Taiwan Semiconductor Manufacturing Company, Ltd.
Taïwan, Province de Chine
Nouveaux brevets et marques déposées la semaine dernière
Dernière mise à jour : 2026-09-26
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Viewing 1 - 100 of 108
marques
brevets
| # | ID | Juridiction | Title |
|---|---|---|---|
| 1 | 19687173 |
|
TRANSISTOR DEVICE WITH MULTI-LAYER CHANNEL STRUCTURE |
| 2 | 19087814 |
|
Semiconductor Structure and Method Thereof |
| 3 | 19688275 |
|
HIGH-K ISOLATION OF FIN STRUCTURES |
| 4 | 19083424 |
|
GRINDING SYSTEM AND METHOD OF GRINDING SEMICONDUCTOR STRUCTURE |
| 5 | 19086946 |
|
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION |
| 6 | 19678257 |
|
FERROELECTRIC MEMORY DEVICES HAVING IMPROVED FERROELECTRIC PROPERTIES AND METHODS OF MAKING THE SAME |
| 7 | 19689155 |
|
METAL-INSULATOR-SILICIDE CAPACITORS |
| 8 | 19082567 |
|
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME |
| 9 | 19086793 |
|
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF |
| 10 | 19685397 |
|
TREATMENT OF ELECTRODES OF MIM CAPACITORS |
| 11 | 19685172 |
|
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME |
| 12 | 19087624 |
|
ON-DIE PARAMETER MEASURING CIRCUIT AND METHOD FOR OPERATING THE SAME |
| 13 | 19685182 |
|
SYSTEM FOR THERMAL TESTING A WAFER CHUCK AND METHODS FOR PERFORMING THE SAME |
| 14 | 19173296 |
|
WAFER INSPECTION SYSTEM AND METHOD THEREOF |
| 15 | 19678423 |
|
METHOD FOR FORMING A CRYSTALLINE PROTECTIVE POLYSILICON LAYER |
| 16 | 19679754 |
|
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF |
| 17 | 19693819 |
|
METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE |
| 18 | 19649937 |
|
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME |
| 19 | 19693823 |
|
PASSIVE SEMICONDUCTOR DEVICE |
| 20 | 19669999 |
|
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE |
| 21 | 19085180 |
|
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME |
| 22 | 19086044 |
|
MEMORY CELL, SEMICONDUCTOR DEVICE, AND FABRICATION METHOD THEREOF |
| 23 | 19695243 |
|
CLOCK SIGNAL DISTRIBUTION SYSTEM, INTEGRATED CIRCUIT DEVICE AND METHOD |
| 24 | 19685699 |
|
DEVICE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME |
| 25 | 19086265 |
|
METHODS AND DEVICES FOR INCREASING EFFICIENCY OF IMAGE SENSOR |
| 26 | 19463149 |
|
SEMICONDUCTOR STRUCTURE |
| 27 | 19673024 |
|
SEMICONDUCTOR DEVICE WITH AIR-VOID SPACER |
| 28 | 19692367 |
|
TRANSISTOR CONTACTS AND METHODS OF FORMING THE SAME |
| 29 | 19088271 |
|
INTEGRATED DEVICE AND MANUFACTURING METHOD THEREOF |
| 30 | 19274353 |
|
METHOD FOR METAL ION REMOVAL FROM METAL-CONTAINING SOLUTION USING FLUIDIZED BED HOMOGENEOUS CRYSTALLIZATION |
| 31 | 19088047 |
|
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME |
| 32 | 19671461 |
|
SEMICONDUCTOR STRUCTURE |
| 33 | 19692151 |
|
PACKAGE STRUCTURE |
| 34 | 19683699 |
|
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME |
| 35 | 19086839 |
|
MULTIPLE-INPUT FUSED MULTIPLY-AND-ACCUMULATE UNIT FOR THE LOGARITHM NUMBER SYSTEM |
| 36 | 19678335 |
|
APPARATUS AND METHOD FOR HANDLING WAFER STORAGE BOX |
| 37 | 19691783 |
|
METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURE |
| 38 | 19084896 |
|
LITHOGRAPHY APPARATUS AND METHOD FOR OPERATING THE SAME |
| 39 | 19635854 |
|
STRAIN RELIEF TRENCHES FOR EPITAXIAL GROWTH |
| 40 | 19678354 |
|
NOVEL INTERCONNECT STRUCTURE |
| 41 | 19087916 |
|
SEMICONDUCTOR DEVICE |
| 42 | 19687096 |
|
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME |
| 43 | 19082447 |
|
BONDED DIE STRUCTURES WITH BACKSIDE POWER DISTRIBUTION NETWORK AND INTEGRATED FUNCTONAL DIES AND METHODS OF FORMING THE SAME |
| 44 | 19685918 |
|
EDGE FILL FOR STACKED STRUCTURE |
| 45 | 19083534 |
|
Semiconductor Device Including Cells with Varying Cell Heights and Method of Manufacturing the Same |
| 46 | 19692212 |
|
DEVICE STRUCTURE WITH FERROELECTRIC LAYER |
| 47 | 19692225 |
|
INTERCONNECT STRUCTURE HAVING HEAT DISSIPATION CAPABILITY AND METHOD FOR MANUFACTURING THE SAME |
| 48 | 19683997 |
|
METHOD FOR FORMING SEMICONDUCTOR DEVICE |
| 49 | 19685272 |
|
IMAGE SENSOR DEVICES AND METHODS OF FORMATION |
| 50 | 19678512 |
|
MEMORY DEVICE |
| 51 | 19178449 |
|
MOVABLE VOLATILE ORGANIC COMPOUNDS (VOC) ROTOR ANTI-SKID CHAIN IMPLEMENT |
| 52 | 19685563 |
|
COMPUTE-IN-MEMORY LUT-BASED MULTIPLY-ADD APPARATUS |
| 53 | 19695138 |
|
CELL BOUNDARY REGION WITH BURIED POWER GRID SEGMENT, SEMICONDUCTOR DEVICE INCLUDING SAME, AND METHOD OF MANUFACTURING SAME |
| 54 | 19685340 |
|
METHODS OF REDUCING CAPACITANCE IN FIELD-EFFECT TRANSISTORS |
| 55 | 19690943 |
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| 56 | 19694080 |
|
LOW TEMPERATURE ERROR THERMAL SENSOR |
| 57 | 19685368 |
|
TRENCH CAPACITOR STRUCTURE AND METHODS OF MANUFACTURING |
| 58 | 19684287 |
|
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF |
| 59 | 19667715 |
|
SYSTEMS AND METHODS FOR TRAY CASSETTE WAREHOUSING |
| 60 | 19685710 |
|
ETCHING-DAMAGE-FREE INTERMETAL DIELECTRIC LAYER WITH THERMAL DISSIPATION FEATURE |
| 61 | 19685728 |
|
CONDUIT CHECK APPARATUS |
| 62 | 19682464 |
|
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME |
| 63 | 19086183 |
|
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME |
| 64 | 19199407 |
|
CIRCUIT BOARD DEVICE |
| 65 | 19690103 |
|
MEMORY CELL WITH OFFSET INTERCONNECT VIA |
| 66 | 19690362 |
|
HIGH DENSITY CAPACITOR IMPLEMENTED USING FINFET |
| 67 | 19691233 |
|
FAULT DIAGNOSTICS |
| 68 | 19088088 |
|
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME |
| 69 | 19684962 |
|
MEMORY SYSTEM AND OPERATING METHOD |
| 70 | 19097219 |
|
METHOD FOR REMOVING BY-PRODUCT IN PLASMA ETCHING APPARATUS |
| 71 | 19687582 |
|
LIGHT SENSOR FOR PACKAGE INTRUSION DETECTION |
| 72 | 19086564 |
|
INTERCONNECT STRUCTURE INCLUDING ALIGNED INTERCONNECT LAYERS AND METHOD FOR MANUFACTURING THE SAME |
| 73 | 19687108 |
|
SENSING CIRCUIT OF MEMORY DEVICE AND CONTROL METHOD OF SENSING CIRCUIT |
| 74 | 19301606 |
|
DIELECTRIC LAYERS AROUND SEMICONDUCTOR NANOSTRUCTURES IN STACKED TRANSISTORS |
| 75 | 19688249 |
|
PELLICLE AND METHOD OF MANUFACTURING THEREOF |
| 76 | 19344742 |
|
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| 77 | 19086046 |
|
SEMICONDUCTOR STRUCTURE |
| 78 | 19693065 |
|
LITHOGRAPHY SYSTEM WITH NON-INVASIVE MONITORING AND METHODS |
| 79 | 19085383 |
|
LATERAL ELECTRICAL PATH FROM CONTACT TO CONTACT |
| 80 | 19084062 |
|
FLEXIBLE ROW INTEGRATED CIRCUIT (IC) FLOORPLAN |
| 81 | 19686324 |
|
SILICIDE LAYER OF SEMICONDUCTOR DEVICE |
| 82 | 19696122 |
|
VOLTAGE REFERENCE CIRCUIT |
| 83 | 19086463 |
|
PACKAGE STRUCTURE INCLUDING AN EMBEDDED ACTIVE DIE AND METHODS FOR FORMING THE SAME |
| 84 | 19083832 |
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME |
| 85 | 19671468 |
|
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME |
| 86 | 19685870 |
|
Vertically Stacked Semiconductor Device Including a Hybrid Bond Contact Junction Circuit and Methods for Forming the Same |
| 87 | 19685652 |
|
Semiconductor Device and Method of Manufacturing |
| 88 | 19688134 |
|
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE |
| 89 | 19685916 |
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE |
| 90 | 19695951 |
|
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME |
| 91 | 19693794 |
|
OPTICAL FINGERPRINT SENSOR WITH ENHANCED ANTI-COUNTERFEITING FEATURES |
| 92 | 19685028 |
|
METHOD FOR FORMING CONDUCTIVE BUMPS BY PERFORMING A REFLOW PROCESS |
| 93 | 19687207 |
|
INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF |
| 94 | 19688304 |
|
STRUCTURE AND FABRICATION OF PCM-BASED CAPACITOR BANK |
| 95 | 19086422 |
|
SOURCE/DRAIN STRUCTURE AND METHODS THEREOF |
| 96 | 19687007 |
|
DIRECT NON-OHMIC SWITCH FOR VOLTAGE INSTABILITY PROTECTION AND METHODS FOR FORMING THE SAME |
| 97 | 19085791 |
|
SEMICONDUCTOR PROCESSING EQUIPMENT AND CONTROL METHOD THEREOF |
| 98 | 19687017 |
|
MULTILAYER ALD COATING FOR CRITICAL COMPONENTS IN PROCESS CHAMBER |
| 99 | 19084678 |
|
INTEGRATED OPTICAL DEVICE AND METHOD OF FORMING THE SAME |
| 100 | 19685096 |
|
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME |



