To provide a resin mold which is excellent in adhesion to a substrate, excellent in release properties from a transfer material resin, further excellent in durability of the resin mold itself, and which endures repetition transfer to the transfer material resin, a resin mold of the invention is a resin mold having a fine concavo-convex structure on the surface, and is characterized in that the fluorine element concentration (Es) in a resin mold surface portion is the average fluorine element concentration (Eb) in the resin forming the resin mold or more.
B82Y 10/00 - Nanotechnologie pour le traitement, le stockage ou la transmission d’informations, p. ex. calcul quantique ou logique à un électron
B82Y 40/00 - Fabrication ou traitement des nanostructures
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
2.
Polyolefin-based porous film and method for producing the same
A method for producing a polyolefin-based porous film includes an (A) step: a raw fabric forming step for forming a non-porous raw fabric from a polyolefin-based resin composition, a (B) step: an MD cold stretching step for cold stretching the non-porous raw fabric obtained in the (A) step at a temperature of −20° C. to (Tm−30)° C. (Tm is a melting point (° C.) of the non-porous raw fabric) in an extruding direction (MD) of the raw fabric to make the raw fabric porous; a (D) step: a TD cold stretching step for cold stretching a film processed in the (B) step in a direction (TD) perpendicular to the MD, and an (H) step: a thermal fixing step, in the above order.
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
The problem addressed by the present invention is to obtain an electrolyte membrane that, as an electrolyte membrane for a redox flow secondary battery, is able to suppress the ion permeability of an active substance without detracting from proton (H+) permeability, has superior ion-selective permeability, has low electrical resistivity, and has superior current efficiency. The present invention solves the abovementioned problem by means of the electrolyte membrane for a redox flow secondary battery containing a perfluorocarbon sulfonic acid resin having a specific structure and an equivalent weight (EW), and the ion conductivity being adjusted to a predetermined range.
H01M 8/1039 - Matériaux d’électrolyte polymère halogénés, p. ex. des fluorures de polyvinylidène sulfonés
H01M 8/1023 - Matériaux d’électrolyte polymère caractérisés par la structure chimique de la chaîne principale du polymère conducteur ionique comprenant uniquement du carbone, p. ex. des polyarylènes, des polystyrènes ou des polybutadiène-styrènes
H01M 8/18 - Éléments à combustible à régénération, p. ex. batteries à flux REDOX ou éléments à combustible secondaires
H01M 8/20 - Éléments à combustible indirects, p. ex. éléments à combustible avec un couple REDOX irréversible
The onium salt of the present invention contains predetermined compound A represented by the general formula (1). The composition of the present invention contains the onium salt of the present invention, and an onium salt containing predetermined compound B represented by the general formula (2). The onium salt and the composition of the present invention exert well-balanced excellent physical properties in terms of cold curing properties, storage stability, thermal shock resistance after curing, and moisture resistance.
C08F 2/46 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
C08G 61/04 - Composés macromoléculaires contenant uniquement des atomes de carbone dans la chaîne principale de la molécule, p. ex. polyxylylènes uniquement des atomes de carbone aliphatiques
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C07C 309/06 - Acides sulfoniques ayant des groupes sulfo liés à des atomes de carbone acycliques d'un squelette carboné acyclique saturé contenant des atomes d'halogène ou des groupes nitro ou nitroso liés au squelette carboné
A semiconductor light emitting device, which can endure a dicing step for singulation, is superior in resistance to a high/low thermal cycle, and exhibits a high light extraction efficiency, and an optical film, which can be used favorably for producing the semiconductor light emitting device, are to be provided. The invention provides a semiconductor light emitting device comprising a semiconductor layer, an A layer, and a B layer, in which the semiconductor light emitting device is configured such that at least a part of emitted light from the semiconductor layer is emitted outward from the B layer through the A layer, the thickness of the A layer is from 1 nm to 200 nm, the B layer has a first major surface and a second major surface, while the first major surface faces the A layer and the second major surface has a concave-convex microstructure, the B layer contains an inorganic substance at 60 mass-% or more on the basis of the total mass of the B layer, and the content of an inorganic substance present in the A layer is lower than the content of the inorganic substance present in the B layer.
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
H01L 33/58 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique
H01L 33/22 - Surfaces irrégulières ou rugueuses, p.ex. à l'interface entre les couches épitaxiales
H01L 33/44 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les revêtements, p.ex. couche de passivation ou revêtement antireflet
6.
Polyolefin-based porous film and method for producing the same
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
The present invention provides an epoxy resin composition including an epoxy resin represented by the following formula (1) and an epoxy resin represented by the following formula (2):
An onium salt according to the present invention comprises a compound (A) represented by given general formula (1). A composition according to the present invention comprises the onium salt according to the present invention and an onium salt that comprises a compound (B) represented by given general formula (2). Each of the onium salt and the composition according to the present invention exhibits excellent properties including low-temperature curability, storage stability, thermal shock resistance after curing and moisture resistance and has a good balance among the above-mentioned properties.
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
9.
Coating composition, coating film, laminate, and process for manufacturing the laminate
Provided is a coating composition excellent in antifouling properties, transparency and hydrophilicity, wherein the coating composition contains (A) a metal oxide particle having a number average particle size of 1 nm to 400 nm; and (B) a polymer particle, in which the content of an aqueous-phase component in the component (B), represented by the expression (I), is 20 mass % or less, where (I) (%)=(dry mass of a filtrate obtained by filtering the component (B) at a molecular cutoff of 50,000)×(100−total mass of solid content)/(mass of the filtrate−dry mass of the filtrate)×100/the total mass of solid content.
B05D 3/00 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides
C08F 230/08 - Copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule liaison double carbone-carbone et contenant du phosphore, du sélénium, du tellure ou un métal contenant un métal contenant du silicium
C08G 77/20 - Polysiloxanes contenant du silicium lié à des groupes aliphatiques non saturés
C09D 5/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, caractérisées par leur nature physique ou par les effets produitsApprêts en pâte
C09D 143/04 - Homopolymères ou copolymères de monomères contenant du silicium
C09D 147/00 - Compositions de revêtement à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, l'un au moins contenant plusieurs liaisons doubles carbone-carboneCompositions de revêtement à base de dérivés de tels polymères
G02B 1/10 - Revêtements optiques obtenus par application sur les éléments optiques ou par traitement de la surface de ceux-ci
C08F 220/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
C08G 77/00 - Composés macromoléculaires obtenus par des réactions créant dans la chaîne principale de la macromolécule une liaison contenant du silicium, avec ou sans soufre, azote, oxygène ou carbone
C08K 5/5415 - Composés contenant du silicium contenant de l'oxygène contenant au moins une liaison Si—O
C08K 5/5425 - Composés contenant du silicium contenant de l'oxygène contenant au moins une liaison C=C
10.
Coating composition, coating film, laminate and process for manufacturing the laminate
Provided is a coating composition excellent in antifouling properties, transparency and hydrophilicity, wherein the coating composition contains (A) a metal oxide particle having a number average particle size of 1 nm to 400 nm; and (B) a polymer particle, in which the content of an aqueous-phase component in the component (B), represented by the expression (I), is 20 mass % or less, where (I) (%)=(dry mass of a filtrate obtained by filtering the component (B) at a molecular cutoff of 50,000)×(100−total mass of solid content)/(mass of the filtrate−dry mass of the filtrate)×100/the total mass of solid content.
B05D 3/00 - Traitement préalable des surfaces sur lesquelles des liquides ou d'autres matériaux fluides doivent être appliquésTraitement ultérieur des revêtements appliqués, p. ex. traitement intermédiaire d'un revêtement déjà appliqué, pour préparer les applications ultérieures de liquides ou d'autres matériaux fluides
G02B 1/18 - Revêtements pour garder des surfaces optiques propres, p. ex. films hydrophobes ou photocatalytiques
C08F 230/08 - Copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule liaison double carbone-carbone et contenant du phosphore, du sélénium, du tellure ou un métal contenant un métal contenant du silicium
C08G 77/20 - Polysiloxanes contenant du silicium lié à des groupes aliphatiques non saturés
C09D 5/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, caractérisées par leur nature physique ou par les effets produitsApprêts en pâte
C09D 143/04 - Homopolymères ou copolymères de monomères contenant du silicium
C09D 147/00 - Compositions de revêtement à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, l'un au moins contenant plusieurs liaisons doubles carbone-carboneCompositions de revêtement à base de dérivés de tels polymères
G02B 1/10 - Revêtements optiques obtenus par application sur les éléments optiques ou par traitement de la surface de ceux-ci
C08F 220/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
C08G 77/00 - Composés macromoléculaires obtenus par des réactions créant dans la chaîne principale de la macromolécule une liaison contenant du silicium, avec ou sans soufre, azote, oxygène ou carbone
C08K 5/5415 - Composés contenant du silicium contenant de l'oxygène contenant au moins une liaison Si—O
C08K 5/5425 - Composés contenant du silicium contenant de l'oxygène contenant au moins une liaison C=C
11.
SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND OPTICAL FILM
Provided is: a semiconductor light-emitting element having the ability to withstand chip dicing, exceptional cooling/heating-cycle resistance, and high light-extraction efficiency; and an optical film that can suitably be used in the manufacture of the semiconductor light-emitting element. The present disclosure provides a semiconductor light-emitting element including a semiconductor layer, a layer A, and a layer B, wherein the semiconductor light-emitting element is configured so that at least a part of the emitted light from the semiconductor layer is released from the layer B via the layer A, the layer A has a thickness of 1-200 nm, the layer B has a first principal surface and a second principal surface, the first principal surface faces the layer A, the second principal surface has a fine convex/concave structure, the layer B contains 60 mass% or more of an inorganic material in relation to the total mass of the layer B, and the inorganic material content of the layer A is less than the inorganic material content of the layer B.
H01L 33/22 - Surfaces irrégulières ou rugueuses, p.ex. à l'interface entre les couches épitaxiales
H01L 33/44 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les revêtements, p.ex. couche de passivation ou revêtement antireflet
Provided is a prepreg suffering little resin particle fall-off and little resin peeling during prepreg production and during handling in order to have excellent dielectric properties for PPE and favorable adhesiveness. A PPE-containing prepreg constituted of a base material and a curable resin composition including PPE particles, wherein the prepreg is characterized in that (1) PPE extracted from the prepreg using a mixed solvent of toluene and methanol in a mass ratio of 95:5 includes PPE particles (A) insoluble in the mixed solvent, (2) the amount of PPE contained in the PPE particles (A) is 70 mass % or higher, and (3) the number-average molecular weight of the PPE contained in the PPE particles (A) is 8,000-40,000.
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
C08J 5/24 - Imprégnation de matériaux avec des prépolymères pouvant être polymérisés en place, p. ex. fabrication des "prepregs"
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
B32B 7/06 - Liaison entre couches permettant une séparation sans difficultés
B32B 15/20 - Produits stratifiés composés essentiellement de métal comportant de l'aluminium ou du cuivre
B32B 27/20 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des charges, des pigments, des agents thixotropiques
B32B 27/32 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyoléfines
B32B 27/28 - Produits stratifiés composés essentiellement de résine synthétique comprenant des copolymères de résines synthétiques non complètement couverts par les sous-groupes suivants
13.
Resin composition, layered product, multilayer printed wiring board, multilayer flexible wiring board and manufacturing method of the same
2 or less in storing at 40° C. for 2 weeks after the heat history of 180° C. for 60 minutes, and (d) a thermogravimetric decrease at 260° C. is 2.0% or less in measuring on a temperature rising condition of 10° C./min from 40° C. by thermogravimetric analysis (TG). When a multilayer flexible wiring board is manufactured using the resin composition, it is possible to obtain the resin layer excellent in alkali processability, embeddability in press, heat resistance, bendability, insulation reliability, and adhesion to the conductive layer.
C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide-acides ou précurseurs similaires de polyimides
B32B 27/28 - Produits stratifiés composés essentiellement de résine synthétique comprenant des copolymères de résines synthétiques non complètement couverts par les sous-groupes suivants
A method for manufacturing an electrolyte solution comprises: a supplying step of continuously supplying an emulsion containing a polymer electrolyte and a solvent into dissolving equipment; and a dissolving step of heating the inside of the dissolving equipment and continuously dissolving the polymer electrolyte in the solvent to obtain an electrolyte solution.
H01B 1/06 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement d'autres substances non métalliques
H01M 4/86 - Électrodes inertes ayant une activité catalytique, p. ex. pour piles à combustible
H01M 8/10 - Éléments à combustible avec électrolytes solides
15.
SEPARATOR FOR NONAQUEOUS ELECTROLYTE BATTERIES, AND NONAQUEOUS ELECTROLYTE BATTERY
A separator for nonaqueous electrolyte batteries, which comprises a multilayer porous membrane that is provided with: a polyolefin microporous membrane; and a porous layer that contains an inorganic filler and is provided on at least one surface of the polyolefin microporous membrane. This separator for nonaqueous electrolyte batteries is characterized in that with respect to pores having an area of 0.01 μm2 or more in a cross-section of the porous layer of the multilayer porous membrane, not less than 30% of the pores have an angle θ satisfying 60° ≤ θ ≤ 120°, said angle θ being the angle between the major axis of each pore and an axis that is parallel to the interface between the microporous membrane and the porous layer.
A semiconductor light-emitting device constituted by: a semiconductor light-emitting element (100) emitting a first light, having a layered semiconductor layer (110) constituted by layering at least two or more semiconductor layers (103) (105) and a light-emitting layer (104); and a wavelength conversion member covering at least a portion of the semiconductor light-emitting element (100), absorbing at least a portion of the first light and emitting a second light having a wavelength different from the first light. The device is characterized in that, as a constitutive element on any of the main planes constituting the semiconductor light-emitting element (100), the semiconductor light-emitting element (100) is provided with a microstructural layer containing dots constituted from a plurality of depressions or protrusions extending outward from the plane, the microstructural layer constituting a two-dimensional photonic crystal (102) defined by any of at least the pitch between the dots, the dot diameter or the dot height, the two-dimensional photonic crystal (102) having at least two or more periods of 1 μm or greater each.
H01L 33/22 - Surfaces irrégulières ou rugueuses, p.ex. à l'interface entre les couches épitaxiales
H01L 33/50 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de conversion de la longueur d'onde
H01L 33/58 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments de mise en forme du champ optique
17.
LED PATTERN WAFER, LED EPITAXIAL WAFER, AND PRODUCTION METHOD FOR LED EPITAXIAL WAFER
An LED pattern wafer (10) comprising an uneven structure A (20) having a substantially n-times symmetrical array on at least part of the main surface thereof. At least part of the uneven structure A (20) has a rotation shift angle (Θ) for an array axis (A) of the uneven structure A (20) relative to the crystal axis direction inside the main surface, that fulfills 0° < Θ ≤ (180/n)°. A protrusion peak of the uneven structure A (20) is a corner section having a radius of curvature exceeding 0. Laminated upon the uneven structure A (20) are, in order, a first semiconductor layer (30), a light-emitting semiconductor layer (40), and a second semiconductor layer (50), configuring an LED epitaxial wafer (100). As a result, an LED pattern wafer and an LED epitaxial wafer having improved cracking and internal quantum efficiency (IQE) can be provided.
H01L 33/22 - Surfaces irrégulières ou rugueuses, p.ex. à l'interface entre les couches épitaxiales
H01L 21/205 - Dépôt de matériaux semi-conducteurs sur un substrat, p. ex. croissance épitaxiale en utilisant la réduction ou la décomposition d'un composé gazeux donnant un condensat solide, c.-à-d. un dépôt chimique
H01L 21/3065 - Gravure par plasmaGravure au moyen d'ions réactifs
18.
Photosensitive resin composition, method for producing hardened relief pattern, semiconductor device and display device
C08L 65/00 - Compositions contenant des composés macromoléculaires obtenus par des réactions créant une liaison carbone-carbone dans la chaîne principaleCompositions contenant des dérivés de tels polymères
G03F 7/023 - Quinonediazides macromoléculairesAdditifs macromoléculaires, p. ex. liants
C08G 16/02 - Polymères de condensation d'aldéhydes ou de cétones avec des monomères non prévus dans les groupes d'aldéhydes
C08L 61/12 - Polymères de condensation obtenus uniquement à partir d'aldéhydes ou de cétones avec des phénols d'aldéhydes avec des phénols avec des phénols polyhydriques
A material (1) to be etched is provided with a mask layer (12) on a substrate (11), the mask layer having a pattern of a width no greater than 2 µm and an aspect ratio of 0.1-5.0. Also, the total thermal resistance value when mounted on a mounting member (2) used during etching is no greater than 6.79×10-3(m2·K/W). Here, the total thermal resistance value is the sum of the thermal resistance value of the mounting member (2) in the mounting region (X) of the mounting member (2) for the material (1) to be etched, the thermal resistance value of the substrate (11), and, when other members than the material (1) to be etched are present on the mounting member (2), the thermal resistance value of the other members; each thermal resistance value being the value obtained by dividing the thickness of each member by the thermal conductivity (λ) of the materials constituting the member. The material (1) to be etched is etched via the mask layer (12), whereby the desired microrelief structure is formed on the substrate (11).
Disclosed is a laminated separator including a first polyolefin microporous layer and a second polyolefin microporous layer which is laminated on the first polyolefin microporous layer and which is different from the first polyolefin microporous layer, wherein at least one of the first microporous layer and the second microporous layer includes an inorganic particle having a primary particle size of 1 nm or more and 80 nm or less.
H01M 2/16 - Séparateurs; Membranes; Diaphragmes; Eléments d'espacement caractérisés par le matériau
H01M 2/18 - Séparateurs; Membranes; Diaphragmes; Eléments d'espacement caractérisés par la forme
B29C 47/00 - Moulage par extrusion, c. à d. en exprimant la matière à mouler dans une matrice ou une filière qui lui donne la forme désirée; Appareils à cet effet (moulage par extrusion-soufflage B29C 49/04)
B29C 67/20 - Techniques de façonnage non couvertes par les groupes , ou pour la fabrication d'objets poreux ou cellulaires, p. ex. des mousses plastiques, des mousses alvéolaires
B32B 27/08 - Produits stratifiés composés essentiellement de résine synthétique comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique d'une résine synthétique d'une sorte différente
B32B 27/20 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des charges, des pigments, des agents thixotropiques
B32B 27/32 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyoléfines
B32B 27/18 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
The disclosure provides a laminated polyolefin microporous membrane having propylene-α-olefin copolymer and methods of producing the same. The laminated polyolefin microporous membrane has a two-type three layer structure in which first polyolefin microporous layers are surface layers and a second polyolefin microporous layer is an intermediate layer which is different from the first polyolefin microporous layer.
B29C 67/20 - Techniques de façonnage non couvertes par les groupes , ou pour la fabrication d'objets poreux ou cellulaires, p. ex. des mousses plastiques, des mousses alvéolaires
B32B 27/08 - Produits stratifiés composés essentiellement de résine synthétique comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique d'une résine synthétique d'une sorte différente
B32B 27/18 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers
B32B 27/20 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des charges, des pigments, des agents thixotropiques
B32B 27/32 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyoléfines
B29C 47/00 - Moulage par extrusion, c. à d. en exprimant la matière à mouler dans une matrice ou une filière qui lui donne la forme désirée; Appareils à cet effet (moulage par extrusion-soufflage B29C 49/04)
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
Disclosed is a laminated polyolefin microporous membrane having a two-type three-layer structure in which first polyolefin microporous layers are surface layers and a second polyolefin microporous layer is an intermediate layer which is different from the first polyolefin microporous layer, in which at least one of the first polyolefin microporous layers and the second polyolefin microporous layer comprises a polypropylene-based resin in which a mass ratio of polypropylene to propylene copolymer is 0 or more and 2.29 or less, and a melting point of the polypropylene copolymer is 120° C. or higher and 145° C. or lower. Also disclosed is a method of making the same.
H01M 2/16 - Séparateurs; Membranes; Diaphragmes; Eléments d'espacement caractérisés par le matériau
H01M 2/18 - Séparateurs; Membranes; Diaphragmes; Eléments d'espacement caractérisés par la forme
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
B29C 47/00 - Moulage par extrusion, c. à d. en exprimant la matière à mouler dans une matrice ou une filière qui lui donne la forme désirée; Appareils à cet effet (moulage par extrusion-soufflage B29C 49/04)
B29C 67/20 - Techniques de façonnage non couvertes par les groupes , ou pour la fabrication d'objets poreux ou cellulaires, p. ex. des mousses plastiques, des mousses alvéolaires
B32B 27/08 - Produits stratifiés composés essentiellement de résine synthétique comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique d'une résine synthétique d'une sorte différente
B32B 27/18 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers
B32B 27/32 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyoléfines
B32B 27/20 - Produits stratifiés composés essentiellement de résine synthétique caractérisée par l'emploi d'additifs particuliers utilisant des charges, des pigments, des agents thixotropiques
d) is set at 0.8 time to 1.3 time the pitch P1. With the wire grid polarizing plate (10) in a liquid crystal display device, high image quality can be achieved.
G03B 21/00 - Projecteurs ou visionneuses du type par projectionLeurs accessoires
24.
RESIN PRECURSOR, RESIN COMPOSITION CONTAINING SAID RESIN PRECURSOR, RESIN FILM, METHOD FOR PRODUCING SAID RESIN FILM, LAMINATE, AND METHOD FOR PRODUCING SAID LAMINATE
Provided is a resin precursor, said resin precursor enabling the production of a transparent cured resin article without requiring a particular combination of solvents, and also enabling the production of a cured resin article which generates a small residual stress between the cured resin article and an inorganic film and has excellent chemical resistance and has a YI value and a total light transmittance that are less affected by the concentration of oxygen during a curing process. A resin precursor which is produced by polymerizing a polymerization component containing an amino group and a group reactive with an amino group, wherein the polymerization component comprises a polyvalent compound having at least two groups independently selected from an amino group and a group reactive with an amino group, the polyvalent compound comprises a compound containing a silicon group, the polyvalent compound contains a diamine represented by formula (1), the structure of the resin precursor is represented by general formula (2), and the amount of the compound containing a silicon group is 6 to 25 mass% relative to the whole mass of the polyvalent compound.
Provided are a pellicle film and a pellicle which exhibit excellent transmittance with respect to extreme ultraviolet (EUV) light, and sufficient physical strength and durability in practical use, and with which film fragments can be easily removed, and excellent productivity can be achieved. A pellicle film (1) is configured using a carbon porous-body film, and has a film thickness (D) in the range of 100 nm - 63 µm.
Provided is a photosensitive resin laminate roll which enables foreign bodies to be easily eliminated from the end surfaces of the photosensitive resin laminate roll when said roll is being unpacked. This photosensitive resin laminate roll comprises: a photosensitive resin laminate wound into a roll shape onto a winding core; and roll end surface protective members disposed so as to be in contact with the end surfaces of the wound photosensitive resin laminate. The roll end surface protective members each have an adhesive composition on the side that is in contact with the roll end surface. The photosensitive resin laminate includes at least a support layer, and a photosensitive resin layer laminated on the support layer.
B65D 59/00 - Bouchons, manchons, capuchons ou éléments analogues rigides ou semi-rigides, pour protéger des parties d'objets ou pour les mettre en paquets, p. ex. protecteurs pour filets de vis, protecteurs d'angles, chapeaux pour tubes ou pour faisceaux d'objets en forme de baguette
B32B 7/02 - Propriétés physiques, chimiques ou physicochimiques
B32B 27/00 - Produits stratifiés composés essentiellement de résine synthétique
B65D 81/30 - Adaptations pour empêcher la détérioration ou l'altération du contenuApplications au réceptacle ou au matériau d'emballage d'agents de conservation des aliments, de fongicides, d'insecticides ou de produits repoussant les animaux en excluant la lumière ou toute autre radiation extérieure
B65D 85/672 - Réceptacles, éléments d'emballage ou paquets spécialement adaptés à des objets ou à des matériaux particuliers pour matériaux du genre bande ou ruban enroulés en spirale plate sur noyaux
B65H 75/28 - Agencements pour fixer les extrémités du matériau
A polyimide precursor useful for the production of a polyimide film which is colorless and transparent, has a low residual stress that is generated between the polyimide film and an inorganic film, and has excellent mechanical properties and thermal properties. The polyimide precursor is produced from a diamine-containing monomer component represented by formula (A) and has a structural unit represented by general formula (B) [wherein multiple R3's and R4's independently represent a monovalent organic group having 1 to 20 carbon atoms; and h represents an integer of 3 to 200]. The polyimide precursor is characterized in that a polyimide resin can be produced by curing the polyimide precursor by heating, wherein the resultant polyimide resin has at least one glass transition temperature in a temperature range from 150 to 380˚C, has no glass transition temperature in a temperature range from 0 to 150˚C (exclusive), has an imide group concentration of 2.00 to 3.70 mmol/g and may contain a solvent.
The purpose of the present invention is to provide a coating material capable of preventing the adhesion of barnacles and other marine organisms. A coating material for ship bottoms is mixed with an aqueous chlorine dioxide solution. In this manner, a coating material capable of preventing the adhesion of marine organisms can be produced. The coating material (4) for preventing the adhesion of marine organisms is applied onto the bottom part of a ship or a boat or the surface of a marine structure, an undersea facility or the like, whereby it becomes possible to prevent the adhesion of barnacles (8), mahogany clams, moss animals, algae and other marine organisms effectively.
This redox flow secondary battery is provided with an electrolytic cell that comprises a positive electrode cell chamber, a negative electrode cell chamber and a separation membrane that separates the positive electrode cell chamber and the negative electrode cell chamber from each other. In addition, the redox flow secondary battery is configured as follows: the separation membrane has a microporous membrane and an ion exchange resin layer that is in contact with the microporous membrane; the air resistance of the separation membrane per a thickness of 200 μm is 10,000 seconds/100 cc or more; the microporous membrane contains a polyolefin resin or a vinylidene fluoride resin and an inorganic filler; and at least a surface of the microporous membrane, said surface being in contact with the ion exchange resin layer, has a smoothness of 16,000 seconds or less.
The present invention can provide a resin composition, a laminate, a method for producing a laminate, and a method for producing a flexible device, whereby sufficient adhesion is achieved between a resin layer and an inorganic substrate during the course of producing a flexible device, and only the inorganic substrate can be easily peeled off from the resin layer in the final stage. Further, the present invention can provide a substrate for flexible devices and a flexible device using said substrate, wherein variations in film thickness are small and the device is less prone to malfunction when the device is constructed.
B32B 17/10 - Produits stratifiés composés essentiellement d'une feuille de verre ou de fibres de verre, de scorie ou d'une substance similaire comprenant du verre comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
B32B 27/34 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyamides
The purpose of this invention is to provide a multilayer porous film having a low heat shrinkage rate and a method for manufacturing same, and a separator for a non-aqueous electrolyte cell provided with the multilayer porous film. A multilayer porous film having: a polyolefin porous film; and a porous layer containing an inorganic filler, a resin binder, and an ion dissociative inorganic dispersant, the porous layer being provided on one or both sides of the polyolefin porous film.
B32B 27/32 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyoléfines
B32B 5/32 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par la présence de plusieurs couches qui comportent des fibres, filaments, grains ou poudre, ou qui sont sous forme de mousse ou essentiellement poreuses les deux couches étant sous forme de mousse ou essentiellement poreuses
C08J 9/28 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement par élimination d'une phase liquide d'un objet ou d'une composition macromoléculaire, p. ex. par séchage du coagulum
H01M 2/16 - Séparateurs; Membranes; Diaphragmes; Eléments d'espacement caractérisés par le matériau
A coating head with an inner deckle includes: a coating head main body (1) which is formed from a pair of members extending in a transverse direction of a base material, said coating head main body (1) having a coating fluid flow path (1c) formed from a slit part (1a) and a manifold part (1b) which are between these members, face the base material and open in the proximity thereof, and a coating fluid inlet (1d) connected to the coating fluid flow path (1c); and an inner deckle (2) that is inserted into the coating fluid flow path (1c) from both ends or one end of the coating head main body (1) so as to be freely slidable along the longitudinal direction (A) of the coating head main body (1) and is at least provided with a manifold sealing unit (2f). The manifold sealing unit (2f) of the inner deckle (2) expands or undergoes thermal expansion so as to seal the inner wall of the coating fluid flow path (1c) and change the application width of the coating fluid.
B05C 5/02 - Appareillages dans lesquels un liquide ou autre matériau fluide est projeté, versé ou répandu sur la surface de l'ouvrage à partir d'un dispositif de sortie en contact, ou presque en contact, avec l'ouvrage
B05D 1/26 - Procédés pour appliquer des liquides ou d'autres matériaux fluides aux surfaces par application de liquides ou d'autres matériaux fluides, à partir d'un orifice en contact ou presque en contact avec la surface
33.
OPTICAL SUBSTRATE, SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND MANUFACTURING METHOD FOR SAME
An optical substrate PP (10) includes a substrate body and a recess/bump structure (20) formed of a plurality of bumps (20a) provided on the main surface of the substrate body. Markings (X) that can be observed with an optical microscope are formed on the main surface. The interval between the markings is larger than the pitch of the recess/bump structure (20). The markings (X) can be recognized as first areas (Xa) and a second area (Xb) by a difference in brightness in an optical microscopic image of the markings (X). A plurality of first areas (Xa) are arranged at intervals, and the second area (Xb) exists among the first areas (Xa). According to the present invention, the improvement of the internal quantum efficiency (IQE) and the improvement of the light extraction efficiency (LEE) of semiconductor light-emitting elements, which have been said to be a trade-off, are achieved at the same time.
Provided is a photosensitive resin composition which has high film retention ratio after development and high sensitivity, while having a uniform surface after the development. A positive photosensitive resin composition which contains: (a) a polymer that contains a structural unit represented by general formula (1) as a main component; (b) a quinonediazide compound; and (c) a phenolic resin having a specific structure. (In formula (1), each of R1 and R2 independently represents a divalent to octavalent organic group having 2-60 carbon atoms; each of R3, R4, R5 and R6 independently represents a hydrogen atom or a monovalent organic group having 1-20 carbon atoms; each of d and e independently represents an integer of 0-2, provided that d and e are not 0 at the same time; each of f and g independently represents an integer of 0-4; and n represents a positive integer.)
G03F 7/023 - Quinonediazides macromoléculairesAdditifs macromoléculaires, p. ex. liants
C08G 8/20 - Polymères de condensation obtenus uniquement à partir d'aldéhydes ou de cétones avec des phénols d'aldéhydes de formaldéhyde, p. ex. de formaldéhyde formé in situ avec des phénols polyhydriques
C08G 69/26 - Polyamides dérivés, soit des acides amino-carboxyliques, soit de polyamines et d'acides polycarboxyliques dérivés de polyamines et d'acides polycarboxyliques
35.
PHOTOSENSITIVE FILM LAMINATE, FLEXIBLE PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING SAME
A photosensitive film laminate is provided with a substrate and a photosensitive film provided on the substrate. The photosensitive film contains a photosensitive resin composition containing (A) an alkali-soluble resin, (B) a polymerizable compound having an unsaturated double bond, and (C) a photopolymerization initiator, the (C) photopolymerization initiator having the structure expressed by general formula (1) (Ar1 represents a monovalent organic group including an aromatic, R1 represents an organic group having an alkyl or aryl group, and R2 represents a C3-50 monovalent hydrocarbon group that is any of a branched alkyl group, a straight alkyl group, an alkyl group having an alicyclic structure, or an alkyl group having an aromatic structure). It is possible to provide an exceptionally photosensitive film that can be developed in alkali, has exceptional wiring coverage even when formed into a thin film, and allows excellent visibility of an exposure part and a non-exposure part. It is also possible to provide a flexible printed wiring board using the photosensitive film.
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
G03F 7/037 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polyamides ou des polyimides
H05K 3/28 - Application de revêtements de protection non métalliques
36.
EPOXY RESIN COMPOSITION, EPOXY RESIN, AND CURED ARTICLE
The purpose of the present invention is to provide an epoxy resin composition that includes an epoxy resin represented by formula (1) and an epoxy resin represented by formula (2).
The purpose of the present invention is to provide a separator for an energy storage device having excellent adhesion to an electrode, and excellent handling properties. The separator for the energy storage device has a microporous polyolefin membrane, and a thermoplastic polymer covering layer that covers at least part of at least one of the surfaces of the microporous polyolefin membrane. In the thermoplastic polymer covering layer, an area that contains the thermoplastic polymer and an area that does not contain the thermoplastic polymer exist in a sea island form on the microporous polyolefin membrane. The thermoplastic polymer contained in the thermoplastic polymer covering layer has at least two glass transition temperatures. At least one of the glass transition temperatures exists in a region of less than 20°C, and at least one of the glass transition temperatures exists in a region of 20°C or above.
The present invention addresses the problem of providing a method for producing a photosensitive resin element that has excellent productivity and good appearance. The present invention provides a method for producing a photosensitive resin element, which comprises: a step for obtaining a liquid blend by blending (a) a binder resin that has a weight average molecular weight of 5,000-500,000 and a carboxyl group content of 100-600 in terms of acid equivalent, (b) a photopolymerizable unsaturated compound, (c) a photopolymerization initiator, (d) acetone and (e) a non-acetone solvent, with the mass ratio of (d) the acetone to the total mass of (d) the acetone and (e) the non-acetone solvent being 30-98% by mass and with the ratio of the total solid content in the liquid blend being 30-80% by mass; and a step wherein the liquid blend is applied onto a supporting layer and dried thereon, thereby forming a photosensitive resin element on the supporting layer.
G03F 7/033 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polymères obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone, p. ex. polymères vinyliques
39.
FUNCTION-TRANSFERRING OBJECT, METHOD FOR TRANSFERRING FUNCTIONAL LAYER, PACKAGE AND FUNCTION-TRANSFERRING FILM ROLL
A function-transferring object (14) is equipped with a carrier (10) that has a rugged nanostructure (11) and a functional layer (12) provided on the rugged structure (11). The functional layer (12) is transferred to an object to be processed (20) by first providing the functional layer (12) on the surface of the rugged structure (11), bringing the functional layer (12) into direct contact with one main surface of the object being processed (20), and subsequently removing the carrier (10) from the functional layer (12). The mean pitch of the rugged structure (11) is 1 nm to 1500 nm, the functional layer (12) comprises a resin, and the ratio (Ra/lor) of the surface roughness (Ra) of the exposed surface of the functional layer (12) to the distance (lor) between the top of the protrusions of the rugged structure (11) and the exposed surface of the functional layer is 1.2 or less. Moreover, the functional layer (12) is disposed inside the recesses (11a) and the exposed surface is in a non-liquid state at a temperature of 20°C when shielded from light. With the invention, it is possible to confer function on the object being processed (20) with high precision.
B32B 3/30 - Produits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche continue dont le périmètre de la section droite a une allure particulièreProduits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche comportant des cavités ou des vides internes caractérisés par une couche comportant des retraits ou des saillies, p. ex. des gorges, des nervures
B29C 59/02 - Façonnage de surface, p. ex. gaufrageAppareils à cet effet par des moyens mécaniques, p. ex. par pressage
B29C 59/04 - Façonnage de surface, p. ex. gaufrageAppareils à cet effet par des moyens mécaniques, p. ex. par pressage en utilisant des rouleaux ou des courroies sans fin
H01L 21/027 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou
40.
Polyolefin-based porous film and method for producing the same
A method for producing a polyolefin-based porous film includes an (A) step: a raw fabric forming step for forming a non-porous raw fabric from a polyolefin-based resin composition, a (B) step: an MD cold stretching step for cold stretching the non-porous raw fabric obtained in the (A) step at a temperature of −20° C. to (Tm−30)° C. (Tm is a melting point (° C.) of the non-porous raw fabric) in an extruding direction (MD) of the raw fabric to make the raw fabric porous; a (D) step: a TD cold stretching step for cold stretching a film processed in the (B) step in a direction (TD) perpendicular to the MD, and an (H) step: a thermal fixing step, in the above order.
B29C 55/14 - Étirage suivant plusieurs axes suivant deux axes successivement
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
Using a film (II) for fine pattern formation, which is provided with a cover film (10) that is provided with a nanoscale microrelief structure (11) on one surface, a second mask layer (12) that is provided within a recessed portion of the microrelief structure (11), and a first mask layer (13) that is provided so as to cover the microrelief structure (11) and the second mask layer (12), the first mask layer (13) and the second mask layer (12) are transferred to an object to be processed (20). In this connection, the film (II) for fine pattern formation is pressed against the object to be processed (20), with the surface that is provided with the first mask layer (13) facing the surface of the object to be processed (20); the first mask layer (13) is irradiated with an energy ray; and then the cover film (10) is separated from the second mask layer (12) and the first mask layer (13). In this connection, the pressing and the energy ray irradiation are separately carried out. The object to be processed is etched using the second mask layer (12) and the first mask layer (13).
B29C 59/04 - Façonnage de surface, p. ex. gaufrageAppareils à cet effet par des moyens mécaniques, p. ex. par pressage en utilisant des rouleaux ou des courroies sans fin
B29C 65/02 - Assemblage d'éléments préformésAppareils à cet effet par chauffage, avec ou sans pressage
H01L 21/027 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou
B29L 7/00 - Objets plats, p. ex. pellicules ou feuilles
42.
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING HARDENING RELIEF PATTERN, AND SEMICONDUCTOR DEVICE
Provided is a negative photosensitive resin composition containing (A) 100 mass parts of a polyimide precursor having a structure expressed by the general formula (1) shown below (R1, R2, X1, and Y1 are as defined in the specification), and (B) 0.1-20 parts by mass of a photopolymerization initiator.
Provided is a polysiloxane composition having radical-crosslinkable groups, the composition, when allowed to stand for 24 hours in the air at 24ºC and ordinary pressure while being shielded from the light having any wavelength not longer than 400 nm and thereafter examined with an electron spin resonance (ESR) device, having a peak at a value of g of 2.034-1.984, and the composition containing radicals in an amount of 0.1×10-6 to 120×10-6 mol per g of the solid components of the composition.
A light extraction body (1) for a semiconductor light-emitting element is provided with: a concavo-convex structure layer (11) which has a concavo-convex structure (11a) provided to a surface thereof, and which has a first refractive index (n1); and first light extraction layers (12a) provided on the convex portions of the concavo-convex structure (11a). With regard to the first light extraction layers (12a), the distance (Lcv) between the average position (Sh) of convex-portion apexes and the average position (Scv) of the boundary surfaces of the first light extraction layers (12a) on the convex portions satisfies formula (1) 10nm ≤ Lcv ≤ 5000nm. In the concavo-convex structure (11a): the average height (H) of the convex portions satisfies formula (2) 10nm ≤ H ≤ 5000nm; the average pitch (P) satisfies formula (3) 50nm ≤ P ≤ 5000nm; and the aforementioned distance (Lcv) and the average height (H) of the convex portions satisfy formula (4) 50nm ≤ Lcv+H ≤ 6000nm. As a result, light-extraction efficiency from a semiconductor light-emitting element using the light extraction body (1) can be improved, and long-term reliability of the semiconductor light-emitting element can also be improved.
H01L 51/52 - Dispositifs à l'état solide qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de tels dispositifs ou de leurs parties constitutives spécialement adaptés pour l'émission de lumière, p.ex. diodes émettrices de lumière organiques (OLED) ou dispositifs émetteurs de lumière à base de polymères (PLED) - Détails des dispositifs
A concavo-convex structure (12) containing multiple independent convex parts (131 to 134) and concave parts (14) disposed between each convex part (131 to 134) is disposed on the surface of an optical substrate (1). The average space (Pave) between the adjacent convex parts (131 to 134) of the concavo-convex structure (12) is within the range of 50 nm≤Pave≤1500 nm, and convex parts (133) having a height (hn) within the range of 0.6 h≥hn≥0 h relative to the average height (Have) of the convex parts are present at a probability (Z) of 1/10000≤Z≤1/5. When the optical substrate (1) is used in a semiconductor light-emitting element, the light extraction efficiency (LEE) is increased by eliminating the waveguide mode by means of light scattering while improving the internal quantum efficiency (IQE) by dispersing the dislocation within a semiconductor layer and by reducing the dislocation density, and the light emission efficiency of the semiconductor light-emitting element is improved.
H01L 33/22 - Surfaces irrégulières ou rugueuses, p.ex. à l'interface entre les couches épitaxiales
H01L 33/32 - Matériaux de la région électroluminescente contenant uniquement des éléments du groupe III et du groupe V de la classification périodique contenant de l'azote
Provided is a multilayer porous film having a porous film that contains a polyolefin-based resin as a primary component, and a porous layer that contains an inorganic filler and a resin-based binder laminated on at least one surface of the porous film. In the porous film, the average pore diameter (d) calculated using a gas-liquid method, the path curvature (τa), and the number of pores (B) are respectively d = 0.035-0.060 μm, τa = 1.1-1.7, and B=100-500 pores/μm2, and the film thickness of the porous film is L=5-22 μm.
H01M 2/16 - Séparateurs; Membranes; Diaphragmes; Eléments d'espacement caractérisés par le matériau
B32B 5/32 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par la présence de plusieurs couches qui comportent des fibres, filaments, grains ou poudre, ou qui sont sous forme de mousse ou essentiellement poreuses les deux couches étant sous forme de mousse ou essentiellement poreuses
B32B 27/32 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyoléfines
C08J 9/00 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement
Provided is a prepreg suffering little resin particle fall-off and little resin peeling during prepreg production and during handling in order to have excellent dielectric properties for PPE and favorable adhesiveness. A PPE-containing prepreg constituted of a base material and a curable resin composition including PPE particles, wherein the prepreg is characterized in that (1) PPE extracted from the prepreg using a mixed solvent of toluene and methanol in a mass ratio of 95:5 includes PPE particles (A) insoluble in the mixed solvent, (2) the amount of PPE contained in the PPE particles (A) is 70 mass% or higher, and (3) the number-average molecular weight of the PPE contained in the PPE particles (A) is 8,000-40,000.
A pellicle provided with a pellicle frame (10) formed in a substantially rectangular frame shape by a pair of long side parts (10a) and a pair of short side parts (10b), and a pellicle film (11) stretchingly supported by the pellicle frame (10). The ratio of the long-side width/long-side length ratio of the side part is 0.3% to 2.2% inclusive. The short-side width/short-side length ratio of the side part is 0.3% to 3.8% inclusive. At least one side part of the long side parts (10a) and short side parts (10b) bulge to the outer side of the pellicle frame (10). The bulging side part elastically deforms toward the inner side of the pellicle film (10). In this state, the pellicle film (11) is affixed to the pellicle frame (10).
G03F 1/64 - Pellicules, p. ex. assemblage de pellicules ayant une membrane sur un cadre de supportLeur préparation caractérisés par les cadres, p. ex. du point de vue de leur structure ou de leur matériau
G03F 1/62 - Pellicules, p. ex. assemblage de pellicules ayant une membrane sur un cadre de supportLeur préparation
An object of the present invention is to provide a polymer electrolyte membrane meeting power generation properties and physical durability at the same time and having high durability. A polymer electrolyte membrane comprising a microporous membrane and a fluorine-based polymer electrolyte contained in a pore of the microporous membrane, wherein pore distribution of the microporous membrane has a pore distribution with a center of distribution in a pore diameter range of 0.3 μm to 5.0 μm, and the fluorine-based polymer electrolyte composition contains a fluorine-based polymer electrolyte (component A) having an ion exchange capacity of 0.5 to 3.0 meq/g.
H01M 8/1044 - Mélanges de polymères dont l'un au moins est un conducteur ionique
H01M 8/1062 - Matériaux d’électrolyte polymère caractérisés par un support poreux n’ayant pas de propriétés conductrices ioniques caractérisés par les propriétés physiques du support poreux, p. ex. sa porosité ou son épaisseur
H01M 8/10 - Éléments à combustible avec électrolytes solides
C08L 27/18 - Homopolymères ou copolymères du tétrafluoro-éthylène
C09D 127/22 - Compositions de revêtement à base d'homopolymères ou de copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un halogèneCompositions de revêtement à base de dérivés de tels polymères modifiés par post-traitement chimique
H01B 1/12 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement d'autres substances non métalliques substances organiques
50.
MOLD, RESIST LAMINATE AND MANUFACTURING PROCESS THEREFOR, AND MICRORELIEF STRUCTURE
A resist laminate (30) includes an inorganic substrate (21), the first resist layer (22) provided on one principal surface of the inorganic substrate (21), and the second resist layer (23) which is provided on the first resist layer (22) and which has a microrelief layer (23a) on the surface. The microrelief layer (23a) is formed by transferring using a mold, wherein: the thickness of the residual film remaining after the transferring is 50nm or less; the ratio of the projection top width (lcv) of the fine pattern of the mold to the recess opening width (lcc) thereof, namely, lcv/lcc ratio is within a prescribed range; and the ratio of the volume (Vr2) of the second resist layer (23) to the recess volume (Vcm) of the fine pattern of the mold, namely, Vr2/Vcm ratio is within a prescribed range. Thus, a resist mask (25) which has a thin and uniform residual film can be easily formed on the inorganic substrate (21).
H01L 21/027 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou
B29C 33/38 - Moules ou noyauxLeurs détails ou accessoires caractérisés par la matière ou le procédé de fabrication
B29C 33/42 - Moules ou noyauxLeurs détails ou accessoires caractérisés par la forme de la surface de moulage, p. ex. par des nervures ou des rainures
B29C 59/02 - Façonnage de surface, p. ex. gaufrageAppareils à cet effet par des moyens mécaniques, p. ex. par pressage
B32B 3/26 - Produits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche continue dont le périmètre de la section droite a une allure particulièreProduits stratifiés comprenant une couche ayant des discontinuités ou des rugosités externes ou internes, ou une couche de forme non planeProduits stratifiés comprenant une couche ayant des particularités au niveau de sa forme caractérisés par une couche comportant des cavités ou des vides internes
51.
Developer, process for treating developing solution, process for producing printing plate, and filter apparatus
A process for producing a printing plate, includes feeding a developing solution to an exposed photosensitive resin composition layer; passing the developing solution, in which a photosensitive resin composition is dispersed, through a dispersed-material-filter and flocculating the photosensitive resin composition dispersed in the developing solution by the dispersed-object-filter, and removing a flocculated photosensitive resin composition from the developing solution passed through the dispersed-material-filter.
The disclosure includes a method for producing a dispersion composition of fluorine-containing ion exchange resin comprising a copolymer represented by formula:
wherein x and y represent numbers satisfying 0≦x<1, 0≦y<1, and x+y=1; Z represents H, Cl, F, or a perfluoroalkyl group having 1 to 3 carbon atoms; m represents an integer of 0 to 12; and n represents an integer of 0 to 2.
H01B 1/12 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement d'autres substances non métalliques substances organiques
This coating composition comprises (A) a metal oxide that comprises (a1) a spherical metal oxide and (a2) a chain-shaped metal oxide having an aspect (length/breadth) ratio of 3 to 25 and (B) polymer emulsion particles. It is preferable that the coating composition further contains (C) a hydrolyzable silicon compound. Further, this antireflection film can be formed by applying the coating composition to a substrate and drying the resulting coating.
H01L 31/052 - Moyens de refroidissement directement associés ou intégrés à la cellule PV, p.ex. éléments Peltier intégrés pour refroidissement actif ou puits thermiques directement associés aux cellules PV
54.
FINE UNEVENNESS STRUCTURE BODY, DRY ETCHING THERMO-REACTIVE RESIST MATERIAL, MOLD FABRICATION METHOD, AND MOLD
Provided is a fine unevenness structure body (10), comprising an etching layer (11), and a resist layer (12) which is configured of a dry etching thermo-reactive resist material which is disposed upon the etching layer (11). An unevenness structure which corresponds to opening parts (12a) which are formed in the resist layer (12) is formed in the etching layer (11). The pattern pitch (P) of the fine pattern of the unevenness structure is 1-10nm. The pattern depth (H) of the fine pattern is 1-10nm. The pattern cross-section shapes of the fine pattern are trapezoids, triangles, or mixtures of these. The dry etching thermo-reactive resist material has at least one primary constituent element selected from a group consisting of copper, niobium, tin, manganese, oxides and nitrides of these, and nickel bismuth.
A resin composition which comprises (A) a polyimide having an acidic functional group and (B) a compound having a functional group that reacts with the acidic functional group, wherein (a) the resin composition, after having undergone a 90°C 10-minute heat history, has a rate of dissolution in 3 mass% aqueous sodium hydroxide solution at 45°C of 0.95 or higher when the dissolution rate before the heat history is taken as 1, (b) the resin composition, after having undergone a 180°C 60-minute heat history, has a rate of dissolution in 3 mass% aqueous sodium hydroxide solution at 45°C of 0.001-0.02 µm/sec, (c) the resin composition, after having undergone a 180°C 60-minute heat history and then been held at 40°C for 2 weeks, has a bleedout amount of 50 mg/m2 or less, and (d) the resin composition has a weight loss on heating from 40°C to 260°C, measured by thermogravimetric analysis (TG) under the heating conditions of 10 °C/min, of 2.0% or less. When the resin composition is used to produce a multilayered flexible wiring board, a resin layer excellent in terms of alkali processability, embeddability during pressing, heat resistance, flexing characteristics, insulation reliability, and tight adhesion to the conductive layers is obtained.
C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide-acides ou précurseurs similaires de polyimides
B32B 15/088 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique comprenant des polyamides
B32B 27/34 - Produits stratifiés composés essentiellement de résine synthétique comprenant des polyamides
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide-acides ou précurseurs similaires de polyimides
C08K 5/29 - Composés contenant des liaisons doubles carbone-azote
Provided is a photopolymer composition for a semiconductor element surface protective film or an interlayer insulating film, in which a solution of the photopolymer composition comprises 100 parts by mass of (A) a phenolic resin having a biphenyldiyl structure in a main chain of the resin; 1 to 30 parts by mass of (B) a photo acid-generating agent; and 1 to 60 parts by mass of (C) a compound that can be reacted with ingredient (A) by means of an acid generated from the photo acid-generating agent or heat.
H01L 21/461 - Traitement de corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour changer les caractéristiques physiques ou la forme de leur surface, p. ex. gravure, polissage, découpage
Provided is an optical substrate capable of reducing color shifts due to refraction of light. An optical substrate (12) is provided with a microstructure layer including a plurality of dots (31) configured from projections or depressions, the microstructure layer extending in the out-of-plane direction from the principal plane of the substrate, the microstructure layer has a plurality of dot rows in which a plurality of dots are arranged at a pitch (Py) in a first direction in the principal plane of the substrate, and has a plurality of dot rows in which a plurality of dots are arranged at a pitch (Px) in a second direction orthogonal to the first direction in the principal plane of the substrate, and the pitch (Py) and the pitch (Px) are both indefinite intervals and are each nano-order.
G02B 5/00 - Éléments optiques autres que les lentilles
H01L 51/50 - Dispositifs à l'état solide qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de tels dispositifs ou de leurs parties constitutives spécialement adaptés pour l'émission de lumière, p.ex. diodes émettrices de lumière organiques (OLED) ou dispositifs émetteurs de lumière à base de polymères (PLED)
The problem addressed by the present invention is to obtain an electrolyte membrane that, as an electrolyte membrane for a redox flow secondary battery, is able to suppress the ion permeability of an active substance without detracting from proton (H+) permeability, has superior ion-selective permeability, has low electrical resistivity, and has superior current efficiency. The present invention solves the abovementioned problem by means of the electrolyte membrane for a redox flow secondary battery containing a perfluorocarbon sulfonic acid resin having a specific structure and an equivalent weight (EW), and the ion conductivity being adjusted to a predetermined range.
The purpose of the present invention is to provide a redox flow secondary battery which has low electrical resistance and excellent current efficiency in addition to durability. The present invention relates to: an electrolyte membrane for redox flow secondary batteries, which contains an ion exchange resin composition containing a fluorine-based polymer electrolyte; and a redox flow secondary battery which uses the electrolyte membrane for redox flow secondary batteries.
H01B 1/06 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement d'autres substances non métalliques
H01M 8/02 - Éléments à combustibleLeur fabrication Détails
60.
REDOX FLOW SECONDARY BATTERY AND ELECTROLYTE MEMBRANE FOR REDOX FLOW SECONDARY BATTERY
This redox flow secondary battery has an electrolyte tank (6) containing: a positive electrode cell chamber (2) containing a positive electrode (1) comprising a carbon electrode; a negative electrode cell chamber (4) containing a negative electrode (3) comprising a carbon electrode; and an electrolyte membrane (5) as a barrier membrane that separates/isolates the positive electrode cell chamber (2) and the negative electrode cell chamber (4). The positive electrode cell chamber (2) contains a positive electrode electrolyte containing an active substance, the negative electrode cell chamber (4) contains a negative electrode electrolyte containing an active substance, and the redox flow secondary battery charges and discharges on the basis of the change in valency of the active substances in the electrolytes. The electrolyte membrane (5) contains an ion exchange resin composition that is primarily a polyelectrolye polymer, and the electrolyte membrane (5) has a reinforcing material comprising a fluorine-based porous membrane.
C08L 27/18 - Homopolymères ou copolymères du tétrafluoro-éthylène
C08L 79/04 - Polycondensats possédant des hétérocycles contenant de l'azote dans la chaîne principalePolyhydrazidesPolyamide-acides ou précurseurs similaires de polyimides
H01B 1/06 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement d'autres substances non métalliques
H01M 8/02 - Éléments à combustibleLeur fabrication Détails
H01M 8/10 - Éléments à combustible avec électrolytes solides
61.
REDOX FLOW SECONDARY BATTERY AND ELECTROLYTE MEMBRANE FOR REDOX FLOW SECONDARY BATTERIES
The purpose of the present invention is to provide a redox flow secondary battery which has low electrical resistance and excellent current efficiency in addition to durability. The present invention relates to: an electrolyte membrane for redox flow secondary batteries, which contains an ion exchange resin composition containing a fluorine-based polymer electrolyte, and which has an ion cluster diameter of 1.00-2.95 nm as determined by a small-angle X-ray method in water at 25˚C; and a redox flow secondary battery which uses the electrolyte membrane for redox flow secondary batteries.
C08L 79/04 - Polycondensats possédant des hétérocycles contenant de l'azote dans la chaîne principalePolyhydrazidesPolyamide-acides ou précurseurs similaires de polyimides
H01B 1/06 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement d'autres substances non métalliques
H01M 8/02 - Éléments à combustibleLeur fabrication Détails
62.
SEMICONDUCTOR CHIP WITH ATTACHED ANISOTROPIC ELECTROCONDUCTIVE FILM, SEMICONDUCTOR WAFER WITH ATTACHED ANISOTROPIC ELECTROCONDUCTIVE FILM, AND SEMICONDUCTOR DEVICE
Provided is a semiconductor chip or wafer with an attached anisotropic electroconductive film in which the connecting part can be inspected before connection, the number of electroconductive particles contributing to the connection can be predicted, and the alignment mark can be readily distinguished during connection. A semiconductor chip or wafer with an attached anisotropic electroconductive film, having a semiconductor chip or wafer having a plurality of circuit electrodes on one surface, and an anisotropic electroconductive film covering the circuit electrodes, wherein the semiconductor chip or wafer with an attached anisotropic electroconductive film is characterized in that the anisotropic electroconductive film contains an insulating resin component and electroconductive particles, and no less than 60% of all electroconductive particles contained in the anisotropic electroconductive film are present further towards the surface of the anisotropic electroconductive film than the average height of the circuit electrodes.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
H01B 5/16 - Conducteurs ou corps conducteurs non isolés caractérisés par la forme comprenant un matériau conducteur incorporé à un matériau isolant ou faiblement conducteur, p. ex. du caoutchouc conducteur
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01R 11/01 - Éléments de connexion individuels assurant plusieurs emplacements de connexion espacés pour des organes conducteurs qui sont ou qui peuvent être interconnectés de cette façon, p. ex. pièces d'extrémité pour fils ou câbles supportées par le fil ou par le câble et possédant des moyens pour faciliter la connexion électrique avec quelqu'autre fil, borne, ou organe conducteur, répartiteurs caractérisés par la forme ou par la disposition de l'interconnexion entre leurs emplacements de connexion
63.
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING HARDENED RELIEF PATTERN, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE
Provided is a photosensitive resin composition which comprises: (A-1) a resin containing a structure represented by general formula (1); and (B) a photo-acid generating agent. In general formula (1), X, R1 to R7, m1 to m4, n1, n2, Y and W are each as defined in the description.
G03F 7/023 - Quinonediazides macromoléculairesAdditifs macromoléculaires, p. ex. liants
C08G 61/00 - Composés macromoléculaires obtenus par des réactions créant une liaison carbone-carbone dans la chaîne principale de la macromolécule
C08L 65/00 - Compositions contenant des composés macromoléculaires obtenus par des réactions créant une liaison carbone-carbone dans la chaîne principaleCompositions contenant des dérivés de tels polymères
This thermally reactive resist material contains copper oxide and silicon or copper oxide and is configured such that the content of silicon or silicon oxide in the thermally reactive resist material is 4.0 mol% or more but less than 10.0 mol% in terms of silicon expressed in mole. A thermally reactive resist layer is formed using the thermally reactive resist material, and the thermally reactive resist layer is exposed and then developed using a developer liquid. A base is dry etched with a chlorofluorocarbon gas using the thus-obtained thermally reactive resist layer as a mask, thereby producing a mold that has recesses and projections on the base surface. At this time, a fine pattern that is configured of the recesses and projections can be controlled.
A wire grid polarizing plate (10) has a base (11) having on a surface thereof a concave-convex structure extending in a specific direction and conductors (12) unevenly distributed on one side surface (11b) of a convex part (11a) of the concave-convex structure. In the wire grid polarizing plate (10) as viewed in cross-section along a direction perpendicular to the direction to which the concave-convex structures extend, the pitch (P1), which is the interval between two adjacent convex parts (11a), is 120 nm or less; and the convex part height (H), which is the difference between the highest part (11c) of the convex parts (11a) and lowest part (11e) of the concave parts (11d), is 80 to 130% of the pitch (P1). A high-image-quality LCD display device can be provided by using the wire grid polarization plate (10) in an LCD display device.
G02F 1/13 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p. ex. commutation, ouverture de porte ou modulationOptique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des cristaux liquides, p. ex. cellules d'affichage individuelles à cristaux liquides
G02F 1/1335 - Association structurelle de cellules avec des dispositifs optiques, p. ex. des polariseurs ou des réflecteurs
G03B 21/14 - Projecteurs ou visionneuses du type par projectionLeurs accessoires Détails
This microporous membrane comprises a surfactant adhered to a polyolefin microporous membrane. The surfactant contains a surfactant (A) having 5g or higher solubility per 100g of water and a surfactant (B) having less than 0.1g solubility per 100g of water. The total of the aforementioned adhered surfactants (A) and (B) is 1-40 mass% per 100 mass% of the microporous polyolefin membrane, and the tortuosity of the polyolefin microporous membrane is greater than 2.0.
Provided is a method for manufacturing a connecting structure that includes a connecting step for connecting surface electrode conductive wiring of solar cells with a substrate thickness of 40 µm - 190 µm and tab wires by an adhesive that includes conductive particles that have a Vickers hardness of 100 MPa - 600 MPa.
Provided is an optical substrate provided with a microscopic structure, said optical substrate improving the light-emitting efficiency of LEDs while improving the internal quantum efficiency (IQE) by reducing the number of dislocation defects in a conductor layer. The optical substrate (1) is provided with a microscopic structure (12) containing dots composed of multiple protrusions (13) that extend in the out-of-plane direction from the main surface of a substrate (11). The microscopic structure (12): has multiple rows of dots (13-1 to 13-N) consisting of multiple dots that are arranged at a pitch Py in a first direction within the main surface of the substrate (11); and has multiple rows of dots consisting of multiple dots that are arranged at pitch Px in a second direction that is orthogonal to the first direction within the main surface of the substrate (11). Either one of the pitch Py or the pitch Px is at a regular interval on a nano-order scale, while the other is at an irregular interval on a nano-order scale, or both pitches are at an irregular interval on a nano-order scale.
The present invention relates to a photosensitive alkali-soluble silicone resin composition comprising an alkali-soluble silicone resin (A) which comprises a carboxyl group or a dicarboxylic acid anhydride group in one molecule; an alkali-soluble resin (B) whose acid value is between 10 mgKOH/g and 200 mgKOH/g; and a photoinitiator (C). The (A) or (B) ingredient may comprise a photosensitive unsaturated double bond group, or the photosensitive alkali-soluble silicone resin composition may further comprise a compound (D) which comprises a photosensitive unsaturated double bond.
C08F 230/08 - Copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule liaison double carbone-carbone et contenant du phosphore, du sélénium, du tellure ou un métal contenant un métal contenant du silicium
C08F 290/08 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères modifiés par introduction de groupes aliphatiques non saturés terminaux ou latéraux sur des polymères modifiés par introduction de groupes non saturés latéraux
C08G 77/14 - Polysiloxanes contenant du silicium lié à des groupes contenant de l'oxygène
C08G 77/20 - Polysiloxanes contenant du silicium lié à des groupes aliphatiques non saturés
G03F 7/033 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polymères obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone, p. ex. polymères vinyliques
G03F 7/038 - Composés macromoléculaires rendus insolubles ou sélectivement mouillables
H01L 21/027 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou
Provided is an encapsulating resin sheet which is excellent in terms of gap-filling properties and creep resistance and of transparency and color difference stability. The encapsulating resin sheet (1) comprises a polyethylene resin having a density of 0.860-0.910 g/cm3, contains no crosslinking agents, and has given material properties.
Provided is an etching solution for copper oxide. In a case where a copper oxide is used as a thermal reaction type resist material and exposed to a laser, the etching solution can etch the resulting laser-exposed resist material selectively between exposed and unexposed areas and at a controlled etch rate. Further, provided is an etching process using the same. An etching solution for use in removing selectively a copper oxide having a specific valence from a copper oxide-containing layer which contains copper oxides different in valence, characterized by: comprising an amino acid, a chelating agent, and water as the essential components; and having both a weight concentration of the amino acid which is higher than that of the chelating agent and a pH of 3.5 or higher.
C09K 13/06 - Compositions pour l'attaque chimique, la gravure, le brillantage de surface ou le décapage contenant un acide inorganique avec une substance organique
Provided is a convexo-concave microstructure transcription template that exerts good transfer material coatability and good releasability at the same time. This convexo-concave microstructure transcription template (110) has: a base material; a patterned section (111) where a convexo-concave microstructure, which is to be transferred onto an object to be processed, is formed in a portion of one of the primary surfaces of the base material; a non-patterned section (112) where the convexo-concave microstructure is not formed and that consists of an area of the one primary surface other than the transfer area; and a barrier area (114) that is provided between the patterned section (111) and the non-patterned section so as to border, at least partially, the patterned section (111). The patterned section (111) and the barrier area (114) contain multiple concave sections. The relationship expressed as Rf1 > Rf2 is established between the average roughness factor (Rf1) of the patterned section (111) and the average roughness factor (Rf2) of barrier area (114), and the relationship expressed as Ar1 > Ar2 is established between the average aperture ratio (Ar1) of the patterned section (111) and the average aperture ratio (Ar2) of the barrier area (114).
H01L 21/027 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou
B29C 33/42 - Moules ou noyauxLeurs détails ou accessoires caractérisés par la forme de la surface de moulage, p. ex. par des nervures ou des rainures
B29C 33/44 - Moules ou noyauxLeurs détails ou accessoires comportant des moyens ou conçus spécialement pour faciliter le démoulage d'objets, p. ex. des objets à contre-dépouille
B29C 59/02 - Façonnage de surface, p. ex. gaufrageAppareils à cet effet par des moyens mécaniques, p. ex. par pressage
B29C 59/04 - Façonnage de surface, p. ex. gaufrageAppareils à cet effet par des moyens mécaniques, p. ex. par pressage en utilisant des rouleaux ou des courroies sans fin
73.
PELLICLE, PRESSURE-SENSITIVE ADHESIVE FOR PELLICLE, PHOTOMASK WITH PELLICLE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Provided is a pellicle which has a pressure-sensitive adhesive generating little outgas and with which it is possible to reduce paste residue when peeled from a photomask after exposure. This pellicle comprises a pellicle frame, a pellicle film provided in a tensioned state on one end of the pellicle frame, and a pressure-sensitive adhesive adhering to the other end of the pellicle frame, wherein the pressure-sensitive adhesive comprises a (meth)acrylic acid alkyl ester copolymer and a silane compound, the (meth)acrylic acid alkyl ester copolymer being a copolymer of a monomer having a reactive functional group of (meth)acrylic acid alkyl ester having an alkyl group with carbon number of 4 to 14, with at least either an isocyanate group or an epoxy group.
G03F 1/62 - Pellicules, p. ex. assemblage de pellicules ayant une membrane sur un cadre de supportLeur préparation
B65D 85/86 - Réceptacles, éléments d'emballage ou paquets spécialement adaptés à des objets ou à des matériaux particuliers pour des éléments électriques
74.
Coating composition, coating film, laminate, and process for production of laminate
Provided is a coating composition excellent in antifouling properties, transparency and hydrophilicity, wherein the coating composition contains (A) a metal oxide particle having a number average particle size of 1 nm to 400 nm; and (B) a polymer particle, in which the content of an aqueous-phase component in the component (B), represented by the expression (I), is 20 mass % or less, where (I)(%)=(dry mass of a filtrate obtained by filtering the component (B) at a molecular cutoff of 50,000)×(100−total mass of solid content)/(mass of the filtrate−dry mass of the filtrate)×100/the total mass of solid content.
B32B 5/16 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par le fait qu'une des couches est formée de particules, p. ex. de copeaux, de fibres hachées, de poudre
C08G 77/20 - Polysiloxanes contenant du silicium lié à des groupes aliphatiques non saturés
C09D 5/00 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, caractérisées par leur nature physique ou par les effets produitsApprêts en pâte
F24J 2/48 - caractérisés par le matériau absorbant
C08F 230/08 - Copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule liaison double carbone-carbone et contenant du phosphore, du sélénium, du tellure ou un métal contenant un métal contenant du silicium
C08G 77/00 - Composés macromoléculaires obtenus par des réactions créant dans la chaîne principale de la macromolécule une liaison contenant du silicium, avec ou sans soufre, azote, oxygène ou carbone
C08K 5/5425 - Composés contenant du silicium contenant de l'oxygène contenant au moins une liaison C=C
C08F 220/18 - Esters des alcools ou des phénols monohydriques des phénols ou des alcools contenant plusieurs atomes de carbone avec l'acide acrylique ou l'acide méthacrylique
Provided is a photosensitive resin composition which has excellent resolution and adhesion as a resist material for an etching resist, a plating resist or the like. This photosensitive resin composition contains 20-90% by weight of a binder polymer (A), 5-75% by weight of a photopolymerizable compound (B) and 0.01-30% by weight of a photopolymerization initiator (C). The photosensitive resin composition is characterized in that: the binder polymer (A) is a copolymer which is obtained by copolymerizing a first monomer that is a carboxylic acid or a carboxylic acid anhydride and a non-acidic second monomer that contains one polymerizable unsaturated group, said copolymer having a weight average molecular weight of 5,000-100,000; the photopolymerizable compound (B) is an addition-polymerizable monomer; and a photosensitive resin layer, which is obtained by exposing the photosensitive resin composition and then developing the exposed photosensitive resin composition, has a water contact angle of more than 60˚ and a Young's modulus of 1.5 GPa or more but less than 4 GPa.
G03F 7/033 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polymères obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone, p. ex. polymères vinyliques
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
G03F 7/029 - Composés inorganiquesComposés d'oniumComposés organiques contenant des hétéro-atomes autres que l'oxygène, l'azote ou le soufre
A rotary optical link joint having a small change in transmission loss during rotational use is provided. In order to realize this, the rotary optical link joint according to the present invention is an optical link joint that relatively rotatably holds, centering around an axis line (19, 29), a first optical fiber (11) and a second optical fiber (21), wherein a part or all of the first optical fiber (11) and the second optical fiber (21) are configured by a multi-core optical fiber having a plurality of cores, and wherein the plurality of cores is arranged in a circular or annular area that is sectioned by a concentric circle centered around the axis line (19, 29) of the multi-core optical fiber.
Provided is a resin composition with which cure warpage can be mitigated and which has excellent heat resistance and is suitable for use as a material for the surface-protective film or interlayer dielectric of a semiconductor element or for a protective dielectric, interlayer dielectric, or the like for printed wiring boards. Also provided are a resin film obtained using the resin composition and a wiring board obtained using the composition or film. This resin composition is characterized by comprising (A) a polymer, (B) a polyfunctional hydroxylated compound having two or more hydroxy groups, and (C) a polyfunctional crosslinking compound having two or more crosslinking functional groups which form crosslinks between the crosslinking compound and the polymer and/or polyfunctional hydroxylated compound, the polyfunctional crosslinking compound being capable of forming three-dimensional crosslinks between the crosslinking compound and the polymer and/or polyfunctional hydroxylated compound.
Disclosed is a method of producing a polyolefin porous membrane involving the following steps in the following order: a raw fabric forming step (A) for forming a poreless raw fabric from a polyolefin resin compound; an MD cold rolling step (B) for cold rolling at -20°C to (Tm-30)°C (where Tm is the melting point (°C) of the poreless raw fabric) the poreless raw fabric obtained in step (A) in the machine direction (MD) of the aforementioned raw fabric and creating pores therein; a TD cold rolling step (D) for cold rolling the membrane processed in step (B) in a direction (TD) orthogonal to the MD; and a thermal fixing step (H). The thermal fixing temperature T2(°C) in step (H) satisfies expressions (1) and (2) below. (1) T2>T1 (2) (Tm-3)≥T2≥(Tm-40) (In the expressions, T1 represents the rolling temperature (°C) in step (D), and Tm represents the melting point (°C) of the poreless raw fabric.) The polyolefin porous membrane comprising a polyolefin resin composition has a pore surface area of 35.0-42.0 m2/g, and a birefringence of 2.0x10-2 to 4.0x10-2.
Provided are: an alkali-soluble phenol resin characterized by having a structure represented by general formula (1), －Ａ－Ｂ１－Ａ－Ｂ２－Ａ－Ｂ３－Ａ－・・・Ｂｉ・・・Ａ－Ｂｎ－Ａ－ (1) (in the formula: A each independently is a divalent organic group having 6-25 carbon atoms and having a phenolic hydroxyl group, the bonds of A existing in an aromatic ring having a phenolic hydroxyl group, and there optionally being a substituent group aside from the hydroxyl group in said aromatic ring; Bi is a divalent organic group having 1-15 carbon atoms and not having a phenolic hydroxyl group; i is an integer between 1 and n inclusive; and n is an integer between 2 and 1,000 inclusive), the average value (Σdi/n) of the shortest distance (di) between oxygen atoms in the phenolic hydroxyl group in two As that face each other sandwiching a Bi obtained by calculating the shortest distance (di) by means of molecular mechanics being at least 9 ångstroms (Å), and the softening point being at least 100°C; a photosensitizer; and a solvent-containing photosensitive phenol resin composition for alkaline development.
G03F 7/023 - Quinonediazides macromoléculairesAdditifs macromoléculaires, p. ex. liants
C08G 61/02 - Composés macromoléculaires contenant uniquement des atomes de carbone dans la chaîne principale de la molécule, p. ex. polyxylylènes
G03F 7/40 - Traitement après le dépouillement selon l'image, p. ex. émaillage
H01L 21/312 - Couches organiques, p. ex. couche photosensible
H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
H01L 23/522 - Dispositions pour conduire le courant électrique à l'intérieur du dispositif pendant son fonctionnement, d'un composant à un autre comprenant des interconnexions externes formées d'une structure multicouche de couches conductrices et isolantes inséparables du corps semi-conducteur sur lequel elles ont été déposées
A photosensitive resin composition which comprises (A) an alkali-soluble polymer, (B) a photopolymerization initiator, and (C) a compound having an ethylenically unsaturated double bond, wherein the photopolymerization initiator (B) is a 2,4,5-triarylimidazole dimer or an acridine compound, while a compound represented by general formula (I) is contained as the compound (C). In general formula (I), R1, R2, A, B, n1, n2 and n3 are each as defined in the description. The photosensitive resin composition is excellently and stably dispersible in a developer to minimize the generation of an aggregate. Further, the resin composition exhibits proper developability and can provide a flexible cured resist with good etching resistance.
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
C08F 2/50 - Polymérisation amorcée par énergie ondulatoire ou par rayonnement corpusculaire par la lumière ultraviolette ou visible avec des agents sensibilisants
C08F 20/26 - Esters contenant de l'oxygène en plus de l'oxygène de la fonction carboxyle
Provided is an insulation structure having a memory cell part and a peripheral circuit part in the same layer by satisfactorily embedding a fine pattern in the memory cell part and preventing an insulator from cracking in the peripheral circuit part. The insulation structure of the present invention comprises a substrate and a circuit pattern part formed on the substrate, wherein the circuit pattern part comprises a fine region having a fine pattern with a width of 30 nm or less and a wide region having a wide pattern with a width greater than 100 nm that are provided in the same layer, and the same kind of insulating composition is filled in the fine pattern and the wide pattern.
H01L 27/10 - Dispositifs consistant en une pluralité de composants semi-conducteurs ou d'autres composants à l'état solide formés dans ou sur un substrat commun comprenant des éléments de circuit passif intégrés avec au moins une barrière de potentiel ou une barrière de surface le substrat étant un corps semi-conducteur comprenant une pluralité de composants individuels dans une configuration répétitive
H01L 27/115 - Mémoires mortes programmables électriquement; Procédés de fabrication à étapes multiples de ces dispositifs
H01L 29/788 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée à grille flottante
H01L 29/792 - Transistors à effet de champ l'effet de champ étant produit par une porte isolée à isolant de grille à emmagasinage de charges, p.ex. transistor de mémoire MNOS
−6 kg/m, a (breadth/length) ratio of an average filament diameter of said weft yarn to an average filament diameter of said warp yarn is 1.01 or more but less than 1.27, and a thickness is 10 μm to 40 μm.
D03D 15/00 - Tissus caractérisés par la matière, la structure ou les propriétés des fibres, des filaments, des filés, des fils ou des autres éléments utilisés en chaîne ou en trame
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
C08J 5/24 - Imprégnation de matériaux avec des prépolymères pouvant être polymérisés en place, p. ex. fabrication des "prepregs"
D03D 1/00 - Tissus conçus pour faire des articles particuliers
Provided is a curable resin composition which can provide a cured article having a low dielectric constant and a low dielectric tangent, and can also provide a cured article having excellent moldability at ordinary press-molding temperatures, excellent heat resistance and excellent adhesion properties. The present invention provides a curable resin composition containing a polyphenylene ether, wherein the average number of phenolic hydroxy groups is 0.3 or more per molecule of the polyphenylene ether, the resin flow amount of the curable resin composition upon curing is 0.3 to 15% inclusive, and a cured article having a dielectric tangent of 0.005 or less at 1 GHz and a glass transition temperature of 170˚C or higher can be produced.
C08G 65/48 - Polymères modifiés par post-traitement chimique
B32B 17/04 - Produits stratifiés composés essentiellement d'une feuille de verre ou de fibres de verre, de scorie ou d'une substance similaire sous forme de fibres ou filaments collés ou enrobés dans une substance plastique
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C08F 283/06 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères prévus par la sous-classe sur des polyéthers, des polyoxyméthylènes ou des polyacétals
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
[Problem] To provide: an epoxy resin which exhibits low viscosity when used in a resin composition and which exhibits excellent heat resistance when used in a cured product; and a resin composition. [Solution] This resin composition comprises an epoxy resin (A) that has a total chlorine content of 0.01 to 1000ppm and a resin (B) that has a melting or softening point of 50°C or higher, the content of the epoxy resin (A) being 20 to 90% by mass relative to the total amount of all the resins.
C08G 59/20 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les composés époxydés utilisés
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
85.
Developer, process for treating developing solution, process for producing printing plate, and filter apparatus
A developer efficiently removes photosensitive resin components dispersing in a developing solution. The developer includes a feeder that feeds a developing solution to a printing raw plate, a dispersed-material filter, wherein the developing solution in which a photosensitive resin composition separated from a photosensitive resin composition layer of the printing raw plate is dispersed, is passed through the dispersed-material filter to flocculate the photosensitive resin composition dispersing in the developing solution and a flocculated-material-filter removes the flocculated photosensitive resin composition from the developing solution passed through the dispersed-material filter.
This non-aqueous electrolyte contains acetonitrile and a lithium salt. Anions of this lithium salt in the nonaqueous electrolyte have lowest unoccupied molecular orbital (LUMO) energy in a range of -2.00 - 4.35 eV, and highest occupied molecular orbital (HOMO) energy in a range of -5.35 - -2.90 eV.
1-6 alkoxy group or acetoxy group) and (ii) 1% by mass or more and 60% by mass or less of silica particles, and (II) a solvent, wherein the silane compounds represented by the general formula (1) are two or more types of silane compounds comprising a tetrafunctional silane compound which corresponds to the case of n=0 in the general formula (1) and a trifunctional silane compound which corresponds to the case of n=1 in the general formula (1).
H01L 51/44 - Dispositifs à l'état solide qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de tels dispositifs ou de leurs parties constitutives spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement en énergie électrique, soit comme dispositifs de commande de l'énergie électrique par ledit rayonnement - Détails des dispositifs
88.
Resin composition for pattern formation, pattern formation method and process for producing light-emitting element
Disclosed are: a resin composition for pattern formation, which enables the stable formation of a pattern at a level of the wavelength of light; a method for forming a pattern having a sea-island structure using the composition; and a process for producing a light-emitting element that can achieve high luminous efficiency properties. The resin composition for pattern formation comprises: (a) a specific block copolymer containing an aromatic ring-containing polymer and a poly(meth)acrylate as block moieties; (b) a homopolymer of a specific aromatic ring-containing polymer; and (c) a homopolymer of a specific poly(meth)acrylate, wherein the ratio of the total amount of the aromatic ring-containing homopolymer (b) and the poly(meth)acrylate homopolymer (c) relative to the entire resin composition is 0% by weight to 90% by weight, and the total amount of an aromatic ring-containing polymer moiety contained in the block copolymer (a) as a block moiety and the aromatic ring-containing homopolymer (b) relative to the entire resin composition is 10% by weight to 60% by weight.
Provided are: an oxide nanoparticle reaction product for producing a cured material having excellent cracking resistance and high hardness and exhibiting high elasticity at high temperatures; and a silicone composition containing the oxide nanoparticle reaction product. The oxide nanoparticle reaction product comprises an organopolysiloxane (A) having a unit structure represented by formula (1): R1mSiO(4-m)/2 [wherein R1 represents an unsubstituted or substituted monovalent hydrocarbon group, an alkoxy group, a hydroxy group or a hydrogen atom; and m represents an integer of 0-3] and oxide nanoparticles (B), wherein the organopolysiloxane (A) and each of the oxide nanoparticles (B) are bound to each other through a covalent bond. The oxide nanoparticle reaction product is characterized by having a unit structure represented by formula (5): XnR23-nSiO1/2 [wherein X represents an alkenyl group or a hydrogen atom; R2 represents a saturated unsubstituted or substituted monovalent hydrocarbon group; and n represents 1 or 2].
C08L 83/05 - Polysiloxanes contenant du silicium lié à l'hydrogène
C08L 83/07 - Polysiloxanes contenant du silicium lié à des groupes aliphatiques non saturés
G02B 1/04 - Éléments optiques caractérisés par la substance dont ils sont faitsRevêtements optiques pour éléments optiques faits de substances organiques, p. ex. plastiques
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 33/56 - Matériaux, p.ex. résine époxy ou silicone
90.
PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SAME
The present invention provides: a photosensitive transparent resin composition having excellent thermal shock resistance in the production of products with integrated electronic parts or of solid-state imaging elements that requires a reflow soldering process; and a microplastic lens or an optical-element molded product for liquid crystal polarizing plates that uses said photosensitive transparent resin composition. The photosensitive resin composition contains: 100 parts by mass of a polyorganosiloxane (a) having a polymerizable functional group and prepared according to a method of mixing an alkoxysilane compound represented by the following general formula (1), R1aR2bSi(OR3)4-a-b (wherein R1, R2, R3, a, and b are as defined in the Description), with a catalyst and polymerizing the alkoxysilane compound, wherein said polyorganosiloxane (a) includes a structure represented by the following general formula (2), ≡Si-O-X-Si≡ (wherein X is as defined in the Description), and the structure of said general formula (2) contains 5 to 60% of the Si atoms contained in said polyorganosiloxane (a); and 0.01 to 30 parts by mass of a photopolymerization initiator (b).
C08F 30/08 - Homopolymères ou copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule liaison double carbone-carbone et contenant du phosphore, du sélénium, du tellure ou un métal contenant un métal contenant du silicium
C08F 299/08 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires à partir de polycondensats non saturés à partir de polysiloxanes
[Problem] To provide a polymer electrolyte film with superior durability having both power generating characteristics and physical durability. [Solution] A polymer electrolyte membrane contains a fluorine-containing polymer electrolyte composition in the voids of a microporous membrane. The pore distribution of the microporous membrane has a distribution center in a range of a pore diameter of 0.3 - 5.0 µm, and the polymer electrolyte membrane contains a fluorine-containing polymer electrolyte (component A) in which the fluorine-containing polymer electrolyte composition has an ion exchange capacity of 0.5 - 3.0 meq/g.
H01M 8/02 - Éléments à combustibleLeur fabrication Détails
C08J 9/42 - Imprégnation avec des composés macromoléculaires
C08L 27/18 - Homopolymères ou copolymères du tétrafluoro-éthylène
H01B 1/06 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement d'autres substances non métalliques
H01M 8/10 - Éléments à combustible avec électrolytes solides
The present invention relates to a polymer electrolyte membrane meeting power generation properties and physical durability at the same time and having high durability. A polymer electrolyte membrane comprising a microporous membrane and a fluorine-based polymer electrolyte contained in a pore of the microporous membrane, wherein pore distribution of the microporous membrane has a pore distribution with a center of distribution in a pore diameter range of 0.3 µm to 5.0 µm, and the fluorine-based polymer electrolyte composition contains a fluorine-based polymer electrolyte (component A) having an ion exchange capacity of 0.5 to 3.0 meq/g.
H01M 8/1044 - Mélanges de polymères dont l'un au moins est un conducteur ionique
H01M 8/103 - Matériaux d’électrolyte polymère caractérisés par la structure chimique de la chaîne principale du polymère conducteur ionique comprenant de l’azote, p. ex. des polybenzimidazoles sulfonés [S-PBI], des polybenzimidazoles comprenant de l’acide phosphorique, des polyamides sulfonés [S-PA] ou des polyphosphazènes sulfonés
H01M 8/1032 - Matériaux d’électrolyte polymère caractérisés par la structure chimique de la chaîne principale du polymère conducteur ionique comprenant du soufre, p. ex. des polyéthersulfones sulfonés [S-PES]
H01M 8/1039 - Matériaux d’électrolyte polymère halogénés, p. ex. des fluorures de polyvinylidène sulfonés
H01M 8/1062 - Matériaux d’électrolyte polymère caractérisés par un support poreux n’ayant pas de propriétés conductrices ioniques caractérisés par les propriétés physiques du support poreux, p. ex. sa porosité ou son épaisseur
A photosensitive resin composition for a protective film for the surface of semiconductor elements or for interlayer insulating films, which contains the following constituents in a solvent, is provided: 100 parts by mass of a phenolic resin (A) having a biphenyl diyl structure on a main chain; 1 to 30 parts by mass of a photoacid generator (B); and 1 to 60 parts by mass of a compound (C) which is able to react with the constituent (A) due to the acid or heat generated by the photoacid generator (B).
C08L 65/00 - Compositions contenant des composés macromoléculaires obtenus par des réactions créant une liaison carbone-carbone dans la chaîne principaleCompositions contenant des dérivés de tels polymères
C08L 25/02 - Homopolymères ou copolymères d'hydrocarbures
C08L 61/34 - Polymères de condensation d'aldéhydes ou de cétones avec des monomères couverts par au moins deux des groupes , et
Provided is a resin composition which gives a cured product of a photocurable resin having good crack resistance even when formed into a thick film, and capable of maintaining a low coefficient of linear expansion, low thermal weight loss, and a low shrinkage factor. This photosensitive silicone resin composition comprises (A) a silica particle-containing condensation reaction product and (B) a photopolymerization initiator, and is characterized in that the silica particle-containing condensation reaction product (A) is a condensation reaction product of a polysiloxane compound (a) comprising a hydrolytic condensation product of one or more silane compounds represented by the following general formula (1): R1n1SiX14-n1 (wherein R1, n1, and X1 are defined in the claims) and/or the silane compound, and silica particles (b), and has a terminal structure: Si-O-Y (wherein Y is defined in the claims) which satisfies the following formula (2): 0 < [Si-O-SiR33] / ([Si-O-R2] + [Si-O-SiR33]) ≤ 1 (wherein R2 and R3 are defined in the claims), and has a photopolymerizable functional group.
C08G 77/20 - Polysiloxanes contenant du silicium lié à des groupes aliphatiques non saturés
C08F 299/08 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires à partir de polycondensats non saturés à partir de polysiloxanes
C08G 77/14 - Polysiloxanes contenant du silicium lié à des groupes contenant de l'oxygène
C08L 83/06 - Polysiloxanes contenant du silicium lié à des groupes contenant de l'oxygène
C08L 83/07 - Polysiloxanes contenant du silicium lié à des groupes aliphatiques non saturés
An anisotropic conductive adhesive film which comprises: an organic binder that contains a cationically polymerizable substance; 0.01 to 15 parts by mass of a cation generator represented by general formula (1) per 100 parts by mass of the organic binder; and 0.1 to 20vol% of conductive particles relative to the whole volume of the organic binder. In general formula (1), Q, A, R4 and Y- are each as defined in the description.
H01R 11/01 - Éléments de connexion individuels assurant plusieurs emplacements de connexion espacés pour des organes conducteurs qui sont ou qui peuvent être interconnectés de cette façon, p. ex. pièces d'extrémité pour fils ou câbles supportées par le fil ou par le câble et possédant des moyens pour faciliter la connexion électrique avec quelqu'autre fil, borne, ou organe conducteur, répartiteurs caractérisés par la forme ou par la disposition de l'interconnexion entre leurs emplacements de connexion
C08G 59/68 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les catalyseurs utilisés
C09J 7/00 - Adhésifs sous forme de films ou de pellicules
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
H01B 5/16 - Conducteurs ou corps conducteurs non isolés caractérisés par la forme comprenant un matériau conducteur incorporé à un matériau isolant ou faiblement conducteur, p. ex. du caoutchouc conducteur
96.
Ablation layer, photosensitive resin structure, and method for producing relief printing plate using the photosensitive resin structure
A photosensitive resin structure having an ablation layer for a photosensitive resin for a relief printing that is capable of being processed by infrared radiation and containing an anionic polymer, a relief printing plate is produced by drawing a pattern by irradiating the ablation layer with infrared radiation; exposing the pattern by irradiating the photosensitive resin layer with ultraviolet radiation; and removing the ablation layer and unexposed photosensitive resin layer with a developer.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
G03F 7/26 - Traitement des matériaux photosensiblesAppareillages à cet effet
G03F 1/00 - Originaux pour la production par voie photomécanique de surfaces texturées, p. ex. masques, photomasques ou réticulesMasques vierges ou pellicules à cet effetRéceptacles spécialement adaptés à ces originauxLeur préparation
Disclosed is a photosensitive resin composition which has high film retention ratio after development and high sensitivity, while exhibiting high elongation degree and high storage stability. Specifically disclosed is a photosensitive resin composition which contains a hydroxy polyamide resin (A) and a photoacid generator (B). The hydroxy polyamide resin (A) has at least one structure selected from the group consisting of structures represented by general formula (1) (wherein Z1, Z2 and Z3 each independently represents a divalent organic group, and at least one of the Z1, Z2 and Z3 has an alicyclic structure or an aliphatic structure; and m1 represents an integer of 0 or 1) and structures represented by general formula (2) (wherein Z1, Z2 and Z3 each independently represents a divalent organic group, and at least one of the Z1, Z2 and Z3 has an alicyclic structure or an aliphatic structure; and m1 represents an integer of 0 or 1).
Disclosed is an organic-inorganic hybrid composition containing a metal oxide (A) having a particle diameter of 1-400 nm and a polymer emulsion particle (B) having a particle diameter of 10-800 nm. The polymer emulsion particle (B) is obtained by polymerizing a hydrolyzable silicon compound (b1) and a vinyl monomer (b2) having a secondary and/or tertiary amide group in the presence of water and an emulsifying agent.
C08L 43/04 - Homopolymères ou copolymères de monomères contenant du silicium
C08G 77/442 - Polymères séquencés ou greffés contenant des segments de polysiloxanes contenant des segments de polymères vinyliques
C08F 220/60 - Amides contenant de l'azote en plus de l'azote de la fonction carbonamide
C08F 230/08 - Copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule liaison double carbone-carbone et contenant du phosphore, du sélénium, du tellure ou un métal contenant un métal contenant du silicium
Provided is a self-supporting film having excellent optical characteristics as a result of being independently provided with an anti-reflection function. The self-supporting film comprises a concave-convex structure layer in which concave and convex shapes are periodically formed in the surface thereof, wherein the concave and convex shapes are periodically formed on at least one side of the concave-convex structure layer, the self-supporting film has an average thickness in the range of 0.2 μm to 20.0 μm, and the concave-convex structure layer has a yield strain of 1% or higher and a tensile elongation of 10% or higher.
Disclosed is a frame for a large pellicle wherein handleability is satisfactory and occurrence of an air path is suppressed when used. In the frame for a large pellicle stretching and supporting a large pellicle film so as to cover the opening section, a frame section forming the rim of the opening section comprises junctions of at least three places along the axial direction of the frame section.
G03F 1/64 - Pellicules, p. ex. assemblage de pellicules ayant une membrane sur un cadre de supportLeur préparation caractérisés par les cadres, p. ex. du point de vue de leur structure ou de leur matériau
brevets
