings; anti-vibration rubbers used for anti-vibration dampers and mounts for land vehicles, water vehicles, outboard motors, motors or machines; anti-vibration rubbers used in anti-vibration mounts for stepping motors, electrical equipment, and precision instruments; films and sheets made from plastic, polymers, semi-processed plastic, resin, epoxy resin, thermoset, and thermoplastics for use in the manufacture of circuit boards; gasket material in sheets for use in electronics; non-metal gaskets for use in electronics; non-metal sealing rings for use as connection seals; non-metal seals for use in electronics; packing, cushioning, and stuffing materials of rubber or plastics; sealing materials; insulating materials; waterproof packings for use in electronics; plastic substances, semi-processed; plastic film other than for wrapping; plastic semi-worked products; synthetic rubber; rubber, raw or semi-worked; synthetic resins, semi-finished products; cylinder jointings; ebonite (vulcanite); filtering materials of semi-processed films or foams of plastic; joint packings; connecting hoses for vehicle radiators.

18.

MEKTEC Hybrid FPC

      
Numéro d'application 019193381
Statut Enregistrée
Date de dépôt 2025-05-26
Date d'enregistrement 2025-09-19
Propriétaire MEKTEC CORPORATION (Japon)
Classes de Nice  ?
  • 07 - Machines et machines-outils
  • 09 - Appareils et instruments scientifiques et électriques
  • 12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules
  • 17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler

Produits et services

Machine tools; motors, except for land vehicles; machine coupling, except for land vehicles; machine belts, except for land vehicles; incubators for eggs; agricultural machines and implements; construction machines; engines, except for land vehicles; joints, except those for land vehicles; transmission components, except for land vehicles; vending machines; engine parts for automobiles; ball bearings; roller bearings; exhaust pipes for land vehicles; transmission belts, other than for land vehicles; engines for aircraft; transmission parts for aircraft; transmission parts for ships. Flexible printed circuits; keyboard controllers; switches, electric; capacitors; busbars; electronic connectors; power distribution machines and apparatus; panel keyboard; printed circuit board; materials testing instruments and machines; flexible printed circuit board; scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking [supervision], life-saving and teaching apparatus and instruments; apparatus for recording, transmission or reproduction of sound or images; mechanisms for coin-operated apparatus; cash registers; calculating machines; data processing equipment; computers; fire-extinguishing apparatus; Electric circuits; rectifiers; electronic components; apparatus and instruments for conducting, distributing, transforming, accumulating, regulating or controlling electricity; magnetic recording media; acoustic disks; compact disks, DVDs and other digital recording media; computer software; data processing apparatus and computers; flexible circuits; printed circuits; Multilayer flexible printed circuit boards; multilayer circuits and surface mount device boards; Chips [integrated circuits]; Integrated circuits; Integrated circuit cards [smart cards]; electronic controllers for automobiles. Two-wheeled motor vehicles, bicycles and their parts and fittings; automobiles and their parts and fittings; aircraft and their parts and fittings; vessels and their parts and fittings; railway rolling stock and their parts and fittings; motors for land vehicles; Plastic products and technical products for vehicles, namely, parts and fittings for vehicles, of plastic, internal fittings parts for vehicles, of plastic, transmission components for vehicles, of plastic, structural parts for vehicles, of plastic, transmission mechanisms for vehicles, of plastic; Engines for automobiles; transmission parts for automobiles; suspension parts for automobiles; engines for railway cars; engines for two-wheeled motor vehicles; engines for land vehicles; transmission parts for railway cars; transmission parts for bicycles; transmission parts for vehicles; suspension parts for aircraft; suspension parts for ships; suspension parts for railway cars; suspension parts for bicycles; suspension parts for vehicles; bushings for vehicles; bearings, machine elements for land vehicles; clutches for land vehicles; gears for vehicles; transmission belts for land vehicles; shock absorbers for vehicles; dust covers of plastic or rubber for automobile parts. Rubber, gutta-percha, gum, asbestos and mica; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; Flexible pipes, not of metal; acrylic resins, semi-finished products; adhesive bands other than stationery and not for medical or household purposes; anti-dazzle films for windows [tinted films]; floating Anti-pollution barriers; asbestos cloth; asbestos coverings; asbestos fabrics; asbestos felt; asbestos mill boards; asbestos packing; asbestos paper; asbestos safety curtains; asbestos sheets; asbestos slate; bags [envelopes, pouches] of rubber, for packaging; balata; bands of rubber for unscrewing jar lids; bark coverings for sound insulation; boiler composition to prevent the radiation of heat; brake lining materials; semi-processed plastics; sealing, packing and insulation material; non-metallic flexible tubes; gaskets; dust proofing seals; o-rings; anti-vibration rubbers used for anti-vibration dampers and mounts for land vehicles, water vehicles, outboard motors, motors or machines; anti-vibration rubbers used in anti-vibration mounts for stepping motors, electrical equipment, and precision instruments; films and sheets made from plastic, polymers, semi-processed plastic, resin, epoxy resin, thermoset, and thermoplastics for use in the manufacture of circuit boards; gasket material in sheets for use in electronics; non-metal gaskets for use in electronics; non-metal sealing rings for use as connection seals; non-metal seals for use in electronics; packing, cushioning, and stuffing materials of rubber or plastics; sealing materials; insulating materials; waterproof packings for use in electronics; plastic substances, semi-processed; plastic film other than for wrapping; plastic semi-worked products; synthetic rubber; rubber, raw or semi-worked; synthetic resins, semi-finished products; cylinder jointings; ebonite (vulcanite); filtering materials of semi-processed films or foams of plastic; joint packings; connecting hoses for vehicle radiators.

19.

MEKTEC HYBF

      
Numéro de série 99199061
Statut En instance
Date de dépôt 2025-05-23
Propriétaire MEKTEC CORPORATION (Japon)
Classes de Nice  ?
  • 07 - Machines et machines-outils
  • 09 - Appareils et instruments scientifiques et électriques
  • 12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules
  • 17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler

Produits et services

Machines and machine tools for the cutting and forming of materials; motors, except for land vehicles; machine coupling, except for land vehicles; machine belts, except for land vehicles; incubators for eggs; agricultural machines, namely, cultivators, harvestors, disk harrows, seeders, cultipackers, tilling machines, planters, plows, hoppers; agricultural implements, namely, coulters, hay balers, incorporators, seed drills; concrete and road construction machines, bulldozers, hydraulic and trench excavators, asphalt paving machines, concrete paving machines, drilling machines, rock drilling machines, road sweeping machines construction machines; engines, except for land vehicles; machine parts, namely, joints for connecting sliding strips, plates and guides; universal joints, namely, Cardan joints not for land vehicles; transmission components, except for land vehicles; vending machines; mechanical engine parts for automobiles; ball bearings for use in machines, namely, agricultural machinery, construction machines, engines, industrial machines motors; roller bearings for machines; exhaust pipes for land vehicles; transmission belts, other than for land vehicles Flexible printed circuits; computer keyboard controllers; switches, electric; capacitors; electrical power distribution units, namely, busbars; electronic connectors; electric power distribution machines and apparatus; keyboards, namely, computer keyboards; printed circuit boards; electronic materials testing instruments and machines for drive technology for vehicles, air travel and railway engineering; Flexible printed circuit board; scientific apparatus and instruments, namely, ultra-high vacuum chambers; nautical and photographic apparatus and instruments, namely, underwater housings for cameras, underwater enclosures for cameras and underwater enclosures for photographic lenses; surveying apparatus and instruments; cinematographic apparatus and instruments, namely, cinematographic cameras; optical apparatus and instruments, namely, eyeglass lenses; weighing apparatus and instruments; measuring apparatus and instruments, namely, angle finders; signaling apparatus and instruments, namely, signaling lights; checking apparatus, namely, apparatus for checking flight parameters; teaching apparatus and instruments, namely, teaching robots; apparatus for recording, transmission or reproduction of sound or images; mechanisms for coin-operated apparatus; cash registers; calculating machines; data processing equipment; computers; fire-extinguishing apparatus; electric circuits; rectifiers; electronic components, namely, piezoelectric switches; Electronic components for computers; Electronic components for juke boxes; Audio electronic components, namely, surround sound systems; Electronic components in the nature of infrared detectors for use in further manufacture; apparatus and instruments for conducting, transforming, accumulating, regulating or controlling the distribution or use of electricity; recorded and downloadable media, namely, typeface fonts recorded on magnetic media; blank magnetic recording media in the nature of blank electronic storage media and blank digital storage media, for recording sounds or images; acoustic disks, namely, compact disks featuring music; acoustic disks featuring information on the use of equipment in the field of space and information technology; blank acoustic disks, namely, blank audio disks and blank optical disk; blank compact disks; blank recordable DVDs; data processing apparatus; printed circuits; multilayer flexible printed circuit boards; printed circuits, namely, multilayer circuits and surface mount device boards; computer chips; Sensor chips for scientific use; DNA chips; Silicon chips; integrated circuits; integrated circuit cards; blank smart cards; electronic controllers for automobiles Two-wheeled motor vehicles; bicycles and their structural parts and fittings; automobiles and their structural parts and fittings; aircraft and their structural parts and fittings; vessels and their structural parts and fittings; railway rolling stock and their structural parts and fittings; motors for land vehicles; plastic parts for vehicles, namely, automotive exterior and interior plastic extruded decorative and protective trim, column switches, shift levers, door knobs, ADAS sensors, battery voltage monitoring, and lighting; engines for automobiles; transmission parts for automobiles, namely, transmission chains for land vehicles; land vehicle transmission parts, namely, gears, shafts, retainers, housings, forks, synchronizer assemblies and rings; land vehicle transmission parts, namely, valve bodies; suspension parts for automobiles, namely, suspension struts; Land vehicle suspension parts, namely, torsion/sway bars; land vehicle suspension parts, namely, coil springs; engines for land vehicles, namely, engines for railway cars; engines for two-wheeled motor vehicles; engines for land vehicles; transmission parts for land vehicles being railway cars, namely, transmission chains, force transmission cables; transmission parts for land vehicles being bicycles, namely, transmission chains; transmission parts for land vehicles, namely, transmission chains; power transmission parts for land vehicles in the nature of transmission cases for land vehicles; Transmission parts for land vehicles, namely, transmission drive shafts, transmission half shafts, and transmission propeller shafts; suspension parts for aircraft, namely, equalizers; suspension parts for ships, namely, equalizers; suspension parts for railway cars, namely, equalizers; suspension parts for bicycles, namely, equalizers; suspension parts for land vehicles, namely, equalizers; suspension parts for land vehicles, namely, coil springs, leaf springs, equalizers, torsion bars, sway bars; air springs for land vehicle suspension; suspension parts for land vehicles, namely, suspension members, suspension arms, tie rods, vehicle suspension springs, rubber bushes, shock absorbers, suspension mounts, stabilizer kits comprising stabilizers, and ball joints; bushings for vehicles, namely, bushings for transmission shift cables for land vehicles; power trim bushings for vehicles; chassis bushings for vehicles; vibration absorbing and isolating bushings for vehicles; Insulator bushings, centering bushings for propeller shafts, bushings for stabilizer links, bushings for shift levers, bushings for electric power steering dampers; bearings, as parts of land vehicles; clutches for land vehicles; gears for vehicles; transmission belts for land vehicles; suspension shock absorbers for vehicles Rubber, raw or semi-worked; Raw gutta-percha; Semi-worked gutta-percha; Gum, raw or semi-worked; plastics in extruded form for use in further manufacturing; packing and insulating material; Packing and insulating materials; stopping materials, namely, caulking materials; stopping materials, namely, fire-stop caulking materials; stopping materials for impact absorption, vibration damping, and soundproofing; flexible pipes, not of metal; acrylic resins, semi-processed; adhesive bands other than for stationery and not for medical or household purposes; tinted plastic film for use on windows; floating anti-pollution barriers; asbestos cloth; asbestos coverings in the nature of asbestos cloths and sheets; asbestos fabrics; asbestos felt; asbestos millboards; asbestos packing; asbestos paper; asbestos safety curtains; asbestos sheets; asbestos slate; bags of rubber for packaging; envelopes of rubber for packaging; rubber pouches for merchandise packaging; balata; rubber bands for commercial and industrial uses, namely, rubber bands for unscrewing jar lids; bark coverings for sound insulation; boiler composition to prevent the radiation of heat; brake lining materials, namely, semi-processed brake lining materials; semi- worked synthetic plastic and synthetic resins as semi-finished products in form of pellets, rods, foils, foams, fibers, films and sheets; sealing, packing and insulation material; non-metallic flexible tubes; Gaskets for industrial use; Gaskets made of rubber; Gaskets for heat exchangers; dust proofing seals; o-rings; dust proofing covers for surface lubrication, preventing the leakage of grease and the intrusion of water and muddy water; damping material in the nature of insulating materials; films and sheets made from plastic, polymers, semi-processed plastic, resin, epoxy resin, thermoset, and thermoplastics for use in the manufacture of circuit boards; sheets of rubber or rubber with a copper material for use as gaskets in electronics; non-metal sealing rings for use as connection seals; non-metal seals for use in electronics; packing, cushioning, and stuffing materials of rubber or plastics; sealing and insulating materials; waterproof packings for use in electronics; plastic substances, semi-processed; plastic film for packing and stuffing; plastic film, other than for wrapping, namely, plastic film for waterproofing and electrical insulation; plastic film, other than for wrapping, namely, plastic film for use in the manufacture of appliances and furniture; synthetic plastic as semi-finished products in form of foils, plates, rods, profiles, hoses, tubes, blocks, flakes, pellets, nodules, cloth chips, granules, and glass chips; synthetic rubber; synthetic resins, semi-processed; cylinder jointings being joint sealants; cylinder jointings, namely, pipe jointing compounds; ebonite; semi-processed films and foams of plastic in the nature of filtering materials in water filters as parts of domestic or commercial installations, water distribution devices for aquariums, water supply purification apparatus, sewage treatment plants; joint packings for pipes; connecting hoses for vehicle radiators

20.

MEKTEC HYBRID FPC

      
Numéro de série 99199078
Statut En instance
Date de dépôt 2025-05-23
Propriétaire MEKTEC CORPORATION (Japon)
Classes de Nice  ?
  • 07 - Machines et machines-outils
  • 09 - Appareils et instruments scientifiques et électriques
  • 12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules
  • 17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler

Produits et services

Machines and machine tools for the cutting and forming of materials; motors, except for land vehicles; machine coupling, except for land vehicles; machine belts, except for land vehicles; incubators for eggs; Agricultural machines, namely, cultivators, harvestors, disk harrows, seeders, cultipackers, tilling machines, planters, Plows, hoppers; Agricultural implements, namely, coulters, hay balers, incorporators, seed drills; construction machines, namely, concrete construction machines, road construction machines, bulldozers, hydraulic and trench excavators, asphalt paving machines, concrete paving machines, drilling machines, rock drilling machines, and road sweeping machines; engines, except for land vehicles; Machine parts, namely, joints for connecting sliding strips, plates and guides, and universal joints, namely, Cardan joints not for land vehicles; transmission components, except for land vehicles; vending machines; Mechanical engine parts for automobiles; ball bearings for use in machines, namely, agricultural machinery, construction machines, engines, industrial machines, motors; roller bearings for machines; exhaust pipes for land vehicles; transmission belts, other than for land vehicles Flexible printed circuits; computer keyboard controllers; switches, electric; capacitors; electrical power distribution units, namely, busbars; electronic connectors; electric power distribution machines and apparatus; keyboards, namely, computer keyboards; printed circuit boards; electronic materials testing instruments and machines for drive technology for vehicles, air travel and railway engineering; Flexible printed circuit board; scientific apparatus and instruments, namely, ultra-high vacuum chambers; nautical and photographic apparatus and instruments, namely, underwater housings for cameras, underwater enclosures for cameras and underwater enclosures for photographic lenses; surveying apparatus and instruments; cinematographic apparatus and instruments, namely, cinematographic cameras; optical apparatus and instruments, namely, eyeglass lenses; weighing apparatus and instruments; measuring apparatus and instruments, namely, angle finders; signaling apparatus and instruments, namely, signaling lights; checking apparatus, namely, apparatus for checking flight parameters; teaching apparatus and instruments, namely, teaching robots; apparatus for recording, transmission or reproduction of sound or images; mechanisms for coin-operated apparatus; cash registers; calculating machines; data processing equipment; computers; fire-extinguishing apparatus; electric circuits; rectifiers; electronic components, namely, piezoelectric switches; Electronic components for computers; Electronic components for juke boxes; Audio electronic components, namely, surround sound systems; Electronic components in the nature of infrared detectors for use in further manufacture; apparatus and instruments for conducting, transforming, accumulating, regulating or controlling the distribution or use of electricity; recorded and downloadable media, namely, typeface fonts recorded on magnetic media; blank magnetic recording media in the nature of blank electronic storage media and blank digital storage media, for recording sounds or images; acoustic disks, namely, compact disks featuring music; acoustic disks featuring information on the use of equipment in the field of space and information technology; blank acoustic disks, namely, blank audio disks and blank optical disk; blank compact disks; blank recordable DVDs; data processing apparatus; printed circuits; multilayer flexible printed circuit boards; printed circuits, namely, multilayer circuits and surface mount device boards; computer chips; Sensor chips for scientific use; DNA chips; Silicon chips; integrated circuits; integrated circuit cards; blank smart cards; electronic controllers for automobiles Two-wheeled motor vehicles; bicycles and their structural parts and fittings; automobiles and their structural parts and fittings; aircraft and their structural parts and fittings; vessels and their structural parts and fittings; railway rolling stock and their structural parts and fittings; motors for land vehicles; plastic parts for vehicles, namely, automotive exterior and interior plastic extruded decorative and protective trim, column switches, shift levers, door knobs, ADAS sensors, battery voltage monitoring, and lighting; engines for automobiles; transmission parts for automobiles, namely, transmission chains for land vehicles; land vehicle transmission parts, namely, gears, shafts, retainers, housings, forks, synchronizer assemblies and rings; land vehicle transmission parts, namely, valve bodies; suspension parts for automobiles, namely, suspension struts; Land vehicle suspension parts, namely, torsion/sway bars; land vehicle suspension parts, namely, coil springs; engines for land vehicles, namely, engines for railway cars; engines for two-wheeled motor vehicles; engines for land vehicles; transmission parts for land vehicles being railway cars, namely, transmission chains, force transmission cables; transmission parts for land vehicles being bicycles, namely, transmission chains; transmission parts for land vehicles, namely, transmission chains; power transmission parts for land vehicles in the nature of transmission cases for land vehicles; Transmission parts for land vehicles, namely, transmission drive shafts, transmission half shafts, and transmission propeller shafts; suspension parts for aircraft, namely, equalizers; suspension parts for ships, namely, equalizers; suspension parts for railway cars, namely, equalizers; suspension parts for bicycles, namely, equalizers; suspension parts for land vehicles, namely, equalizers; suspension parts for land vehicles, namely, coil springs, leaf springs, equalizers, torsion bars, sway bars; air springs for land vehicle suspension; suspension parts for land vehicles, namely, suspension members, suspension arms, tie rods, vehicle suspension springs, rubber bushes, shock absorbers, suspension mounts, stabilizer kits comprising stabilizers, and ball joints; bushings for vehicles, namely, bushings for transmission shift cables for land vehicles; power trim bushings for vehicles; chassis bushings for vehicles; vibration absorbing and isolating bushings for vehicles; Insulator bushings, centering bushings for propeller shafts, bushings for stabilizer links, bushings for shift levers, bushings for electric power steering dampers; bearings, as parts of land vehicles; clutches for land vehicles; gears for vehicles; transmission belts for land vehicles; suspension shock absorbers for vehicles Rubber, raw or semi-worked; Raw gutta-percha; Semi-worked gutta-percha; Gum, raw or semi-worked; plastics in extruded form for use in further manufacturing; packing and insulating material; Packing and insulating materials; stopping materials, namely, caulking materials; stopping materials, namely, fire-stop caulking materials; stopping materials for impact absorption, vibration damping, and soundproofing; flexible pipes, not of metal; acrylic resins, semi-processed; adhesive bands other than for stationery and not for medical or household purposes; tinted plastic film for use on windows; floating anti-pollution barriers; asbestos cloth; asbestos coverings in the nature of asbestos cloths and sheets; asbestos fabrics; asbestos felt; asbestos millboards; asbestos packing; asbestos paper; asbestos safety curtains; asbestos sheets; asbestos slate; bags of rubber for packaging; envelopes of rubber for packaging; rubber pouches for merchandise packaging; balata; rubber bands for commercial and industrial uses, namely, rubber bands for unscrewing jar lids; bark coverings for sound insulation; boiler composition to prevent the radiation of heat; brake lining materials, namely, semi-processed brake lining materials; semi- worked synthetic plastic and synthetic resins as semi-finished products in form of pellets, rods, foils, foams, fibers, films and sheets; sealing, packing and insulation material; non-metallic flexible tubes; Gaskets for industrial use; Gaskets made of rubber; Gaskets for heat exchangers; dust proofing seals; o-rings; dust proofing covers for surface lubrication, preventing the leakage of grease and the intrusion of water and muddy water; damping material in the nature of insulating materials; films and sheets made from plastic, polymers, semi-processed plastic, resin, epoxy resin, thermoset, and thermoplastics for use in the manufacture of circuit boards; sheets of rubber or rubber with a copper material for use as gaskets in electronics; non-metal sealing rings for use as connection seals; non-metal seals for use in electronics; packing, cushioning, and stuffing materials of rubber or plastics; sealing and insulating materials; waterproof packings for use in electronics; plastic substances, semi-processed; plastic film for packing and stuffing; plastic film, other than for wrapping, namely, plastic film for waterproofing and electrical insulation; plastic film, other than for wrapping, namely, plastic film for use in the manufacture of appliances and furniture; synthetic plastic as semi-finished products in form of foils, plates, rods, profiles, hoses, tubes, blocks, flakes, pellets, nodules, cloth chips, granules, and glass chips; synthetic rubber; synthetic resins, semi-processed; cylinder jointings being joint sealants; cylinder jointings, namely, pipe jointing compounds; ebonite; semi-processed films and foams of plastic in the nature of filtering materials in water filters as parts of domestic or commercial installations, water distribution devices for aquariums, water supply purification apparatus, sewage treatment plants; joint packings for pipes; connecting hoses for vehicle radiators

21.

FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEXIBLE TRANSPARENT WIRING BOARD

      
Numéro d'application 18738547
Statut En instance
Date de dépôt 2024-06-10
Date de la première publication 2025-02-13
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Nakamura, Akihiro
  • Bushimata, Masahiro

Abrégé

Provided is a flexible transparent wiring board which includes a base substrate, and wiring, in which the base substrate is transparent and has flexibility and insulating properties, a groove is formed on an upper surface of the base substrate, the wiring is formed of a wiring constituent material filled in the groove, and the groove is formed in a narrow V-shape in a depth direction.

Classes IPC  ?

  • H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
  • H05K 1/03 - Emploi de matériaux pour réaliser le substrat
  • H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
  • H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
  • H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés

22.

EXTENSIBLE WIRING BOARD AND CURRENT SUPPLY DEVICE

      
Numéro d'application JP2023027963
Numéro de publication 2025/027749
Statut Délivré - en vigueur
Date de dépôt 2023-07-31
Date de publication 2025-02-06
Propriétaire
  • YA-MAN LTD. (Japon)
  • MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Fukui, Soichiro
  • Shiokawa, Daisuke
  • Ida, Masashi
  • Tabata, Miho
  • Ohdate, Hirokazu
  • Iwase, Masayuki

Abrégé

[Problem] To provide: an extensible wiring board which has a simple configuration and with which reliable mechanical connection and electrical connection with a device body can be established; and a current supply device comprising the extensible wiring board. [Solution] According to one embodiment of the present invention, an extensible wiring board is provided. The extensible wiring board comprises: an extensible sheet; an extensible conductive layer; an external terminal; a first reinforcing part; and a second reinforcing part. The extensible sheet has an opening which penetrates in the thickness direction thereof. The extensible conductive layer is supported by the extensible sheet. The external terminal is electrically connected to the extensible conductive layer and is inserted into the opening. At least a portion of the first reinforcing part is disposed on one surface side of the extensible conductive layer, and at least a portion of the second reinforcing part is disposed on the other surface side of the extensible conductive layer. The first and second reinforcing parts are configured to hold the external terminal therebetween and reinforce at least a portion around the external terminal of the extensible conductive layer.

Classes IPC  ?

23.

WIRING UNIT

      
Numéro d'application 18736466
Statut En instance
Date de dépôt 2024-06-06
Date de la première publication 2025-01-09
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Ono, Tasuku
  • Kanayama, Tomoki

Abrégé

Provided is a wiring unit including a flexible printed circuit board having a first surface and a second surface, a connector, a holding member, and a cover, the flexible printed circuit board has wirings; the connector has a housing case and terminals, the connector is connected to the first surface at one end side in a longitudinal direction of the flexible printed circuit board, the terminals are connected to the wirings on the other end side in the longitudinal direction from the housing case; the holding member is provided to hold the flexible printed circuit board on the second surface; the holding member has a recess on the other end side in the longitudinal direction from the terminals, and the cover has a pressing portion to press and make a part of the flexible printed circuit board enter the recess.

Classes IPC  ?

  • H01R 12/77 - Dispositifs de couplage pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires
  • H01R 13/422 - Fixation de manière démontable sur un socle ou dans un boîtier flexible en une seule pièceSocle ou boîtier en une seule pièce comportant des moyens de verrouillage élastiques
  • H01R 13/50 - SoclesBoîtiers formés comme un corps intégré
  • H01R 13/52 - Boîtiers protégés contre la poussière, les projections, les éclaboussures, l'eau ou les flammes

24.

Biological information acquisition system and electrode sheet

      
Numéro d'application 18256008
Numéro de brevet 12569179
Statut Délivré - en vigueur
Date de dépôt 2022-10-14
Date de la première publication 2024-11-07
Date d'octroi 2026-03-10
Propriétaire
  • HOSEI UNIVERSITY (Japon)
  • MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Nakamura, Sousuke
  • Iwase, Masayuki

Abrégé

Provided is a biological information acquisition system capable of acquiring an electric parameter and biological information that are more accurate. A biological information acquisition system 200 includes a flexible electrode sheet 100 having multiple electrodes 30 arranged in an array, an electrode selector that acquires an electric parameter from the multiple electrodes 30 in a state in which the electrode sheet 100 is arranged along a biological body 300 such that the multiple electrodes 30 do not contact the biological body 300 to select the electrodes 30 to be used for acquisition of biological information based on the acquired electric parameter, and a biological information acquirer that acquires the biological information from the electrodes 30 selected by the electrode selector in a state in which the electrode sheet 100 is arranged along the biological body 300 such that the multiple electrodes 30 do not contact the biological body 300.

Classes IPC  ?

  • A61B 5/282 - Supports pour électrodes multiples
  • A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
  • A61B 5/11 - Mesure du mouvement du corps entier ou de parties de celui-ci, p. ex. tremblement de la tête ou des mains ou mobilité d'un membre
  • A61B 5/26 - Électrodes bioélectriques à cet effet les sujets eux-mêmes maintenant les électrodes en contact avec le corps, p. ex. en appuyant de leur corps sur les électrodes ou en saisissant les électrodes
  • A61B 5/277 - Électrodes capacitives
  • A61B 5/304 - Circuits de commutation

25.

Component mounting board

      
Numéro d'application 18569583
Numéro de brevet 12713529
Statut Délivré - en vigueur
Date de dépôt 2022-10-05
Date de la première publication 2024-08-29
Date d'octroi 2026-08-18
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Tominaga, Azumi

Abrégé

Provided is a component mount board having such a structure that a state of a component mount board being soaked in liquid can be more reliably sensed. A component mount board 100 includes a sheet-shaped moisture detection sensor 90. The moisture detection sensor 90 includes: a board 10 having a base 11, a first conductive pattern 30 formed on the base 11, and a mount component 50 electrically connected to the first conductive pattern 30; and a second conductive pattern 40 forming a circuit 60 together with the first conductive pattern 30 in a complementary manner. A portion of the base 11 corresponding to the second conductive pattern 40 is a missing portion 12. The component mount board 100 further includes a water-absorption expansion material 70. When expanding by water absorption, the water-absorption expansion material 70 presses the base 11 or the second conductive pattern 40 in a direction perpendicular to the plane of the base 11 to break the second conductive pattern 40.

Classes IPC  ?

  • H05K 1/05 - Substrat en métal isolé
  • H05K 1/02 - Circuits imprimés Détails
  • H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur

26.

BATTERY AND FLEXIBLE PRINTED CIRCUIT BOARD

      
Numéro d'application 18444608
Statut En instance
Date de dépôt 2024-02-16
Date de la première publication 2024-08-22
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Nakayama, Kenichi
  • Yamada, Shuzo
  • Kanayama, Tomoki

Abrégé

A battery includes a cell and a flexible printed circuit board to which a temperature measurement element that measures the temperature of the cell is connected. The flexible printed circuit board includes a first flexible printed circuit board portion to which a connector is connected, and a second flexible printed circuit board portion provided through a branch portion branched from the first flexible printed circuit board portion. The first flexible printed circuit board portion is provided with a first temperature measurement element arranged on one surface side of the cell to measure the temperature of one surface of the cell. The second flexible printed circuit board portion is provided with a second temperature measurement element arranged on an other surface side of the cell to measure the temperature of an other surface of the cell.

Classes IPC  ?

  • H01M 10/42 - Procédés ou dispositions pour assurer le fonctionnement ou l'entretien des éléments secondaires ou des demi-éléments secondaires
  • H01M 10/48 - Accumulateurs combinés à des dispositions pour mesurer, tester ou indiquer l'état des éléments, p. ex. le niveau ou la densité de l'électrolyte
  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/14 - Association structurale de plusieurs circuits imprimés

27.

Flexible printed circuit connection structure

      
Numéro d'application 18481982
Numéro de brevet 12562518
Statut Délivré - en vigueur
Date de dépôt 2023-10-05
Date de la première publication 2024-07-11
Date d'octroi 2026-02-24
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Yamada, Shuzo
  • Nakayama, Kenichi
  • Kanayama, Tomoki

Abrégé

Provided is a flexible printed circuit connection structure which includes a flexible printed circuit having a plurality of wires, a board to be connected having a plurality of wires to be connected, a plurality of solder connection portions, and a partition wall, in which: the plurality of solder connection portions is a part where the plurality of wires of the flexible printed circuit and the plurality of wires to be connected of the board to be connected are connected to each other by solder; the partition wall is provided away from the plurality of solder connection portions so as to surround the plurality of solder connection portions; and the flexible printed circuit, the board to be connected, and the partition wall define a sealed space, and the plurality of solder connection portions is arranged inside the sealed space.

Classes IPC  ?

  • H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
  • H01R 12/61 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires se raccordant à des circuits imprimés flexibles, à des câbles plats ou à rubans ou à des structures similaires

28.

Component mounting substrate

      
Numéro d'application 18557526
Numéro de brevet 12628675
Statut Délivré - en vigueur
Date de dépôt 2022-10-05
Date de la première publication 2024-06-27
Date d'octroi 2026-05-12
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Tominaga, Azumi

Abrégé

Provided is a component mount board having a structure capable of more reliably sensing a state of the component mount board being soaked in liquid. A component mount board 100 includes a board 10 having a base 11, a first conductive pattern 30 formed on the base 11, and a mount component 50 electrically connected to the first conductive pattern 30 and a second conductive pattern 40 forming a circuit 60 together with the first conductive pattern 30 in a complementary manner. A portion of the base 11 corresponding to the second conductive pattern 40 is a missing portion 12 where the base 11 is missing. The second conductive pattern 40 is soluble in liquid, or is weakened when becoming wet with liquid.

Classes IPC  ?

29.

Connector-equipped flexible printed circuit board

      
Numéro d'application 18481690
Numéro de brevet 12627088
Statut Délivré - en vigueur
Date de dépôt 2023-10-05
Date de la première publication 2024-06-27
Date d'octroi 2026-05-12
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Yamada, Shuzo
  • Kanayama, Tomoki
  • Ono, Tasuku

Abrégé

A connector-equipped flexible printed circuit board includes: a flexible printed circuit board; a connector having a terminal to be connected to a line provided for the flexible printed circuit board and joined to the flexible printed circuit board; and a reinforcing plate fixed to a surface of the flexible printed circuit board opposite to a portion joined to the connector, in which the connector has a joint protrusion configured to penetrate the flexible printed circuit board, and a stopper structure that restricts movement of the connector in a direction apart from the flexible printed circuit board is provided in addition to joint between the line and the terminal and the joint protrusion.

Classes IPC  ?

  • H01R 12/77 - Dispositifs de couplage pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires
  • H01R 12/70 - Dispositifs de couplage
  • H05K 1/189 -

30.

MEK

      
Numéro de série 98617967
Statut Enregistrée
Date de dépôt 2024-06-25
Date d'enregistrement 2026-04-21
Propriétaire MEKTEC CORPORATION (Japon)
Classes de Nice  ?
  • 09 - Appareils et instruments scientifiques et électriques
  • 12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules
  • 17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler

Produits et services

Flexible printed circuits; computer keyboard controllers; switches, electric; capacitors; electrical power distribution units, namely, busbars; electronic connectors; electric power distribution machines and apparatus; keyboards, namely, computer keyboards; printed circuit boards; electronic materials testing instruments and machines for drive technology for vehicles, air travel and railway engineering; flexible printed circuit board; scientific apparatus and instruments, namely, ultra-high vacuum chambers; nautical and photographic apparatus and instruments, namely, underwater housings for cameras, underwater enclosures for cameras and underwater enclosures for photographic lenses; surveying apparatus and instruments; cinematographic apparatus and instruments, namely, cinematographic cameras; optical apparatus and instruments, namely, eyeglass lenses; weighing apparatus and instruments; measuring apparatus and instruments, namely, angle finders; signaling apparatus and instruments, namely, signaling lights; checking apparatus, namely, apparatus for checking flight parameters; teaching apparatus and instruments, namely, teaching robots; apparatus for recording, transmission or reproduction of sound or images; mechanisms for coin-operated apparatus; cash registers; calculating machines; data processing equipment; computers; fire-extinguishing apparatus; electric circuits; rectifiers; electronic components, namely, piezoelectric switches; electronic components for computers; electronic components for juke boxes; audio electronic components, namely, surround sound systems; electronic components in the nature of infrared detectors for use in further manufacture; apparatus and instruments for conducting, transforming, accumulating, regulating or controlling the distribution or use of electricity; recorded and downloadable media, namely, typeface fonts recorded on magnetic media; blank magnetic recording media in the nature of blank electronic storage media and blank digital storage media, for recording sounds or images; acoustic disks, namely, compact disks featuring music; acoustic disks featuring information on the use of equipment in the field of space and information technology; blank acoustic disks, namely, blank audio disks and blank optical disk; blank compact disks; blank recordable DVDs; data processing apparatus; flexible printed circuits; printed circuits; multilayer flexible printed circuit boards; printed circuits, namely, multilayer circuits and surface mount device boards; computer chips; sensor chips for scientific use; DNA chips; silicon chips; integrated circuits; integrated circuit cards; blank smart cards; electronic controllers for automobiles Two-wheeled motor vehicles; bicycles and their structural parts and fittings; automobiles and their structural parts and fittings; aircraft and their structural parts and fittings; vessels and their structural parts and fittings; railway rolling stock and their structural parts and fittings; motors for land vehicles; plastic parts for vehicles, namely, automotive exterior and interior plastic extruded decorative and protective trim, column switches, shift levers, door knobs, ADAS sensors, battery voltage monitoring, and lighting; engines for automobiles; transmission parts for automobiles, namely, transmission chains for land vehicles; land vehicle transmission parts, namely, gears, shafts, retainers, housings, forks, synchronizer assemblies and rings; land vehicle transmission parts, namely, valve bodies; suspension parts for automobiles, namely, suspension struts; land vehicle suspension parts, namely, torsion/sway bars; land vehicle suspension parts, namely, coil springs; engines for land vehicles, namely, engines for railway cars; engines for two-wheeled motor vehicles; engines for land vehicles; transmission parts for land vehicles being railway cars, namely, transmission chains, force transmission cables; transmission parts for land vehicles being bicycles, namely, transmission chains; transmission parts for land vehicles, namely, transmission chains; power transmission parts for land vehicles in the nature of transmission cases for land vehicles; transmission parts for land vehicles, namely, transmission drive shafts, transmission half shafts, and transmission propeller shafts; suspension parts for aircraft, namely, equalizers; suspension parts for ships, namely, equalizers; suspension parts for railway cars, namely, equalizers; suspension parts for bicycles, namely, equalizers; suspension parts for land vehicles, namely, equalizers; suspension parts for land vehicles, namely, coil springs, leaf springs, equalizers, torsion bars, sway bars; air springs for land vehicle suspension; suspension parts for land vehicles, namely, suspension members, suspension arms, tie rods, vehicle suspension springs, rubber bushes, shock absorbers, suspension mounts, stabilizer kits comprising stabilizers, and ball joints; bushings for vehicles, namely, bushings for transmission shift cables for land vehicles; power trim bushings for vehicles; chassis bushings for vehicles; vibration absorbing and isolating bushings for vehicles; insulator bushings, centering bushings for propeller shafts, bushings for stabilizer links, bushings for shift levers, bushings for electric power steering dampers; bearings, as parts of land vehicles; clutches for land vehicles; gears for vehicles; transmission belts for land vehicles; suspension shock absorbers for vehicles Rubber, raw or semi-worked; raw gutta-percha; semi-worked gutta-percha; gum, raw or semi-worked; plastics in extruded form for use in further manufacturing; packing and insulating material; packing and insulating materials; stopping materials, namely, caulking materials; stopping materials, namely, fire-stop caulking materials; stopping materials for impact absorption, vibration damping, and soundproofing, namely, rubber stoppers for industrial packaging containers; flexible pipes, not of metal; acrylic resins, semi-processed; adhesive bands other than for stationery and not for medical or household purposes; tinted plastic film for use on windows; floating anti-pollution barriers; asbestos cloth; asbestos coverings in the nature of asbestos cloths and sheets; asbestos fabrics; asbestos felt; asbestos millboards; asbestos packing; asbestos paper; asbestos safety curtains; asbestos sheets; asbestos slate; bags of rubber for packaging; envelopes of rubber for packaging; rubber pouches for merchandise packaging; balata; rubber bands for commercial and industrial uses, namely, rubber bands for unscrewing jar lids; bark coverings for sound insulation; boiler composition to prevent the radiation of heat; brake lining materials, namely, semi-processed brake lining materials; semi-worked synthetic plastic and synthetic resins as semi-finished products in form of pellets, rods, foils, foams, fibers, films and sheets; sealing, packing and insulation material; non-metallic flexible tubes; gaskets for industrial use; gaskets made of rubber; gaskets for heat exchangers; dust proofing seals; o-rings; dust proofing covers of plastic or rubber for surface lubrication, preventing the leakage of grease and the intrusion of water and muddy water; damping material in the nature of insulating materials; films and sheets made from plastic, polymers, semi-processed plastic, resin, epoxy resin, thermoset, and thermoplastics for use in the manufacture of circuit boards; sheets of rubber or rubber with a copper material for use as gaskets in electronics; non-metal sealing rings for use as connection seals; non-metal seals for use in electronics; packing, cushioning, and stuffing materials of rubber or plastics; sealing and insulating materials; waterproof packings for use in electronics; plastic substances, semi-processed; plastic film for packing and stuffing; plastic film, other than for wrapping, namely, plastic film for waterproofing and electrical insulation; plastic film, other than for wrapping, namely, plastic film for use in the manufacture of appliances and furniture; synthetic plastic as semi-finished products in form of foils, plates, rods, profiles, hoses, tubes, blocks, flakes, pellets, nodules, cloth chips, granules, and glass chips; synthetic rubber; rubber, raw or semi-worked; synthetic resins, semi-processed; cylinder jointings being joint sealants; cylinder jointings, namely, pipe jointing compounds; ebonite; semi-processed films and foams of plastic in the nature of filtering materials in water filters as parts of domestic or commercial installations, water distribution devices for aquariums, water supply purification apparatus, sewage treatment plants; joint packings for pipes; connecting hoses for vehicle radiators

31.

Electronic equipment sealing structure and method for manufacturing the same

      
Numéro d'application 18510566
Numéro de brevet 12588153
Statut Délivré - en vigueur
Date de dépôt 2023-11-15
Date de la première publication 2024-06-20
Date d'octroi 2026-03-24
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Iwaki, Hirokazu

Abrégé

Provided is an electronic equipment sealing structure that includes a case, a flexible printed circuit board, and an adhesive layer, in which the case includes a case body, an opening provided in the case body, and a pair of thin plate portions having flexibility; part of the flexible printed circuit board is inserted into the case body through the opening; one thin plate portion and the other thin plate portion of the pair of thin plate portions are provided along the opening so as to face each of first and second surfaces of the flexible printed circuit board; and the adhesive layer is provided so as to close a clearance between an inner wall surface of the opening and the flexible printed circuit board.

Classes IPC  ?

  • H05K 5/00 - Enveloppes, coffrets ou tiroirs pour appareils électriques

32.

Miscellaneous Design

      
Numéro d'application 019040810
Statut Enregistrée
Date de dépôt 2024-06-13
Date d'enregistrement 2025-05-17
Propriétaire MEKTEC CORPORATION (Japon)
Classes de Nice  ?
  • 07 - Machines et machines-outils
  • 09 - Appareils et instruments scientifiques et électriques
  • 12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules
  • 17 - Produits en caoutchouc ou en matières plastiques; matières à calfeutrer et à isoler

Produits et services

Machine tools; motors, except for land vehicles; machine coupling, except for land vehicles; machine belts, except for land vehicles; incubators for eggs; agricultural machines and implements; construction machines; engines, except for land vehicles; joints, except those for land vehicles; transmission components, except for land vehicles; vending machines; engine parts for automobiles; ball bearings; roller bearings; exhaust pipes for land vehicles; transmission belts, other than for land vehicles; engines for aircraft; transmission parts for aircraft; transmission parts for ships. Flexible printed circuits; keyboard controllers; switches, electric; capacitors; power distribution machines; panel keyboard; printed circuit board; materials testing instruments and machines; flexible printed circuit board; scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking [supervision], life-saving and teaching apparatus and instruments; apparatus for recording, transmission or reproduction of sound or images; mechanisms for coin-operated apparatus; cash registers; calculating machines; data processing equipment; computers; fire-extinguishing apparatus; Electric circuits; rectifiers; apparatus and instruments for conducting, distributing, transforming, accumulating, regulating or controlling electricity; magnetic recording media; acoustic disks; compact disks, DVDs and other digital recording media; computer software; data processing apparatus and computers; flexible circuits; printed circuits; Multilayer flexible printed circuit boards; multilayer circuits and surface mount device boards; Chips [integrated circuits]; Integrated circuits; Integrated circuit cards [smart cards]; electronic controllers for automobiles; none of the aforesaid for ducting electric cables. Two-wheeled motor vehicles, bicycles and their parts and fittings; automobiles and their parts and fittings; aircraft and their parts and fittings; vessels and their parts and fittings; railway rolling stock and their parts and fittings; motors for land vehicles; Plastic products and technical products for vehicles, namely, parts and fittings for vehicles, of plastic, internal fittings parts for vehicles, of plastic, transmission components for vehicles, of plastic, structural parts for vehicles, of plastic, transmission mechanisms for vehicles, of plastic; Engines for automobiles; transmission parts for automobiles; suspension parts for automobiles; engines for railway cars; engines for two-wheeled motor vehicles; engines for land vehicles; transmission parts for railway cars; transmission parts for bicycles; transmission parts for vehicles; suspension parts for aircraft; suspension parts for ships; suspension parts for railway cars; suspension parts for bicycles; suspension parts for vehicles; bushings for vehicles; bearings, machine elements for land vehicles; clutches for land vehicles; gears for vehicles; transmission belts for land vehicles; shock absorbers for vehicles; dust covers of plastic or rubber for automobile parts. Rubber, gutta-percha, gum, asbestos and mica; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; Flexible pipes, not of metal; acrylic resins, semi-finished products; adhesive bands other than stationery and not for medical or household purposes; anti-dazzle films for windows [tinted films]; floating Anti-pollution barriers; asbestos cloth; asbestos coverings; asbestos fabrics; asbestos felt; asbestos mill boards; asbestos packing; asbestos paper; asbestos safety curtains; asbestos sheets; asbestos slate; bags [envelopes, pouches] of rubber, for packaging; balata; bands of rubber for unscrewing jar lids; bark coverings for sound insulation; boiler composition to prevent the radiation of heat; brake lining materials; semi-processed plastics; sealing, packing and insulation material; non-metallic flexible tubes; gaskets; dust proofing seals; o-rings; anti-vibration rubbers used for anti-vibration dampers and mounts for land vehicles, water vehicles, outboard motors, motors or machines; anti-vibration rubbers used in anti-vibration mounts for stepping motors, electrical equipment, and precision instruments; films and sheets made from plastic, polymers, semi-processed plastic, resin, epoxy resin, thermoset, and thermoplastics for use in the manufacture of circuit boards; gasket material in sheets for use in electronics; non-metal gaskets for use in electronics; non-metal sealing rings for use as connection seals; non-metal seals for use in electronics; packing, cushioning, and stuffing materials of rubber or plastics; sealing materials; insulating materials; waterproof packings for use in electronics; plastic substances, semi-processed; plastic film other than for wrapping; plastic semi-worked products; synthetic rubber; rubber, raw or semi-worked; synthetic resins, semi-finished products; cylinder jointings; ebonite (vulcanite); filtering materials of semi-processed films or foams of plastic; joint packings; connecting hoses for vehicle radiators.

33.

MEK

      
Numéro d'application 233211000
Statut En instance
Date de dépôt 2024-06-11
Propriétaire MEKTEC CORPORATION (Japon)
Classes de Nice  ?
  • 09 - Appareils et instruments scientifiques et électriques
  • 12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules

Produits et services

(1) Flexible printed circuits; computer keyboard controllers; switches, electric, namely, electric current switches, electric light switches, electric power switches, electric toggle switches, computer network switches; Capacitors; Busbars; electronic connectors, namely, connectors for electronic circuits, electronic connectors for circuit boards, electronic connectors for loud speakers, electronic connectors for video recorders; power distribution machines and apparatus, namely, distribution boxes for electrical power, electric power distribution units, power distribution boxes and panels; panel keyboard, namely, computer keyboards; printed circuit board; Materials testing instruments and machines, namely, driver systems for autonomous vehicles, integrated electronic driver assistance systems for land vehicles; Flexible printed circuit board; scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking, life-saving and teaching apparatus and instruments, namely, ultra-high vacuum chambers, camera housings, underwater housing for cameras, lenses for cameras, cinematographic cameras, eyeglass lenses, angle finders, rotating signalling lights, electric cables for the transmission of sounds and images, surveying instruments, inflatable devices for life-saving purposes, driver assistance systems for autonomous vehicles, including advanced driver assistance systems (ADAS) and battery monitoring devices for monitoring and tracking voltage, capacity, performance and cell status of automotive batteries; apparatus, namely, electric cables, optical fibers, hard disk drives, mobile phones, tablet computers, smartwatches, and personal digital assistants for recording, transmission and reproduction of sound and images; mechanisms for coin-operated vending machines; cash registers; calculating machines; computer hardware for data processing; computers; fire-extinguishing apparatus for automobiles; Electric circuits, namely, electric circuit closers, decision circuits, electronic circuits, integrated circuits; rectifiers; electronic components for integrated circuit cards, electrical and electronic components, namely, front-end modules; apparatus and instruments, namely, electrical conductor cables, distribution boxes for electrical power, electric transformers, electric accumulators for vehicles, and voltage regulators for electric power for conducting, distributing, transforming, accumulating, regulating and controlling electricity; magnetic recording media, namely, blank magnetic discs, magnetic tape recorders; acoustic disks, namely, compact discs featuring music; compact disks, DVDs and other digital recording media, namely, blank compact discs, blank DVDs, digital versatile disc recorders; computer software, namely, computer software for editing music and for editing digital audio recordings, computer software for use in integrated circuit design, computer software for database management; data processing apparatus, namely, computer printers, computer scanners, and computers; flexible printed circuits; printed circuits; Multilayer flexible printed circuit boards; multilayer circuits and surface mount device boards, namely, circuit boards, computer circuit boards, smartphones, electronic computers for use in motor vehicles; Chips, namely, integrated circuits, blank integrated circuit cards, encoded integrated circuit cards; Integrated circuits; Integrated circuit cards, namely, telephone smart cards, blank smart cards and encoded integrated circuit cards for use in hard disk drives and mobile devices; electronic controllers for automobiles (2) Two-wheeled motor vehicles, namely, motorcycles, bicycles and their parts and fittings; automobiles and their parts and fittings, namely, automobile tires, windscreens, wheel shields, brakes, doors, fenders, windows, steering column control switches, gear shift levers, and door handles; aircraft and their parts and fittings, namely, aircraft chassis, doors, panels, propellers, tires, steering systems; vessels in the forms of boats and ships and their parts and fittings, namely, electric steering gears, hatch covers, portholes, rudders, steering wheels for vessels; railway rolling stock and their parts and fittings; motors for land vehicles; plastic products and technical products for vehicles, namely, automotive exterior and interior plastic extruded decorative and protective trim, column switches being turn signals and windshield wipers, gear shift levers, door handles; Engines for automobiles; transmission parts for automobiles, namely, transmission belts, cases, chains, mechanisms and shafts for automobiles; suspension parts for automobiles, namely, suspension arms, stabilizer bushings, suspension spindles, coilovers, suspension springs, coil springs, suspension shock absorbers, struts, and suspension systems for automobiles; engines for railway cars; engines for two-wheeled motor vehicles; engines for land vehicles; transmission parts for aircraft, namely, gearboxes for aircraft; transmission parts for ships, namely, propeller shafts and gearboxes for ships; transmission parts for railway cars, namely, chains, and force transmission cables being a transmission mechanism for railway cars; transmission parts for bicycles, namely, transmission chains for bicycles; transmission parts for land vehicles, namely, transmission belts and chains for land vehicles; suspension parts for aircraft, namely, equalizers for aircraft; suspension parts for ships, namely, equalizers for ships; suspension parts for railway cars, namely, equalizers for railway cars; suspension parts for bicycles, namely, equalizers for bicycles; suspension parts for land vehicles, namely, equalizers for motor vehicles; stabilizer bushings for automobiles; bearings, machine elements for land vehicles, namely, axle bearings, roller bearings, and wheel bearings for land vehicles; clutches for land vehicles; gears for vehicles, namely, steering gears for ships, gears for bicycles, automobile gear sticks, drive gears; transmission belts for land vehicles; shock absorbers for vehicles

34.

Voltage monitoring module and battery unit

      
Numéro d'application 18480839
Numéro de brevet 12553952
Statut Délivré - en vigueur
Date de dépôt 2023-10-04
Date de la première publication 2024-06-06
Date d'octroi 2026-02-17
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Hosokawa, Takuya
  • Kiya, Kenji
  • Kanayama, Tomoki

Abrégé

A voltage monitoring module includes a flexible printed board including a plurality of wires, in which: the flexible printed board includes: a main body extending in a first direction; and a plurality of branch portions each branching off the main body, the plurality of branch portions being placed intermittently in the first direction, each of the branch portions includes, at a part on a distal end side thereof, a connection terminal to be connected to a cell terminal being a terminal of a battery cell of a battery pack having a plurality of the stacked battery cells, and among the plurality of branch portions, the branch portion located farther in the first direction from a reference position has a longer length dimension from a proximal end of the branch portion to the connection terminal.

Classes IPC  ?

  • G01R 31/3835 - Dispositions pour la surveillance de variables des batteries ou des accumulateurs, p. ex. état de charge ne faisant intervenir que des mesures de tension
  • G01R 31/396 - Acquisition ou traitement de données pour le test ou la surveillance d’éléments particuliers ou de groupes particuliers d’éléments dans une batterie

35.

Flexible printed board and flexible printed board connection structure

      
Numéro d'application 18481201
Numéro de brevet 12733096
Statut Délivré - en vigueur
Date de dépôt 2023-10-04
Date de la première publication 2024-05-30
Date d'octroi 2026-09-08
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Hirata, Masanori
  • Miyamoto, Garo
  • Aoyama, Shunsuke

Abrégé

Provided is a flexible printed board including: an insulating base material; a plurality of first wiring lines disposed on a front surface side of the base material; a plurality of first terminals each provided on an external connection side, of a respective one of the plurality of first wiring lines; a plurality of second wiring lines disposed on a rear surface side of the base material; and a plurality of second terminals each provided on an external connection side, of a respective one of the plurality of second wiring lines; in which: a restraining space for restraining surface flashover is provided from a first outermost terminal, which is outermost of the plurality of first terminals, through an edge portion of the base material, to a second outermost terminal, which is outermost of the plurality of second terminals.

Classes IPC  ?

  • H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/03 - Emploi de matériaux pour réaliser le substrat

36.

Component mount board

      
Numéro d'application 18468832
Numéro de brevet 12432857
Statut Délivré - en vigueur
Date de dépôt 2023-09-18
Date de la première publication 2024-05-23
Date d'octroi 2025-09-30
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Tominaga, Azumi

Abrégé

Provided is a component mount board which includes: a board having a base, a first conductive pattern, a mount component connected to the first conductive pattern, and a soluble layer; and a second conductive pattern, in which the soluble layer is soluble in liquid, and the second conductive pattern is soluble in liquid or is weakened when getting wet with liquid, the base has, in a portion of the base corresponding to the second conductive pattern, a first missing portion the first conductive pattern has a first portion and a second portion separated from the first portion through the first missing portion, the second conductive pattern connects, over the first missing portion, the first and second portions of the first conductive pattern to each other, and a portion of the second conductive pattern at least over the first missing portion is formed on a first surface of the soluble layer.

Classes IPC  ?

  • H05K 1/03 - Emploi de matériaux pour réaliser le substrat
  • H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
  • H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
  • H05K 3/28 - Application de revêtements de protection non métalliques
  • H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p. ex. avec une résistance

37.

Flexible Printed Wiring Board and Method for Manufacturing Same

      
Numéro d'application 18501237
Statut En instance
Date de dépôt 2023-11-03
Date de la première publication 2024-05-09
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Narisawa, Yoshihiko

Abrégé

A flexible printed wiring board according to an embodiment is a flexible printed wiring board having a bent region provided with air layers, including a signal line passing through the bent region; and ground layers provided in a layer different from the signal line via an insulating layer, in which the ground layers are not provided in at least a part of a portion overlapping the signal line in the bent region when the flexible printed wiring board is viewed in a thickness direction.

Classes IPC  ?

  • H05K 1/02 - Circuits imprimés Détails
  • H05K 3/46 - Fabrication de circuits multi-couches

38.

MEKTEC

      
Numéro d'application 231725100
Statut En instance
Date de dépôt 2024-03-21
Propriétaire MEKTEC CORPORATION (Japon)
Classes de Nice  ? 12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules

Produits et services

(1) Plastic products and technical products for vehicles; transmission parts for automobiles; bushings for vehicles; bearings, machine elements for land vehicles; clutches for land vehicles; gears for vehicles; transmission belts for land vehicles

39.

MEKTEC

      
Numéro d'application 019002511
Statut Enregistrée
Date de dépôt 2024-03-21
Date d'enregistrement 2024-10-08
Propriétaire MEKTEC CORPORATION (Japon)
Classes de Nice  ? 12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules

Produits et services

Plastic products and technical products for vehicles, namely parts and fittings for vehicles, of plastic; internal fittings parts for vehicles, of plastic; transmission components for vehicles, of plastic; structural parts for vehicles, of plastic; transmission mechanisms for vehicles, of plastic; transmission parts for automobiles; bushings for vehicles; bearings, machine elements for land vehicles; clutches for land vehicles; gears for vehicles; transmission belts for land vehicles.

40.

MEKTEC

      
Numéro de série 98460472
Statut Enregistrée
Date de dépôt 2024-03-21
Date d'enregistrement 2025-10-28
Propriétaire MEKTEC CORPORATION (Japon)
Classes de Nice  ? 12 - Véhicules; appareils de locomotion par terre, par air ou par eau; parties de véhicules

Produits et services

Plastic products for vehicles, namely, automotive exterior and interior plastic extruded decorative and protective trim; transmission parts for automobiles, namely, transmission chains, shafts and belts for land vehicles; bushings for vehicles, namely, bushings for transmission shift cables for land vehicles; wheel bearings for land vehicles; clutches for land vehicles; gears for vehicles; transmission belts for land vehicles

41.

Temperature measurement device for attachement to a housing, for example, a battery case

      
Numéro d'application 18364054
Numéro de brevet 12601639
Statut Délivré - en vigueur
Date de dépôt 2023-08-02
Date de la première publication 2024-02-29
Date d'octroi 2026-04-14
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Shirota, Katsuhito
  • Komuro, Yuki
  • Kanayama, Tomoki

Abrégé

Provided is a temperature measurement device including: a case; a flexible printed circuit board attached to the case; a pressing plate; and an elastic body, in which: the flexible printed circuit board includes a thermistor element region; the elastic body is interposed between the thermistor element region and the pressing plate; the pressing plate is configured to press the thermistor element region through the elastic body; the case has a through-hole; as viewed in a direction of pressing the thermistor element region by the pressing plate, the thermistor element region and the elastic body are positioned within an area where the through-hole is provided; and the thermistor element region is configured to protrude, through the through-hole, from an attachment surface side of the case attached to the flexible printed circuit board toward a surface side of the case opposite to the attachment surface side.

Classes IPC  ?

  • G01K 7/22 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs l'élément étant une résistance non linéaire, p. ex. une thermistance
  • G01K 1/08 - Dispositifs de protection, p. ex. étuis
  • G01K 1/14 - SupportsDispositifs de fixationDispositions pour le montage de thermomètres en des endroits particuliers
  • H01M 10/48 - Accumulateurs combinés à des dispositions pour mesurer, tester ou indiquer l'état des éléments, p. ex. le niveau ou la densité de l'électrolyte

42.

GASKET-EQUIPPED FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING GASKET-EQUIPPED FLEXIBLE PRINTED WIRING BOARD

      
Numéro d'application 18169103
Statut En instance
Date de dépôt 2023-02-14
Date de la première publication 2023-12-21
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Sasaki, Takashi
  • Inoue, Eiichi

Abrégé

Provided is a gasket-equipped flexible printed wiring board including: a flexible printed wiring board with a through-hole; and a gasket, in which the gasket is provided integrally with the flexible printed wiring board so as to embed a partial region of the flexible printed wiring board in such a manner that the gasket is molded on the flexible printed wiring board, which is an insert component, by insert molding, the gasket has a gate mark on a first end side of the flexible printed wiring board in a width direction thereof, and the through-hole is, within the partial region of the flexible printed wiring board, formed at a position closer to a second end side, which faces the first end side in the width direction, than to the first end side.

Classes IPC  ?

  • H01R 13/52 - Boîtiers protégés contre la poussière, les projections, les éclaboussures, l'eau ou les flammes
  • H01R 12/77 - Dispositifs de couplage pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires
  • H01R 43/24 - Assemblage par moulage sur les pièces de contact

43.

Temperature measurement device

      
Numéro d'application 18192901
Numéro de brevet 12546667
Statut Délivré - en vigueur
Date de dépôt 2023-03-30
Date de la première publication 2023-12-07
Date d'octroi 2026-02-10
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Tomita, Shunsuke
  • Nakayama, Kenichi
  • Kanayama, Tomoki

Abrégé

Provided is a temperature measurement device which includes: a case; a flexible printed circuit board; and a thermistor element mounting portion, the case integrally has a first case portion, a second case portion, and a holding portion; the flexible printed circuit board has a trunk and a branch divided from the trunk; the trunk is fixed to a first surface of the first case portion; the thermistor element mounting portion is arranged in the branch and is fixed to a first surface of the second case portion; the second case portion is folded such that a second surface of the first case portion and a second surface of the second case portion are in contact with each other; and the holding portion holds a part of the branch between a portion divided from the trunk and a portion where the thermistor element mounting portion is arranged.

Classes IPC  ?

  • G01K 7/22 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs l'élément étant une résistance non linéaire, p. ex. une thermistance
  • G01K 1/08 - Dispositifs de protection, p. ex. étuis
  • G01R 31/374 - Dispositions pour le test, la mesure ou la surveillance de l’état électrique d’accumulateurs ou de batteries, p. ex. de la capacité ou de l’état de charge avec des moyens pour corriger la mesure en fonction de la température ou du vieillissement
  • G01R 31/3835 - Dispositions pour la surveillance de variables des batteries ou des accumulateurs, p. ex. état de charge ne faisant intervenir que des mesures de tension

44.

Battery monitoring module and flexible printed wiring board

      
Numéro d'application 18186868
Numéro de brevet 12738547
Statut Délivré - en vigueur
Date de dépôt 2023-03-20
Date de la première publication 2023-12-07
Date d'octroi 2026-09-15
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Shirota, Katsuhito
  • Kanayama, Tomoki
  • Yamada, Shuzo

Abrégé

Provided is a flexible printed wiring board attached to a battery, including: multiple lines are provided only on one surface of the flexible printed wiring board, one end of a first line group and a second line group are respectively connected to one of multiple terminals of the battery, and the other end of the first line group is arranged in a bent portion, and the other end of the second line group and one end of a third line group are arranged at an end portion of a trunk portion, and the other end of the third line group is arranged in the trunk portion, and the bent portion is bent such that the other end of the first line group arranged in the bent portion and the other end of the third line group arranged in the trunk portion are connected to each other.

Classes IPC  ?

  • H01M 10/42 - Procédés ou dispositions pour assurer le fonctionnement ou l'entretien des éléments secondaires ou des demi-éléments secondaires
  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/03 - Emploi de matériaux pour réaliser le substrat

45.

Flexible printed wiring board and electric wiring

      
Numéro d'application 18177000
Numéro de brevet 12342459
Statut Délivré - en vigueur
Date de dépôt 2023-03-01
Date de la première publication 2023-11-02
Date d'octroi 2025-06-24
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Aoyama, Shunsuke
  • Hirata, Masanori

Abrégé

Provided is a flexible printed wiring board including: a base film which is an insulating layer; a first conductor layer; a second conductor layer; and a through-hole, in which the first conductor layer is provided on one surface of the base film, the second conductor layer is provided on the other surface of the base film, and the through-hole is provided so as to penetrate the base film and electrically connect the first conductor layer and the second conductor layer to each other, and the second conductor layer has a solderable region.

Classes IPC  ?

  • H01R 12/61 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires se raccordant à des circuits imprimés flexibles, à des câbles plats ou à rubans ou à des structures similaires
  • H01R 12/62 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires se raccordant à des circuits imprimés rigides ou à des structures similaires
  • H01R 12/63 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires se raccordant à des câbles d'une autre forme
  • H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
  • H01R 35/02 - Connecteurs de ligne flexibles

46.

Electricity storage module

      
Numéro d'application 18102441
Numéro de brevet 12683249
Statut Délivré - en vigueur
Date de dépôt 2023-01-27
Date de la première publication 2023-08-03
Date d'octroi 2026-07-14
Propriétaire
  • TOYOTA JIDOSHA KABUSHIKI KAISHA (Japon)
  • MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Ohira, Yuki
  • Tabara, Satoshi
  • Tomita, Shunsuke
  • Watanabe, Tsukasa

Abrégé

An electricity storage module includes a plurality of electricity storage cells, a plurality of resin frames, and a bus bar module. Each of the electricity storage cells includes a pair of external terminals. The bus bar module includes a plurality of bus bars and a bus bar case. The resin frame includes a retaining portion configured to retain the bus bar case. The bus bar case includes a retained portion that is configured to engage with the retaining portion, and a biasing portion that is configured to bias the bus bar toward a side of the retained portion, in a state in which the retained portion is engaged with the retaining portion.

Classes IPC  ?

  • H01M 50/507 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant un arrangement de plusieurs barres omnibus réunies dans une structure de conteneur, p. ex. modules de barres omnibus
  • H01M 50/202 - Boîtiers ou cadres autour du boîtier primaire d’une seule cellule ou d’une seule batterie

47.

Method for manufacturing printed circuit board with electronic component, and printed circuit board with electronic component

      
Numéro d'application 17835798
Numéro de brevet 12250777
Statut Délivré - en vigueur
Date de dépôt 2022-06-08
Date de la première publication 2023-02-09
Date d'octroi 2025-03-11
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Zhu, Jiang
  • Obuchi, Shota

Abrégé

Provided is a method for manufacturing a printed circuit board with electronic component, including: mounting an electronic component on an insulating substrate; applying an insulating first coating resin to at least a part of the electronic component; curing the first coating resin; applying an insulating second coating resin to the cured first coating resin; and curing the second coating resin.

Classes IPC  ?

  • H05K 3/28 - Application de revêtements de protection non métalliques
  • H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

48.

Flexible printed circuit board with connection terminal, and method for manufacturing the same

      
Numéro d'application 17829849
Numéro de brevet 12057648
Statut Délivré - en vigueur
Date de dépôt 2022-06-01
Date de la première publication 2023-01-26
Date d'octroi 2024-08-06
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Aoyama, Shunsuke
  • Hirata, Masanori

Abrégé

Provided is a flexible printed circuit board with connection terminal, including: a base film and a conductor layer provided on the base film, wherein the connection terminal includes a plurality of crimping pieces for fixing the connection terminal to the flexible printed circuit board, the crimping pieces penetrate the flexible printed circuit board by being crimped, and are bent in a direction opposite to a direction in which the crimping pieces penetrate the flexible printed circuit board, to bite into at least a part of the conductor layer, and the conductor layer is removed in a region of the conductor layer which the crimping pieces penetrate.

Classes IPC  ?

  • H01R 12/68 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires caractérisées par les bornes bornes pénétrant dans l'isolant comprenant des parties déformables

49.

Temperature measurement device

      
Numéro d'application 17684858
Numéro de brevet 12523544
Statut Délivré - en vigueur
Date de dépôt 2022-03-02
Date de la première publication 2022-12-22
Date d'octroi 2026-01-13
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Tomita, Shunsuke
  • Kanayama, Tomoki
  • Komuro, Yuki
  • Hashimoto, Yusuke

Abrégé

A temperature measurement device includes: a case fixed to a measurement target product; a flexible printed circuit board attached to the case; and a thermistor element mounting portion having a thermistor element to be electrically connected to a wiring provided on the flexible printed circuit board, the case has a holding portion for holding the thermistor element mounting portion and a support portion for supporting the holding portion, the holding portion is connected through a hinge portion to a case body provided with the support portion, and the holding portion is supported by the support portion in such a manner that the holding portion is folded back to bend the hinge portion.

Classes IPC  ?

  • G01K 7/22 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs l'élément étant une résistance non linéaire, p. ex. une thermistance
  • G01K 1/08 - Dispositifs de protection, p. ex. étuis
  • G01K 1/14 - SupportsDispositifs de fixationDispositions pour le montage de thermomètres en des endroits particuliers
  • H01M 10/48 - Accumulateurs combinés à des dispositions pour mesurer, tester ou indiquer l'état des éléments, p. ex. le niveau ou la densité de l'électrolyte
  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

50.

Crimp terminal-equipped flexible printed circuit board and method for manufacturing same

      
Numéro d'application 17454948
Numéro de brevet 11942708
Statut Délivré - en vigueur
Date de dépôt 2021-11-15
Date de la première publication 2022-09-15
Date d'octroi 2024-03-26
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Hirata, Masanori
  • Aoyama, Shunsuke
  • Miura, Yu
  • Kiya, Kenji

Abrégé

A crimp terminal-equipped flexible printed circuit board includes: a first flexible printed circuit board having a base film and a circuit provided on a surface of the base film and made of metal foil; multiple crimp terminals including crimp pieces crimped to penetrate the first flexible printed circuit board and bent to bite into part of the circuit; and an insulating reinforcing film partially integrally provided on an area of the base film where the multiple crimp pieces penetrate.

Classes IPC  ?

  • H01R 12/69 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires caractérisées par les bornes bornes déformables, p. ex. bornes à sertir
  • H01R 43/048 - Appareils ou procédés de sertissage
  • H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

51.

Voltage monitoring module

      
Numéro d'application 17544903
Numéro de brevet 11754632
Statut Délivré - en vigueur
Date de dépôt 2021-12-07
Date de la première publication 2022-07-28
Date d'octroi 2023-09-12
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Gyotoku, Hajime
  • Ikemiya, Kazuki
  • Yamada, Shuzo

Abrégé

Provided is a voltage monitoring module which includes: a land; and a metal plate arranged on the land and soldered to the land, in which a through-hole is partially formed at a location of the metal plate corresponding to the land, a non-formation area is formed at a location of the land corresponding to part of the through-hole, and no conductor is formed in the non-formation area.

Classes IPC  ?

  • G01R 31/3835 - Dispositions pour la surveillance de variables des batteries ou des accumulateurs, p. ex. état de charge ne faisant intervenir que des mesures de tension
  • H05K 1/02 - Circuits imprimés Détails

52.

Stretchable circuit board

      
Numéro d'application 17468343
Numéro de brevet 11606859
Statut Délivré - en vigueur
Date de dépôt 2021-09-07
Date de la première publication 2022-06-23
Date d'octroi 2023-03-14
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Iwase, Masayuki

Abrégé

A stretchable circuit board includes a stretchable base material; a stretchable conductive pattern formed on at least one main surface of the stretchable base material and having stretchability; and a reinforcing base having higher rigidity than the stretchable base material, wherein the reinforcing base reinforces the stretchable base material by being directly or indirectly laminated on the stretchable base material so as to surround at least a part of a formation region of the stretchable conductive pattern in the stretchable base material in a plan view.

Classes IPC  ?

  • H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
  • H05K 1/02 - Circuits imprimés Détails

53.

Method for forming through-hole, and substrate for flexible printed wiring board

      
Numéro d'application 17494141
Numéro de brevet 11856695
Statut Délivré - en vigueur
Date de dépôt 2021-10-05
Date de la première publication 2022-04-14
Date d'octroi 2023-12-26
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Higashira, Toshihiro
  • Hatano, Fuki

Abrégé

Provided is a method for forming a through-hole including: forming a laminated body including a fluororesin layer having a first main surface and a second main surface, a first adhesive layer, a first reinforcing resin layer and a first conductor layer provided on the first main surface, a second adhesive layer, a second reinforcing resin layer and a second conductor layer provided on the second main surface; forming an opening in the first conductor layer and irradiating the opening with a laser beam to form a bottomed conduction hole with the second conductor layer exposed on a bottom surface of the conduction hole, wherein a thermal decomposition temperature of the second cured adhesive layer is lower than those of the first reinforcing resin layer and the second reinforcing resin layer, and a thickness of the second cured adhesive layer is 10 μm or more and 200 μm or less.

Classes IPC  ?

  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
  • H05K 3/42 - Trous de passage métallisés
  • H05K 3/46 - Fabrication de circuits multi-couches
  • H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
  • H05K 1/03 - Emploi de matériaux pour réaliser le substrat

54.

Wiring material and battery module

      
Numéro d'application 17299881
Numéro de brevet 12080910
Statut Délivré - en vigueur
Date de dépôt 2020-03-18
Date de la première publication 2022-03-10
Date d'octroi 2024-09-03
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Yamada, Shuzo
  • Watanabe, Tsukasa
  • Tomita, Shunsuke
  • Kanayama, Tomoki

Abrégé

a that projects from the main body 68 in the longitudinal direction and extends in the longitudinal direction.

Classes IPC  ?

  • H01M 50/298 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par le câblage des blocs de batterie
  • H01M 50/284 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports comprenant l’insertion de cartes de circuits, p. ex. de cartes de circuits imprimés
  • H01M 50/505 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant une barre omnibus unique
  • H01M 50/519 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant des circuits imprimés

55.

Wiring body and method for manufacturing same

      
Numéro d'application 17321605
Numéro de brevet 11564313
Statut Délivré - en vigueur
Date de dépôt 2021-05-17
Date de la première publication 2022-02-17
Date d'octroi 2023-01-24
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Matsuda, Fumihiko

Abrégé

A wiring body includes: a core insulating base material having a first main surface and a second main surface; a signal line and a first power supply line provided on the first main surface; a second power supply line provided on the second main surface and electrically connected to the first power supply line; a first dielectric layer laminated on the first main surface so as to embed the signal line and the first power supply line; a first ground layer provided on the first dielectric layer; a second dielectric layer laminated on the second main surface so as to embed the second power supply line; and a second ground layer provided on the second dielectric layer and sandwiching at least the signal line together with the first ground layer.

Classes IPC  ?

  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
  • H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage
  • H05K 3/46 - Fabrication de circuits multi-couches

56.

Support member and battery module

      
Numéro d'application 17276084
Numéro de brevet 12362420
Statut Délivré - en vigueur
Date de dépôt 2019-09-03
Date de la première publication 2022-02-10
Date d'octroi 2025-07-15
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Tomita, Shunsuke
  • Kanayama, Tomoki

Abrégé

Provided are a support member and a battery module in consideration of variations in dimensions of the battery. At the same time, stress concentration on the support member is alleviated. A sliding portion 127 of one of adjacent support cases 121 of the plurality of support cases 121 connected to each other is slidably housed in the main body portion 122 of the other support case 121. Apart of the sliding portion 127 of the one support case 121 is pulled out from the main body portion 122 of the other support case 121. Thus, a distance between the one support case 121 and the other support case 121 is increased. At least a part of the sliding portion 127 of the one support case 121 is housed in the main body portion 122 of the other support case 121. Thus, the distance between the one support case 122 and the other support case 122 is decreased.

Classes IPC  ?

  • H01M 50/242 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports caractérisés par les propriétés physiques des boîtiers ou des bâtis, p. ex. dimensions adaptés pour protéger les batteries contre les vibrations, les collisions ou le gonflement
  • H01M 50/209 - Bâtis, modules ou blocs de multiples batteries ou de multiples cellules caractérisés par leur forme adaptés aux cellules prismatiques ou rectangulaires
  • H01M 50/287 - Fixation des cartes de circuits imprimés sur les couvercles
  • H01M 50/50 - Connexions conductrices de courant pour les cellules ou les batteries

57.

Temperature measuring device

      
Numéro d'application 17338829
Numéro de brevet 11747215
Statut Délivré - en vigueur
Date de dépôt 2021-06-04
Date de la première publication 2022-02-10
Date d'octroi 2023-09-05
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Watanabe, Tsukasa
  • Tomita, Shunsuke
  • Yamada, Shuzo
  • Kiya, Kenji

Abrégé

Provided is a temperature measuring device which includes: a flexible printed circuit board with wiring; a thermistor element; a heat collecting plate; and a pressing member. The flexible printed circuit board is configured to be attached to a case that is fixed to an object to be measured, the thermistor element is electrically connected to the wiring, the heat collecting plate is disposed on a side opposite to the thermistor element via the flexible printed circuit board so as to be pressed against a temperature measuring point in the object to be measured, and the pressing member is made of a foam material and is configured to be compressed when the case is fixed to the object to be measured and to press the heat collecting plate against the object to be measured.

Classes IPC  ?

  • G01K 7/22 - Mesure de la température basée sur l'utilisation d'éléments électriques ou magnétiques directement sensibles à la chaleur utilisant des éléments résistifs l'élément étant une résistance non linéaire, p. ex. une thermistance
  • G01R 31/396 - Acquisition ou traitement de données pour le test ou la surveillance d’éléments particuliers ou de groupes particuliers d’éléments dans une batterie
  • G01K 1/16 - Dispositions particulières pour conduire la chaleur de l'objet à l'élément sensible
  • H05K 1/02 - Circuits imprimés Détails
  • G01K 1/14 - SupportsDispositifs de fixationDispositions pour le montage de thermomètres en des endroits particuliers
  • G01K 1/18 - Dispositions particulières pour conduire la chaleur de l'objet à l'élément sensible pour réduire l'inertie thermique
  • H01M 10/48 - Accumulateurs combinés à des dispositions pour mesurer, tester ou indiquer l'état des éléments, p. ex. le niveau ou la densité de l'électrolyte
  • H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
  • G01R 31/382 - Dispositions pour la surveillance de variables des batteries ou des accumulateurs, p. ex. état de charge
  • G01K 1/08 - Dispositifs de protection, p. ex. étuis

58.

Flexible printed wiring board with crimp terminal

      
Numéro d'application 17182390
Numéro de brevet 12580331
Statut Délivré - en vigueur
Date de dépôt 2021-02-23
Date de la première publication 2021-10-07
Date d'octroi 2026-03-17
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Yamada, Shuzo
  • Miura, Yu
  • Kanayama, Tomoki

Abrégé

A flexible printed wiring board with crimp terminal includes: a flexible printed wiring board having a base film, a circuit including a metal foil provided on a surface of the base film, and a cover film attached to the base film so as to sandwich the circuit; and a crimp terminal with a plurality of crimping pieces that penetrates the flexible printed wiring board by being crimped and is bent to bite into a part of the circuit. A part of the circuit is exposed without the cover film being provided in a partial region of the flexible printed wiring board, and at least some of the crimping pieces are arranged in the partial region, and thus bite into a part of the circuit without penetrating the cover film.

Classes IPC  ?

  • H01R 12/68 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires caractérisées par les bornes bornes pénétrant dans l'isolant comprenant des parties déformables
  • H01R 12/62 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires se raccordant à des circuits imprimés rigides ou à des structures similaires
  • H01R 12/69 - Connexions fixes pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires caractérisées par les bornes bornes déformables, p. ex. bornes à sertir
  • H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés

59.

Heater having flexible printed wiring board and method for manufacturing same

      
Numéro d'application 17182351
Numéro de brevet 12144068
Statut Délivré - en vigueur
Date de dépôt 2021-02-23
Date de la première publication 2021-09-30
Date d'octroi 2024-11-12
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Miyamoto, Garo
  • Aoyama, Shunsuke

Abrégé

Provided is a heater which includes a flexible printed wiring board, in which the flexible printed wiring board includes a base film, a first metal foil, and a second metal foil, the first metal foil forms a heater circuit portion that generates heat when energized, on a first surface of the base film, and the second metal foil forms a heat conductive foil portion that maintains a non-energized state, on a second surface of the base film.

Classes IPC  ?

  • H05B 3/34 - Éléments chauffants ayant une surface s'étendant essentiellement dans deux dimensions, p. ex. plaques chauffantes flexibles, p. ex. grillages ou tissus chauffants
  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

60.

Heater including flexible printed wiring board and method for manufacturing same

      
Numéro d'application 17170265
Numéro de brevet 12193146
Statut Délivré - en vigueur
Date de dépôt 2021-02-08
Date de la première publication 2021-09-30
Date d'octroi 2025-01-07
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Aoyama, Shunsuke
  • Kiya, Kenji

Abrégé

A heater includes: a flexible printed wiring board including a base film and a metal foil provided on one side of the base film; a heater circuit portion that is formed from the metal foil and generates heat when energized; and a heat conductive foil portion that is formed from the metal foil at a position away from the heater circuit portion and is maintained in a non-energized state.

Classes IPC  ?

  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/03 - Emploi de matériaux pour réaliser le substrat
  • H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
  • H05B 1/02 - Dispositions de commutation automatique spécialement adaptées aux appareils de chauffage
  • H05B 3/84 - Dispositions pour le chauffage spécialement adaptées à des surfaces transparentes ou réfléchissantes, p. ex. pour désembuer ou dégivrer des fenêtres, des miroirs ou des pare-brise de véhicules

61.

Printed circuit board and method for manufacturing same

      
Numéro d'application 17173102
Numéro de brevet 11219123
Statut Délivré - en vigueur
Date de dépôt 2021-02-10
Date de la première publication 2021-09-09
Date d'octroi 2022-01-04
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Matsuda, Fumihiko
  • Narisawa, Yoshihiko
  • Kumagai, Kenji
  • Shiokawa, Daisuke
  • Ogi, Yuki
  • Toyoshima, Akihiko
  • Uchino, Masami
  • Arase, Isao
  • Takeuchi, Hiroshi

Abrégé

Provided is a printed circuit board which includes: a first dielectric layer including a first principal surface and a second principal surface on a side opposite to the first principal surface; a first adhesive layer formed on the first principal surface; a first metal foil pattern formed on the first adhesive layer and forming a signal line; and a second metal foil pattern formed on the second principal surface and forming a ground layer, in which the first metal foil pattern has a higher specific conductivity than a specific conductivity of the second metal foil pattern.

Classes IPC  ?

  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/03 - Emploi de matériaux pour réaliser le substrat

62.

Flexible printed circuit board and battery module

      
Numéro d'application 17152445
Numéro de brevet 11799164
Statut Délivré - en vigueur
Date de dépôt 2021-01-19
Date de la première publication 2021-08-12
Date d'octroi 2023-10-24
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Tomita, Shunsuke
  • Kanayama, Tomoki
  • Azuma, Kazuyuki

Abrégé

A flexible printed circuit board which includes: a base film; and multiple wires formed on the base film, in which in a region attached to a battery including multiple arrayed cells, a conductor portion to be the multiple wires is provided only on one surface of the base film, at at least part of a region apart from the region attached to the battery, a conductor portion to be the multiple wires is provided on each surface of the base film, and the flexible printed circuit board further includes multiple conductive portions configured to electrically connect the wires on one surface side of the base film and the wires on the other surface side of the base film.

Classes IPC  ?

  • H01M 50/284 - MonturesBoîtiers secondaires ou cadresBâtis, modules ou blocsDispositifs de suspensionAmortisseursDispositifs de transport ou de manutentionSupports comprenant l’insertion de cartes de circuits, p. ex. de cartes de circuits imprimés
  • H01M 50/507 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant un arrangement de plusieurs barres omnibus réunies dans une structure de conteneur, p. ex. modules de barres omnibus
  • H01M 50/519 - Interconnecteurs pour connecter les bornes des batteries adjacentesInterconnecteurs pour connecter les cellules en dehors d'un boîtier de batterie comprenant des circuits imprimés

63.

Flexible printed circuit board and battery module

      
Numéro d'application 17152843
Numéro de brevet 11382211
Statut Délivré - en vigueur
Date de dépôt 2021-01-20
Date de la première publication 2021-08-12
Date d'octroi 2022-07-05
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Tomita, Shunsuke
  • Kanayama, Tomoki
  • Yamada, Shuzo

Abrégé

A flexible printed circuit board includes: a trunk portion; and a pair of branch portions as two portions branched from the trunk portion and arranged on a battery including multiple arrayed cells, in which for at least one branch portion of the pair of branch portions, bending is performed using a pair of parallel bending lines extending apart from the other branch portion as extending apart from the trunk portion, and the at least one branch portion is bent such that a direction of bending at one bending line of the pair of parallel bending lines and a direction of bending at the other bending line are directions opposite to each other.

Classes IPC  ?

64.

Printed-circuit board

      
Numéro d'application 17148879
Numéro de brevet 11343901
Statut Délivré - en vigueur
Date de dépôt 2021-01-14
Date de la première publication 2021-08-05
Date d'octroi 2022-05-24
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Kiya, Kenji
  • Kanayama, Tomoki

Abrégé

A printed-circuit board includes: a film-shaped thermoplastic base member having plasticity; a pattern fuse formed from a metal foil layer provided on a principal surface of the base member; a cover member covering at least part of the pattern fuse from an opposite side of the base member; and a first heat-resistant protection film provided on a region overlapping with at least part of the pattern fuse and covering the pattern fuse from a cover member side.

Classes IPC  ?

  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p. ex. une résistance, un condensateur, une inductance imprimés
  • H05K 1/03 - Emploi de matériaux pour réaliser le substrat

65.

Adhesive film and flexible printed circuit board

      
Numéro d'application 17109440
Numéro de brevet 12312510
Statut Délivré - en vigueur
Date de dépôt 2020-12-02
Date de la première publication 2021-06-03
Date d'octroi 2025-05-27
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Oba, Hisae
  • Komori, Hiroyuki
  • Suzuki, Nozomu

Abrégé

2·sec·cmHg or less, and a 3% thermal weight reduction temperature of the adhesive agent is 320° C. or higher.

Classes IPC  ?

  • C09J 7/25 - Matières plastiquesMatières plastiques métallisées à base de composés macromoléculaires obtenus par des réactions autres que celles faisant intervenir uniquement des liaisons non saturées carbone-carbone
  • C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide-acides ou précurseurs similaires de polyimides
  • C09J 127/16 - Homopolymères ou copolymères du fluorure de vinylidène
  • C09J 127/20 - Homopolymères ou copolymères de l'hexafluoropropène
  • H05K 1/03 - Emploi de matériaux pour réaliser le substrat
  • H05K 3/46 - Fabrication de circuits multi-couches

66.

Method for manufacturing substrate for flexible printed wiring board, and substrate for flexible printed wiring board

      
Numéro d'application 17020936
Numéro de brevet 11310917
Statut Délivré - en vigueur
Date de dépôt 2020-09-15
Date de la première publication 2021-03-18
Date d'octroi 2022-04-19
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Higashira, Toshihiro
  • Hatano, Fuki

Abrégé

Provided is a method for manufacturing a substrate for flexible printed wiring board, comprising a laminated body forming step and an integration step, wherein in the laminated body forming step, on an upper surface and a lower surface of a fluororesin layer having a modified surface, a first and second reinforcing resin layers having a coefficient of thermal expansion smaller than that of the fluororesin layer are respectively stacked through a first thermosetting adhesive, on the first reinforcing resin layer and/or the second reinforcing resin layer, a conductor layer is stacked through a second thermosetting adhesive, to form a laminated body, and in the integration step, the laminated body is heated and integrated at a temperature not lower than a curing temperature of the first and second thermosetting adhesives and lower than a melting point of the fluororesin layer.

Classes IPC  ?

  • H05K 1/03 - Emploi de matériaux pour réaliser le substrat
  • H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
  • H05K 1/02 - Circuits imprimés Détails

67.

Stretchable wiring board and electrical muscle stimulating device

      
Numéro d'application 16863100
Numéro de brevet 11975191
Statut Délivré - en vigueur
Date de dépôt 2020-04-30
Date de la première publication 2021-02-18
Date d'octroi 2024-05-07
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Ishiguro, Toshihide

Abrégé

Provided is a stretchable wiring board including: a base material having stretchability; a wiring line having at least a portion coated and formed on the base material with a conductive stretchable material; and an uneven engaging portion that is electrically connected to the wiring line and has a protrusion or a recess configured to engage with a connection terminal of an external device.

Classes IPC  ?

  • A61N 1/36 - Application de courants électriques par électrodes de contact courants alternatifs ou intermittents pour stimuler, p. ex. stimulateurs cardiaques
  • A61B 5/395 - Détails de la stimulation, p. ex. stimulation d’un nerf pour provoquer une réponse EMG
  • A61N 1/04 - Électrodes
  • A61N 1/375 - Aménagements structurels, p. ex. boîtiers
  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique

68.

Adhesive sheet

      
Numéro d'application 16817352
Numéro de brevet 12286573
Statut Délivré - en vigueur
Date de dépôt 2020-03-12
Date de la première publication 2020-09-17
Date d'octroi 2025-04-29
Propriétaire
  • Mektec Corporation (Japon)
  • Osaka University (Japon)
Inventeur(s)
  • Iwase, Masayuki
  • Araki, Teppei
  • Sekitani, Tsuyoshi
  • Yoshimoto, Shusuke

Abrégé

To provide an adhesive sheet, the sheet increasing manufacturing efficiency of products including an adhesive agent layer, while using the adhesive agent layer to which an electro-conductive organic polymer compound is added. An adhesive sheet for use in applying a wiring board to a surface onto which the wiring board is to be applied, the adhesive sheet is constituted by an adhesive agent layer including an electro-conductive organic polymer compound and an adhesive material; a first releasing sheet provided on front surface of the adhesive agent layer; and a second releasing sheet provided on a back surface corresponding to a back surface of the front surface in the adhesive agent layer.

Classes IPC  ?

  • C09J 9/02 - Adhésifs conducteurs de l'électricité
  • A61B 5/257 - Moyens adhésifs, p. ex. garnitures ou bandes adhésives
  • A61N 1/00 - ÉlectrothérapieCircuits à cet effet
  • A61N 1/04 - Électrodes
  • C09J 7/40 - Adhésifs sous forme de films ou de pellicules caractérisés par des couches antiadhésives
  • H05K 1/00 - Circuits imprimés
  • H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
  • H05K 1/02 - Circuits imprimés Détails

69.

Probe device, electrical inspection apparatus, and electrical inspection method

      
Numéro d'application 16668093
Numéro de brevet 11137437
Statut Délivré - en vigueur
Date de dépôt 2019-10-30
Date de la première publication 2020-05-28
Date d'octroi 2021-10-05
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Takano, Shoji
  • Matsuda, Fumihiko
  • Narisawa, Yoshihiko

Abrégé

Provided is a probe device used for electrical inspection of a printed wiring board, the probe device including at least one probe group including a plurality of wire probes configured to be able to simultaneously abut against a wire provided on the printed wiring board and extending in a specified direction, the plurality of wire probes abutting against the wire along the direction and being electrically connected to each other.

Classes IPC  ?

  • G01R 31/28 - Test de circuits électroniques, p. ex. à l'aide d'un traceur de signaux
  • G01R 1/073 - Sondes multiples
  • H01R 12/71 - Dispositifs de couplage pour circuits imprimés rigides ou structures similaires

70.

Method for manufacturing multilayer printed circuit board

      
Numéro d'application 16446031
Numéro de brevet 10765000
Statut Délivré - en vigueur
Date de dépôt 2019-06-19
Date de la première publication 2020-01-30
Date d'octroi 2020-09-01
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Matsuda, Fumihiko
  • Takano, Shoji

Abrégé

A method for manufacturing a multilayer printed circuit board includes: preparing a first wiring substrate having a first insulating resin film having a first circuit pattern formed on a first main surface, and a first protective film releasably bonded to a second main surface; partially removing the first protective film and the first insulating resin film to form a bottomed via hole having the first circuit pattern exposed on a bottom surface; filling the bottomed via hole with a conductive paste; disposing a second protective film on the first protective film to cover the bottomed via hole filled with the conductive paste; removing an unnecessary portion of the first wiring substrate after the second protective film is disposed on the first protective film; and peeling off the first protective film and the second protective film from the first wiring substrate after the unnecessary portion is removed.

Classes IPC  ?

  • H05K 3/20 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché par apposition d'un parcours conducteur préfabriqué
  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
  • H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
  • H05K 3/46 - Fabrication de circuits multi-couches
  • B32B 38/10 - Enlèvement de couches ou de parties de couches, mécaniquement ou chimiquement

71.

Printed wiring board for high frequency transmission

      
Numéro d'application 16490611
Numéro de brevet 10736208
Statut Délivré - en vigueur
Date de dépôt 2018-11-22
Date de la première publication 2020-01-09
Date d'octroi 2020-08-04
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Takano, Shoji
  • Narisawa, Yoshihiko
  • Matsuda, Fumihiko

Abrégé

b; a plurality of ground connection vias 51 electrically connecting the ground wiring 31 and the ground layer 40; and a plurality of ground connection vias 52 electrically connecting the ground wiring 32 and the ground layer 40. A width of the ground wirings 31, 32 is smaller than a land diameter of the ground connection vias 51, 52. Then, the ground connection vias 51 and the ground connection vias 52 are arranged not to overlap each other in a width direction perpendicular to the longitudinal direction throughout a cable portion 90.

Classes IPC  ?

  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
  • H05K 1/03 - Emploi de matériaux pour réaliser le substrat
  • H05K 3/46 - Fabrication de circuits multi-couches
  • H01P 3/08 - MicrorubansTriplaques
  • H01P 11/00 - Appareils ou procédés spécialement adaptés à la fabrication de guides d'ondes, résonateurs, lignes ou autres dispositifs du type guide d'ondes
  • H01Q 1/22 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets

72.

Catheter flexible printed wiring board and method for manufacturing the same

      
Numéro d'application 16246695
Numéro de brevet 11931099
Statut Délivré - en vigueur
Date de dépôt 2019-01-14
Date de la première publication 2019-08-08
Date d'octroi 2024-03-19
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Yoshida, Akio
  • Toyoshima, Ryoichi
  • Sasaki, Mitsunori
  • Hasegawa, Hiroyasu

Abrégé

A catheter flexible printed wiring board which includes: a long flexible insulating base member having a tip end portion and a base end portion; and a conductive pattern formed on the flexible insulating base member and extending from the base end portion to the tip end portion, wherein the conductive pattern at the base end portion is wider than the conductive pattern at the tip end portion and thicker than the conductive pattern at the tip end portion.

Classes IPC  ?

  • H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
  • A61B 18/14 - Sondes ou électrodes à cet effet
  • H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

73.

Electrode sheet

      
Numéro d'application 16332723
Numéro de brevet 11786162
Statut Délivré - en vigueur
Date de dépôt 2017-08-17
Date de la première publication 2019-07-18
Date d'octroi 2023-10-17
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Sekitani, Tsuyoshi
  • Uemura, Takafumi
  • Araki, Teppei
  • Yoshimoto, Shusuke
  • Iwase, Masayuki
  • Yoshida, Akio
  • Satake, Hideki

Abrégé

Provided is an electrode sheet allowing easy connection of a wiring that is extended, when required, to a measurement position on a living body. The electrode sheet (main sheet (1), auxiliary sheet (10)) includes a sheet-shaped flexible substrate (2, 11), wirings (3, 12) formed on the flexible substrate (2, 11), electrodes (5, 14) formed on the flexible substrate (2, 11) and electrically connected to the wirings (3, 12), and an insulating layer (4, 13) laid on the flexible substrate (2, 11) in such a manner that the wirings (3, 12) are overlaid with the insulating layer (4, 13) while the electrodes (5, 14) are exposed. The electrodes (5, 14) are formed of a conductive material in which conductive particles are dispersed in a thermoplastic resin.

Classes IPC  ?

  • A61B 5/24 - Détection, mesure ou enregistrement de signaux bioélectriques ou biomagnétiques du corps ou de parties de celui-ci
  • A61B 5/05 - Détection, mesure ou enregistrement pour établir un diagnostic au moyen de courants électriques ou de champs magnétiquesMesure utilisant des micro-ondes ou des ondes radio
  • A61B 5/291 - Électrodes bioélectriques à cet effet spécialement adaptées à des utilisations particulières pour l’électroencéphalographie [EEG]
  • A61B 5/282 - Supports pour électrodes multiples

74.

Stretchable circuit board and stretchable circuit board manufacturing method

      
Numéro d'application 16194422
Numéro de brevet 10499497
Statut Délivré - en vigueur
Date de dépôt 2018-11-19
Date de la première publication 2019-05-30
Date d'octroi 2019-12-03
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Iwase, Masayuki

Abrégé

Provided is a stretchable circuit board including: a stretchable base material having stretchability and including a stretchable wiring line on one main surface; an electrode formed on at least the main surface of the stretchable base material and connected to the stretchable wiring line; an adhesive layer directly or indirectly bonded to the main surface on which the electrode is formed and formed in a region of the main surface other than an electrode region including the electrode; and an adhesive layer separator detachably bonded to the adhesive layer and having an opening formed at a position corresponding to at least part of the electrode region.

Classes IPC  ?

  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/03 - Emploi de matériaux pour réaliser le substrat
  • H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
  • H05K 1/14 - Association structurale de plusieurs circuits imprimés
  • H05K 3/06 - Élimination du matériau conducteur par voie chimique ou électrolytique, p. ex. par le procédé de photo-décapage
  • H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
  • H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal

75.

Stretchable circuit board and stretchable circuit board manufacturing method

      
Numéro d'application 16188513
Numéro de brevet 10595402
Statut Délivré - en vigueur
Date de dépôt 2018-11-13
Date de la première publication 2019-05-30
Date d'octroi 2020-03-17
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Iwase, Masayuki

Abrégé

Provided is a stretchable circuit board including: a stretchable base material having stretchability; a film base material overlapping with part of a one-surface-side surface of the stretchable base material and having lower stretchability than that of the stretchable base material; a stretchable wiring line formed on the one-surface-side surface of the stretchable base material; and an adhesive layer formed on one surface side or the other surface side of the stretchable base material. The adhesive layer is formed on both of an overlapping region where the stretchable base material overlaps with the film base material and a non-overlapping region where the stretchable base material does not overlap with the film base material.

Classes IPC  ?

  • H05K 1/00 - Circuits imprimés
  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/03 - Emploi de matériaux pour réaliser le substrat
  • H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
  • H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
  • H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
  • H05K 3/06 - Élimination du matériau conducteur par voie chimique ou électrolytique, p. ex. par le procédé de photo-décapage
  • H05K 3/20 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché par apposition d'un parcours conducteur préfabriqué
  • H05K 3/28 - Application de revêtements de protection non métalliques
  • H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
  • H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
  • H05K 3/46 - Fabrication de circuits multi-couches
  • H05K 1/14 - Association structurale de plusieurs circuits imprimés
  • H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique

76.

Flexible printed board and method for manufacturing flexible printed board

      
Numéro d'application 16307111
Numéro de brevet 10485093
Statut Délivré - en vigueur
Date de dépôt 2017-06-21
Date de la première publication 2019-03-21
Date d'octroi 2019-11-19
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Ebihara, Satoshi
  • Kato, Takahisa
  • Sasaki, Nobuto
  • Azuma, Kazuyuki
  • Shimokawaji, Tomohiro
  • Wakabayashi, Takeo

Abrégé

Provided are both a flexible printed board, in which heat dissipation performance can be improved in without using an aluminum heal dissipating material, which is light in weight, has good processability and can be reduced in cost, and a method for manufacturing such a flexible printed board. The flexible printed board is a flexible printed board 10 on which a power consuming load is mounted, including: a front surface heat dissipation layer 30 made of a copper foil and having a circuit portion on which the load is mounted; a thermally conductive resin layer 20 having the front surface heat dissipation layer 30 laminated to a front surface side thereof and having a thermal conductivity of 0.49 W/mK or more; and a rear surface heat dissipation layer made of a copper foil, laminated to a rear surface side of the thermally conductive resin layer 20, and having a thickness of 100 to 400% with respect to the front surface heat dissipation layer 30.

Classes IPC  ?

  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés
  • H05K 3/46 - Fabrication de circuits multi-couches

77.

Receiver and receiving system

      
Numéro d'application 16103594
Numéro de brevet 11013110
Statut Délivré - en vigueur
Date de dépôt 2018-08-14
Date de la première publication 2019-02-28
Date d'octroi 2021-05-18
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Yoshida, Akio
  • Sasaki, Mitsunori

Abrégé

A receiver includes a stretchable circuit board having stretchability and a first antenna formed on a main surface of the stretchable circuit board, the first antenna being configured to stretch in accordance with the stretchable circuit board and configured to receive a signal transmitted from a transmitter installed in a living body.

Classes IPC  ?

  • A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
  • H05K 1/02 - Circuits imprimés Détails
  • H04B 13/00 - Systèmes de transmission caractérisés par le milieu utilisé pour la transmission, non prévus dans les groupes
  • G01S 5/06 - Position de source déterminée par coordination d'un ensemble de lignes de position définies par des mesures de différence de parcours
  • H01Q 7/00 - Cadres ayant une distribution du courant sensiblement uniforme et un diagramme de rayonnement directif perpendiculaire au plan du cadre
  • H05K 1/16 - Circuits imprimés comprenant des composants électriques imprimés incorporés, p. ex. une résistance, un condensateur, une inductance imprimés
  • H01Q 1/27 - Adaptation pour l'utilisation dans ou sur les corps mobiles
  • H01Q 1/40 - Éléments rayonnants recouverts avec, ou enrobés d'une matière protectrice
  • H01Q 21/29 - Combinaisons d'unités d'antennes de types différents interagissant entre elles pour donner une caractéristique directionnelle désirée
  • G01S 5/14 - Localisation par coordination de plusieurs déterminations de direction ou de ligne de positionLocalisation par coordination de plusieurs déterminations de distance utilisant les ondes radioélectriques déterminant des distances absolues à partir de plusieurs points espacés d'emplacement connu
  • A61B 5/06 - Dispositifs autres que ceux à radiation, pour détecter ou localiser les corps étrangers
  • H01Q 1/38 - Forme structurale pour éléments rayonnants, p. ex. cône, spirale, parapluie formés par une couche conductrice sur un support isolant

78.

Attachment tag and tag system

      
Numéro d'application 16042682
Numéro de brevet 10410106
Statut Délivré - en vigueur
Date de dépôt 2018-07-23
Date de la première publication 2019-02-14
Date d'octroi 2019-09-10
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Yoshida, Akio
  • Sasaki, Mitsunori

Abrégé

An attachment tag includes a stretchable circuit board having stretchability, a stretchable wiring line provided on a first main surface of the stretchable circuit board and having stretchability, an identification signal generator connected to the stretchable wiring line and configured to generate an identification signal containing identification information, a transmitter configured to transmit the identification signal generated by the identification signal generator, and an adhesive layer provided on a second main surface, different from the first main surface, of the stretchable circuit board and exhibiting adhesiveness.

Classes IPC  ?

  • G06K 7/08 - Méthodes ou dispositions pour la lecture de supports d'enregistrement avec des moyens de perception des modifications d'un champ électrostatique ou magnétique, p. ex. par perception des modifications de la capacité entre des électrodes
  • G06K 19/02 - Supports d'enregistrement pour utilisation avec des machines et avec au moins une partie prévue pour supporter des marques numériques caractérisés par l'utilisation de matériaux spécifiés, p. ex. pour éviter l'usure pendant le transport à travers la machine
  • G06K 19/06 - Supports d'enregistrement pour utilisation avec des machines et avec au moins une partie prévue pour supporter des marques numériques caractérisés par le genre de marque numérique, p. ex. forme, nature, code
  • G06K 19/077 - Détails de structure, p. ex. montage de circuits dans le support
  • G06K 19/07 - Supports d'enregistrement avec des marques conductrices, des circuits imprimés ou des éléments de circuit à semi-conducteurs, p. ex. cartes d'identité ou cartes de crédit avec des puces à circuit intégré
  • H05K 1/00 - Circuits imprimés

79.

Ultrasonic bonding jig, ultrasonic bonding method, and bonding structure

      
Numéro d'application 15933438
Numéro de brevet 10391584
Statut Délivré - en vigueur
Date de dépôt 2018-03-23
Date de la première publication 2019-02-14
Date d'octroi 2019-08-27
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Miyashiro, Hiroshi
  • Suruga, Yoichi
  • Koyano, Shuhei

Abrégé

An ultrasonic bonding jig includes: a plurality of protrusions; and a planar portion among protrusions formed among base ends of the protrusions. The protrusions have side surfaces of tapered surfaces, the side surfaces being positioned in a vibration direction. At the tapered surfaces, an inclination of a tangent at distal ends of the protrusions, with respect to the vibration direction, is larger than an inclination of a tangent at the base ends of the protrusions, with respect to the vibration direction.

Classes IPC  ?

  • B23K 20/00 - Soudage non électrique par percussion ou par une autre forme de pression, avec ou sans chauffage, p. ex. revêtement ou placage
  • B23K 20/10 - Soudage non électrique par percussion ou par une autre forme de pression, avec ou sans chauffage, p. ex. revêtement ou placage utilisant des vibrations, p. ex. soudage ultrasonique
  • F16B 5/00 - Jonction de feuilles ou de plaques soit entre elles soit à des bandes ou barres parallèles à elles
  • F16B 5/08 - Jonction de feuilles ou de plaques soit entre elles soit à des bandes ou barres parallèles à elles par soudage ou procédés similaires

80.

Method of manufacturing printed circuit board

      
Numéro d'application 16047584
Numéro de brevet 10779394
Statut Délivré - en vigueur
Date de dépôt 2018-07-27
Date de la première publication 2019-01-24
Date d'octroi 2020-09-15
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Matsuda, Fumihiko

Abrégé

The invention provides a method of manufacturing a printed circuit board. The printed circuit board (100) has a conductor layer (ground layer (70)), a signal layer (25) having a signal line (20) provided so as to oppose the conductor layer (ground layer (70)), and an insulating resin layer (60) disposed between the conductor layer (ground layer (70)) and the signal layer (25), the insulating resin layer (60) has voids in an overlapping location, in a plan view, with the signal line (20), and the voids (40) are communicated with the outside of the printed circuit board (100).

Classes IPC  ?

  • H01K 3/10 - Machines à cet effet
  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/03 - Emploi de matériaux pour réaliser le substrat
  • H01P 3/08 - MicrorubansTriplaques
  • H01P 11/00 - Appareils ou procédés spécialement adaptés à la fabrication de guides d'ondes, résonateurs, lignes ou autres dispositifs du type guide d'ondes
  • H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés

81.

Ultrasonic bonding jig, bonding structure, and bonding method

      
Numéro d'application 15923493
Numéro de brevet 10744591
Statut Délivré - en vigueur
Date de dépôt 2018-03-16
Date de la première publication 2019-01-10
Date d'octroi 2020-08-18
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Miyashiro, Hiroshi
  • Suruga, Yoichi
  • Koyano, Shuhei

Abrégé

An ultrasonic bonding jig includes: a base; and a protrusion portion which has a protrusion portion end surface approximately parallel to the base and which has a pair of first walls, the pair of first walls being disposed upright approximately perpendicular to the base from opposed sides of the protrusion portion end surface. A bonding structure includes a bonding portion of a metal plate and a base material. The bonding portion has a recessed portion with a closed bottom on a surface of the metal plate, and the recessed portion has a pair of walls approximately perpendicular to the surface of the metal plate.

Classes IPC  ?

  • B23K 20/10 - Soudage non électrique par percussion ou par une autre forme de pression, avec ou sans chauffage, p. ex. revêtement ou placage utilisant des vibrations, p. ex. soudage ultrasonique
  • H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés
  • H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
  • B23K 101/38 - Conducteurs
  • B23K 101/42 - Circuits imprimés
  • H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

82.

Adhesive composition using polyamide-imide resin

      
Numéro d'application 15780739
Numéro de brevet 10913249
Statut Délivré - en vigueur
Date de dépôt 2016-11-09
Date de la première publication 2018-12-20
Date d'octroi 2021-02-09
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Yane, Takehisa
  • Koyanagi, Hideyuki
  • Ohrui, Manabu
  • Ebihara, Satoshi

Abrégé

The present invention provide an adhesive composition which is suitable for laminating a polyimide film with a copper foil in a double-sided flexible copper-clad laminate to be used for a flexible printed wiring board. The adhesive composition comprises a polyamide-imide resin, an epoxy resin, and a phosphorus-type flame retardant, wherein 15 to 40 parts by mass of the epoxy resin is compounded to 85 to 60 parts by mass of the polyamide-imide resin; a glass transition temperature of the polyamide-imide resin is 250° C. or higher; an acid value of the polyamide-imide resin is 50 to 150 mgKOH/g; the epoxy resin is liquid at 25° C.; 15 to 60 parts by mass of the phosphorus-type flame retardant is compounded to 100 parts by mass in total of the polyamide-imide resin and the epoxy resin; and 50% by mass or more of the phosphorus-type flame retardant is a phosphinic acid derivative of a phenanthrene type.

Classes IPC  ?

  • B32B 27/28 - Produits stratifiés composés essentiellement de résine synthétique comprenant des copolymères de résines synthétiques non complètement couverts par les sous-groupes suivants
  • C09J 179/08 - PolyimidesPolyesterimidesPolyamide-imidesPolyamide-acides ou précurseurs similaires de polyimides
  • B32B 15/20 - Produits stratifiés composés essentiellement de métal comportant de l'aluminium ou du cuivre
  • H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
  • B32B 7/12 - Liaison entre couches utilisant des adhésifs interposés ou des matériaux interposés ayant des propriétés adhésives

83.

Joining structure of thin metal plate and base material, and welding method of thin metal plate and base material

      
Numéro d'application 15876234
Numéro de brevet 11225990
Statut Délivré - en vigueur
Date de dépôt 2018-01-22
Date de la première publication 2018-11-22
Date d'octroi 2022-01-18
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Miyashiro, Hiroshi
  • Suruga, Yoichi
  • Koyano, Shuhei

Abrégé

A welding method includes overlapping a thin metal plate with a base material, and setting an annular welding schedule line on a welding schedule portion of the thin metal plate; forming a welding line such that a continuous irradiation with a laser light from a fiber laser is performed while moving the laser light along the welding schedule line, and while vibrating the laser light across the welding schedule line; and setting a length of the welding line such that an entire inside of the welding schedule line is welded.

Classes IPC  ?

  • B23K 26/26 - Soudage de joints continus rectilignes
  • F16B 5/08 - Jonction de feuilles ou de plaques soit entre elles soit à des bandes ou barres parallèles à elles par soudage ou procédés similaires
  • B23K 26/244 - Soudage de joints du type à recouvrement
  • B23K 26/28 - Soudage de joints continus curvilignes

84.

Substrate inspection device and substrate manufacturing method

      
Numéro d'application 15535775
Numéro de brevet 10379064
Statut Délivré - en vigueur
Date de dépôt 2016-12-16
Date de la première publication 2018-07-19
Date d'octroi 2019-08-13
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Mishima, Kenichi

Abrégé

A substrate inspection device for inspecting a flexible printed board to determine whether the transparent adhesive material is properly applied thereto comprises: a substrate reading device which irradiates the flexible printed board with visible light to acquire image data; an adhesive material position determination unit which determines a position of adhesive material CAD data corresponding to the transparent adhesive material with respect to blue color image data among the image data corresponding to blue light which is readily absorbed by polyimide, to create adhesive material alignment data in which the adhesive material CAD data is superposed; an edge enhancing unit which performs processing, on the blue color image data, to enhance an edge of the transparent adhesive material; and a straight line determination unit which determines whether the edge of the transparent adhesive material is present in edge enhanced data in which the edge of the transparent adhesive material is enhanced.

Classes IPC  ?

  • G06K 9/00 - Méthodes ou dispositions pour la lecture ou la reconnaissance de caractères imprimés ou écrits ou pour la reconnaissance de formes, p.ex. d'empreintes digitales
  • G01N 21/956 - Inspection de motifs sur la surface d'objets
  • B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
  • B32B 27/34 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyamides
  • G06T 7/32 - Détermination des paramètres de transformation pour l'alignement des images, c.-à-d. recalage des images utilisant des procédés basés sur la corrélation
  • G01B 11/24 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes
  • G06T 7/00 - Analyse d'image
  • H05K 3/28 - Application de revêtements de protection non métalliques
  • G06T 5/00 - Amélioration ou restauration d'image
  • G06T 7/13 - Détection de bords
  • H05K 1/02 - Circuits imprimés Détails

85.

Stretchable circuit board and method for manufacturing stretchable circuit board

      
Numéro d'application 15569647
Numéro de brevet 10398024
Statut Délivré - en vigueur
Date de dépôt 2017-01-30
Date de la première publication 2018-04-26
Date d'octroi 2019-08-27
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Iwase, Masayuki
  • Wakabayashi, Takeo
  • Mizuno, Eiji

Abrégé

a). The elastomer layer (50) and the stretchable base (10) are layered and joined with each other.

Classes IPC  ?

  • H01R 12/77 - Dispositifs de couplage pour circuits imprimés flexibles, câbles plats ou à rubans ou structures similaires
  • H05K 1/02 - Circuits imprimés Détails
  • H01R 12/70 - Dispositifs de couplage
  • H01R 43/20 - Appareils ou procédés spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation de connecteurs de lignes ou de collecteurs de courant ou pour relier les conducteurs électriques pour assembler les pièces de contact avec le socle isolant, le boîtier ou le manchon ou pour les en désassembler
  • H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
  • B32B 25/00 - Produits stratifiés composés essentiellement de caoutchouc naturel ou synthétique
  • B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
  • H05K 1/03 - Emploi de matériaux pour réaliser le substrat
  • H05K 1/14 - Association structurale de plusieurs circuits imprimés
  • H05K 3/28 - Application de revêtements de protection non métalliques
  • H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés

86.

Stretchable circuit board and method for manufacturing stretchable circuit board

      
Numéro d'application 15690976
Numéro de brevet 10034370
Statut Délivré - en vigueur
Date de dépôt 2017-08-30
Date de la première publication 2018-03-29
Date d'octroi 2018-07-24
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Iwase, Masayuki
  • Toyama, Keizo

Abrégé

b of the base substrate has a rough surface with projections and depressions.

Classes IPC  ?

  • H05K 1/02 - Circuits imprimés Détails
  • H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
  • H05K 3/06 - Élimination du matériau conducteur par voie chimique ou électrolytique, p. ex. par le procédé de photo-décapage
  • A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus
  • H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
  • H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés

87.

Flexible printed wiring board

      
Numéro d'application 15558371
Numéro de brevet 10104774
Statut Délivré - en vigueur
Date de dépôt 2015-11-20
Date de la première publication 2018-03-22
Date d'octroi 2018-10-16
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Matsuda, Fumihiko

Abrégé

Provided is a flexible printed wiring board capable of increasing the number of wires even when the board is used in a narrow arrangement space and enhancing the degree of freedom for design while maintaining the board in a self-supported state. A flexible printed wiring board 100 is used in a state, in which one and another ends in a longitudinal direction are fixed respectively to one and another members that move in relation to each other in a state of being bent to be curved in the longitudinal direction. The flexible printed wiring board includes wiring board units 100A and 100B in which a plurality of wires are formed on a flexible insulating substrate and which are molded in a state of being curved in a lateral direction, and adjacent wiring board units are partially connected at side edges thereof in the lateral direction.

Classes IPC  ?

  • H05K 1/00 - Circuits imprimés
  • H05K 1/14 - Association structurale de plusieurs circuits imprimés
  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/03 - Emploi de matériaux pour réaliser le substrat

88.

Method for manufacturing stretchable circuit board and stretchable circuit board

      
Numéro d'application 15685622
Numéro de brevet 10194527
Statut Délivré - en vigueur
Date de dépôt 2017-08-24
Date de la première publication 2018-03-15
Date d'octroi 2019-01-29
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Iwase, Masayuki

Abrégé

[Problem] Provided is a method for manufacturing a stretchable circuit board, which can facilitate positioning of an external terminal and a stretchable wiring, and increase manufacturing yield of a stretchable circuit board. a located on one side of a stretchable base 53; and a step in which the stretchable wiring portion 55 is positioned with the external terminal 31, and pressure and heat are applied to the film base 33 and the stretchable wiring portion 55 to join them, whereby the external terminal 31 and the stretchable wiring portion 55 are connected with each other.

Classes IPC  ?

  • H05K 1/02 - Circuits imprimés Détails
  • H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
  • H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

89.

Manufacturing method of multilayer printed wiring board

      
Numéro d'application 15691866
Numéro de brevet 10004148
Statut Délivré - en vigueur
Date de dépôt 2017-08-31
Date de la première publication 2017-12-21
Date d'octroi 2018-06-19
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Takano, Shoji
  • Matsuda, Fumihiko

Abrégé

A wiring substrate is manufactured by attaching an adhesive protective film to a metal-foiled laminate sheet, forming bottomed via holes by partially removing the film and an insulating film, filling conductive pastes into the holes, and peeling the film. A wiring substrate is manufactured by forming an adhesive protective layer so as to cover a patterned metal foil on a metal-foiled laminate sheet, forming bottomed step via holes by partially removing the layer and an insulating film, filling conductive pastes into the holes, and peeling off a protective film. The wiring substrate and the second wiring substrate are laminated in such a way that protruding parts of the pastes come into contact with respective protruding parts of the pastes.

Classes IPC  ?

  • H01K 3/10 - Machines à cet effet
  • H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
  • H05K 3/46 - Fabrication de circuits multi-couches
  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
  • H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
  • H05K 3/06 - Élimination du matériau conducteur par voie chimique ou électrolytique, p. ex. par le procédé de photo-décapage

90.

MEKTEC

      
Numéro de série 87624314
Statut Enregistrée
Date de dépôt 2017-09-27
Date d'enregistrement 2018-09-11
Propriétaire MEKTEC CORPORATION (Japon)
Classes de Nice  ? 09 - Appareils et instruments scientifiques et électriques

Produits et services

Circuit boards; flexible circuit boards; printed circuit boards (PCBs); electric and electronic circuits; printed circuits

91.

Stretchable circuit board and method for manufacturing the same

      
Numéro d'application 15436960
Numéro de brevet 10076025
Statut Délivré - en vigueur
Date de dépôt 2017-02-20
Date de la première publication 2017-08-24
Date d'octroi 2018-09-11
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Iwase, Masayuki

Abrégé

A stretchable circuit board includes plural stretchable bases, and plural stretchable wiring portions, at least one of which is provided on each of main surfaces, facing each other, of the plural stretchable bases, in which the stretchable wiring portions provided on the main surfaces are electrically continuous with each other through a connecting portion.

Classes IPC  ?

  • H05K 1/02 - Circuits imprimés Détails
  • H05K 3/38 - Amélioration de l'adhérence entre le substrat isolant et le métal
  • H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
  • H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
  • H05K 3/46 - Fabrication de circuits multi-couches
  • H05K 1/03 - Emploi de matériaux pour réaliser le substrat
  • H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur

92.

Extensible flexible printed circuit board and method for manufacturing extensible flexible printed circuit board

      
Numéro d'application 15503560
Numéro de brevet 10136514
Statut Délivré - en vigueur
Date de dépôt 2015-04-06
Date de la première publication 2017-08-10
Date d'octroi 2018-11-20
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Yoshida, Akio
  • Igarashi, Kiyoshi
  • Muromoto, Shingo
  • Kimura, Taisuke
  • Shintaku, Nobuyuki

Abrégé

An extensible flexible printed circuit board sets one or a plurality of flexible printed circuit boards each including a plurality of conductive layers and an insulating layer as a base circuit board, and includes: component mounting parts which are provided at least at parts of the base circuit board, and capable of mounting electronic components; an extensible conductive part which is provided at least at a part of the base circuit board, includes a plurality of joint parts each intersecting a center line in an extension/contraction direction and a plurality of curved parts each continuing from an end part of each joint part and curve, and exhibits extensibility by the curved parts curving to open or close; and a covering member whose material is a flexibly deformable elastomer, and which covers the component mounting parts and the extensible conductive part.

Classes IPC  ?

  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
  • H05K 3/28 - Application de revêtements de protection non métalliques
  • H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
  • H05K 3/46 - Fabrication de circuits multi-couches
  • H05K 1/03 - Emploi de matériaux pour réaliser le substrat
  • H05K 1/18 - Circuits imprimés associés structurellement à des composants électriques non imprimés

93.

Stretchable circuit board and method for manufacturing stretchable circuit board

      
Numéro d'application 15278558
Numéro de brevet 09961766
Statut Délivré - en vigueur
Date de dépôt 2016-09-28
Date de la première publication 2017-04-06
Date d'octroi 2018-05-01
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Iwase, Masayuki

Abrégé

A stretchable circuit board includes a stretchable base, a stretchable wiring portion, a reinforcement base having in-plane rigidity higher than that of the stretchable base, and a draw-out wiring portion. The stretchable wiring portion having stretchability is formed on a main surface located on at least one side of the stretchable base. The draw-out wiring portion is formed at least on a main surface that is one side of the reinforcement base. The main surface of the reinforcement base is overlaid with a part of an area where the stretchable wiring portion is formed, in which the main surface faces the main surface of the stretchable base. A part of the stretchable wiring portion and a part of the draw-out wiring portion are joined together, and they are electrically continuous.

Classes IPC  ?

  • H05K 1/00 - Circuits imprimés
  • H05K 1/02 - Circuits imprimés Détails
  • H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
  • H05K 1/03 - Emploi de matériaux pour réaliser le substrat
  • H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique

94.

Pressure sensor capable of suppressing dispersion in the initial load of pressure

      
Numéro d'application 15222166
Numéro de brevet 10359326
Statut Délivré - en vigueur
Date de dépôt 2016-07-28
Date de la première publication 2017-03-30
Date d'octroi 2019-07-23
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Toyoshima, Ryoichi
  • Toyama, Keizo
  • Ohdate, Hirokazu
  • Iwase, Masayuki

Abrégé

This invention provides a pressure sensitive element capable of suppressing dispersion in the initial load for pressure sensing among the sensor electrodes or among the pressure sensors. The pressure sensitive element has a support substrate, a sensor electrode, a pressure sensing film and an insulating layer. The pressure sensing film is arranged opposing to the sensor electrode. The insulating layer has an opening and is provided between the support substrate and the pressure sensing film. At least a part of an opening edge of the opening is fallen on the sensor electrode. An exposed part as a part of the sensor electrode is exposed inside the opening, while leaving a buried part as the other part of the sensor electrode buried under the insulating layer.

Classes IPC  ?

  • G01L 1/00 - Mesure des forces ou des contraintes, en général
  • G01L 5/00 - Appareils ou procédés pour la mesure des forces, du travail, de la puissance mécanique ou du couple, spécialement adaptés à des fins spécifiques
  • G01L 1/20 - Mesure des forces ou des contraintes, en général en mesurant les variations de la résistance ohmique des matériaux solides ou des fluides conducteurs de l'électricitéMesure des forces ou des contraintes, en général en faisant usage des cellules électrocinétiques, c.-à-d. des cellules contenant un liquide, dans lesquelles un potentiel électrique est produit ou modifié par l'application d'une contrainte

95.

Stretchable circuit board

      
Numéro d'application 15206821
Numéro de brevet 09763323
Statut Délivré - en vigueur
Date de dépôt 2016-07-11
Date de la première publication 2017-02-02
Date d'octroi 2017-09-12
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Iwase, Masayuki

Abrégé

Provided is a stretchable circuit board having a sheet-like stretchable base capable of stretching and contracting, a stretchable interconnect part formed on or above at least one major surface of the stretchable base, and an external terminal connected to the interconnect part; the stretchable circuit board has a reinforcing area having in-plane rigidity higher than that of the stretchable base, and a stretchable area which remains after excluding the reinforcing area; the interconnect part is formed across a boundary part between the reinforcing area and the stretchable area; and a sheet-like stretchable auxiliary member capable of stretching and contracting is provided to the boundary part having the interconnect part formed therein.

Classes IPC  ?

  • H05K 1/00 - Circuits imprimés
  • H05K 1/02 - Circuits imprimés Détails
  • A61B 5/11 - Mesure du mouvement du corps entier ou de parties de celui-ci, p. ex. tremblement de la tête ou des mains ou mobilité d'un membre
  • A61B 5/0402 - Electrocardiographie, c. à d. ECG
  • A61B 5/024 - Mesure du pouls ou des pulsations cardiaques
  • A61B 5/021 - Mesure de la pression dans le cœur ou dans les vaisseaux sanguins
  • A61B 5/01 - Mesure de la température de parties du corps
  • A61B 5/00 - Mesure servant à établir un diagnostic Identification des individus

96.

Manufacturing method of flexible printed wiring board

      
Numéro d'application 15107931
Numéro de brevet 10149392
Statut Délivré - en vigueur
Date de dépôt 2015-02-16
Date de la première publication 2016-12-15
Date d'octroi 2018-12-04
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Matsuda, Fumihiko

Abrégé

b where the pattern 5 is exposed inside by partially removing the printing plate layer 6, a step of printing conductive paste with the printing plate layer 6 as a printing mask, and filling the conductive paste 8 inside the blind holes, and a step of peeling off the printing plate layer 6 from the metal foil clad laminate 1.

Classes IPC  ?

  • H05K 3/02 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué à la surface du support isolant et est ensuite enlevé de zones déterminées de la surface, non destinées à servir de conducteurs de courant ou d'éléments de blindage
  • H05K 1/02 - Circuits imprimés Détails
  • H05K 3/24 - Renforcement du parcours conducteur
  • H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
  • H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés

97.

Pressure sensing element and pressure sensor

      
Numéro d'application 14904782
Numéro de brevet 10048141
Statut Délivré - en vigueur
Date de dépôt 2014-12-24
Date de la première publication 2016-11-10
Date d'octroi 2018-08-14
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Iwase, Masayuki
  • Toyama, Keizo
  • Ozaki, Kazuyuki
  • Ohdate, Hirokazu
  • Kimura, Taisuke
  • Toyoshima, Ryoichi

Abrégé

Provided is a pressure sensing element configured to be flexible, and capable of demonstrating a stable electrical reliability over a long period; and, a pressure sensor having such pressure sensing element. A pressure sensing element (100) has an electro-conductive pressure sensing film (14), a sensor electrode (12) provided at a position faced to the pressure sensing film (14), and an insulating layer (13) which creates a predetermined distance “A” between the pressure sensing film (14) and the sensor electrode (12) so as to keep them apart from each other, the pressure sensing film (14) being a resin film containing carbon particles (140); and, a pressure sensor (200) has the pressure sensing element (100), and a detection unit (210) which is electrically connected with the pressure sensing element (100) so as to detect contact resistance between the pressure sensing film (14) and the sensor electrode (12).

Classes IPC  ?

  • G01L 1/04 - Mesure des forces ou des contraintes, en général en mesurant la déformation élastique de jauges, p. ex. de ressorts
  • G01L 1/22 - Mesure des forces ou des contraintes, en général en mesurant les variations de la résistance ohmique des matériaux solides ou des fluides conducteurs de l'électricitéMesure des forces ou des contraintes, en général en faisant usage des cellules électrocinétiques, c.-à-d. des cellules contenant un liquide, dans lesquelles un potentiel électrique est produit ou modifié par l'application d'une contrainte en utilisant des jauges de contrainte à résistance
  • A61B 5/103 - Dispositifs de mesure pour le contrôle de la forme, du dessin, de la dimension ou du mouvement du corps ou de parties de celui-ci, à des fins de diagnostic
  • A61B 5/11 - Mesure du mouvement du corps entier ou de parties de celui-ci, p. ex. tremblement de la tête ou des mains ou mobilité d'un membre
  • G01L 1/20 - Mesure des forces ou des contraintes, en général en mesurant les variations de la résistance ohmique des matériaux solides ou des fluides conducteurs de l'électricitéMesure des forces ou des contraintes, en général en faisant usage des cellules électrocinétiques, c.-à-d. des cellules contenant un liquide, dans lesquelles un potentiel électrique est produit ou modifié par l'application d'une contrainte

98.

Manufacturing method of multilayer printed wiring board

      
Numéro d'application 15022292
Numéro de brevet 09788439
Statut Délivré - en vigueur
Date de dépôt 2014-03-26
Date de la première publication 2016-10-06
Date d'octroi 2017-10-10
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Takano, Shoji
  • Matsuda, Fumihiko

Abrégé

A wiring substrate is manufactured by attaching an adhesive protective film to a metal-foiled laminate sheet, forming bottomed via holes by partially removing the film and an insulating film, filling conductive pastes into the holes, and peeling the film. A wiring substrate is manufactured by forming an adhesive protective layer so as to cover a patterned metal foil on a metal-foiled laminate sheet, forming bottomed step via holes by partially removing the layer and an insulating film, filling conductive pastes into the holes, and peeling off a protective film. The wiring substrate and the second wiring substrate are laminated in such a way that protruding parts of the pastes come into contact with respective protruding parts of the pastes.

Classes IPC  ?

  • H05K 3/20 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché par apposition d'un parcours conducteur préfabriqué
  • H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
  • H05K 3/46 - Fabrication de circuits multi-couches
  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
  • H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
  • H05K 3/06 - Élimination du matériau conducteur par voie chimique ou électrolytique, p. ex. par le procédé de photo-décapage

99.

Filling method of conductive paste and manufacturing method of multi-layer printed circuit board

      
Numéro d'application 14892345
Numéro de brevet 10321578
Statut Délivré - en vigueur
Date de dépôt 2014-11-10
Date de la première publication 2016-03-31
Date d'octroi 2019-06-11
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s)
  • Takano, Shoji
  • Matsuda, Fumihiko

Abrégé

A filling method of conductive paste includes a step of providing a protective film on a principal surface of a metal foil clad laminated sheet, a step of forming bottomed via holes, a step of removing the film from a surface to a midway thereof to form a conductive paste flowing groove having the via holes, a step of disposing a housing member on the film, and thereby, causing a conductive paste injecting channel and a vacuum evacuating channel to communicate with a conductive paste flowing space S, a step of depressurizing the space S via the channel, and a step of injecting conductive paste into the space S via the channel, and thereby, filling an inside of the via holes with the conductive paste.

Classes IPC  ?

  • B29C 31/04 - Alimentation, p. ex. chargement d'une cavité de moulage
  • H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
  • H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
  • B23K 3/06 - Dispositifs d'alimentation en métal d'apportCuves de fusion du métal d'apport
  • B29C 33/00 - Moules ou noyauxLeurs détails ou accessoires
  • H05K 3/40 - Fabrication d'éléments imprimés destinés à réaliser des connexions électriques avec ou entre des circuits imprimés
  • H05K 3/46 - Fabrication de circuits multi-couches
  • B29C 45/26 - Moules
  • B29C 45/00 - Moulage par injection, c.-à-d. en forçant un volume déterminé de matière à mouler par une buse d'injection dans un moule ferméAppareils à cet effet
  • H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique

100.

Method of manufacturing flexible printed circuit board with component mounting section for mounting electronic component and flexible cable sections extending in different directions from the component mounting section

      
Numéro d'application 14868609
Numéro de brevet 10383224
Statut Délivré - en vigueur
Date de dépôt 2015-09-29
Date de la première publication 2016-02-11
Date d'octroi 2019-08-13
Propriétaire MEKTEC CORPORATION (Japon)
Inventeur(s) Matsuda, Fumihiko

Abrégé

[Problem] To allow an efficient sheet layout of a flexible printed circuit board having a plurality of cable sections extending in different directions and to improve a yield. a) through the wiring, the method including manufacturing partial FPCs in a sheet in a unit of a partial FPC that includes a partial component mounting section (1A) that is a part of the component mounting section, a cable section (2) extending from the partial component mounting section (1A), and a connection section (3) disposed in the cable section (2), cutting out the partial FPC (4A) from the sheet, performing an alignment using alignment targets (29, 30) of the partial FPC (4A) and a support plate (5) so that the partial component mounting sections (1A) of respective partial FPCs (4A) configure the component mounting section (1), and fixing the partial FPCs (4A) onto the support plate.

Classes IPC  ?

  • H05K 1/11 - Éléments imprimés pour réaliser des connexions électriques avec ou entre des circuits imprimés
  • H05K 1/14 - Association structurale de plusieurs circuits imprimés
  • H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
  • H05K 1/02 - Circuits imprimés Détails
  • H05K 1/03 - Emploi de matériaux pour réaliser le substrat
  • H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
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