Taiwan Semiconductor Manufacturing Company, Ltd.

Taïwan, Province de Chine

Nouveaux brevets et marques déposées la semaine dernière

Dernière mise à jour : 2026-07-11

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brevets

# ID Juridiction Title
1 19013555 OPTICAL DEVICES AND METHODS OF MANUFACTURE
2 19553569 LEVELING SYSTEM FOR CANTILEVER CALIBRATION
3 19191948 RF DIFFERENTIAL CIRCUIT WITH COMMON MODE NOISE REJECTION
4 19555772 ONE-TIME-PROGRAMMABLE MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF
5 19557083 PACKAGE STRUCTURE
6 19559284 SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF
7 19551790 INTEGRATED CIRCUIT PACKAGE AND METHOD
8 19013198 DIODE/CLAMP FOR ESD PROTECTION AND FRONTSIDE CONDUCTIVE LAYER RESISTOR FOR THERMAL SENSING
9 19555707 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
10 19553757 MULTI-GATE DEVICES WITH MULTI-LAYER INNER SPACERS AND FABRICATION METHODS THEREOF
11 19555937 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
12 19557212 SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
13 19013730 METHODS OF FORMING DIELECTRIC FEATURES IN STACKED TRANSISTORS
14 19014862 THREE-DIMENSIONAL ACCELERATOR FOR GENERATIVE ARTIFICIAL INTELLIGENCE OPERATIONS
15 19558514 SEMICONDUCTOR STRUCTURE HAVING DEEP TRENCH CAPACITOR AND METHOD OF MANUFACTURING THEREOF
16 19186812 SEMICONDUCTOR DEVICE AND METHODS FOR FORMING THE SAME
17 19180906 MEMORY DEVICES WITH MULTIPLE TRACKS FORMING ACCESS LINE AND METHODS FOR MANUFACTURING THE SAME
18 19012359 SEMICONDUCTOR DEVICE
19 19204148 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
20 19198658 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
21 19008944 BONDED PHOTONIC STRUCTURES INCLUDING VERTICAL COUPLING INTERLAYER AND METHODS OF FABRICATION THEREOF
22 19174088 INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING
23 19553618 INTEGRATED CIRCUIT HAVING TRANSISTORS WITH DIFFERENT WIDTH SOURCE AND DRAIN TERMINALS
24 19008961 THROUGH-SUBSTRATE VIA AND METHOD OF MAKING SAME
25 19558098 GATE SPACERS IN SEMICONDUCTOR DEVICES
26 19560996 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
27 19010989 INTERCONNECT STRUCTURE INCLUDING CONTACT VIA WITH INCREASED CONTACT AREA TO METAL LINE AND METHOD FOR MANUFACTURING THE SAME
28 19012957 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
29 19558013 MEMORY INTERFACE
30 19014708 SEMICONDUCTOR DEVICES AND METHODS OF FORMATION
31 19011432 METAL RIVET STRUCTURE AND METHOD FOR FABRICATING THE SAME
32 19554240 SEMICONDUCTOR DEVICE WITH VARYING NUMBERS OF CHANNEL LAYERS AND METHOD OF FABRICATION THEREOF
33 19009353 SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
34 19201983 SUPER SRAM CELL
35 19558640 IMAGE SENSOR DEVICE
36 19557564 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
37 19012309 METHODS OF FORMING LOGIC CIRCUITS WITH REDUCED TRANSISTOR COUNTS AND COMPUTER-READABLE-MEDIUM FOR PERFORMING THE SAME
38 19010596 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
39 19209200 STACKED TRANSISTOR DEVICES AND METHODS OF FORMING THE SAME
40 19216067 SEMICONDUCTOR STRUCTURES AND METHOD OF FABRICATING THE SAME
41 19188517 SEMICONDUCTOR DEVICE DESIGN WITH CAPPING SEMICONDUCTOR LAYER
42 19176555 METAL GATE ETCH-BACK IN SEMICONDUCTOR DEVICES
43 19015555 PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
44 19014692 SEMICONDUCTOR DEVICES AND METHODS OF FORMATION
45 19436378 METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH STACKED MEMORY PERIPHERY AND ARRAY
46 19195906 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
47 19203344 ARTIFICIAL INTELLIGENCE ACCELERATOR AND METHOD FOR OPERATING THE SAME
48 19015379 AIR SPACER WITH LINER FOR SEMICONDUCTOR DEVICES
49 19555933 PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
50 19557217 PACKAGE LID WITH A VAPOR CHAMBER BASE HAVING AN ANGLED PORTION AND METHODS FOR FORMING THE SAME
51 19557030 TRANSISTORS WITH VARYING WIDTH NANOSHEET
52 19223440 SEMICONDUCTOR DEVICE AND METHOD
53 19556792 SEMICONDUCTOR MEMORY STRUCTURE HAVING ENHANCED MEMORY WINDOW AND METHOD FOR MANUFACTURING THE SAME
54 19555214 MULTI-TIER DEEP TRENCH CAPACITOR AND METHODS OF FORMING THE SAME
55 19558517 SEMICONDUCTOR STRUCTURE
56 19232347 SOURCE/DRAIN REGIONS AND CONTACT PLUGS IN STACKING TRANSISTORS AND METHODS OF FORMING THE SAME
57 19560825 SUBSTRATE CONTACT IN WAFER BACKSIDE
58 19012418 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
59 19009180 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
60 19552593 SEMICONDUCTOR PACKAGE INCLUDING AN INTEGRATED CIRCUIT DIE AND AN INDUCTOR OR A TRANSFORMER
61 19217246 NANOSTRUCTURE FIELD-EFFECT TRANSISTOR DEVICES AND METHODS OF FORMING
62 19011073 INTERCONNECT STRUCTURE HAVING LAYERED AIR GAPS AND METHOD FOR MANUFACTURING THE SAME
63 19012154 REMOVAL OF INTERPOSER LAYER
64 19553459 PHASE-CHANGE MATERIAL (PCM) RADIO FREQUENCY (RF) SWITCHING DEVICE WITH THIN SELF-ALIGNED DIELECTRIC LAYER
65 19192729 HYBRID CHANNEL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
66 19008934 COPPER BUMPS ON COPPER PADS IN SEMICONDUCTOR INTERCONNECT STRUCTURES AND METHODS FOR FORMING THE SAME
67 19559361 RETICLE INSPECTION AND PURGING METHOD AND TOOL
68 19011911 SEMICONDUCTOR PACKAGE AND METHODS OF FORMING AND USING THE SAME
69 19008954 COMPOSITE PACKAGE AND METHODS FOR FORMING THE SAME
70 19557368 FERROELECTRIC TUNNEL JUNCTION STRUCTURE WITH L-SHAPED SPACERS
71 19444105 FINFET WITH LONG CHANNEL LENGTH STRUCTURE
72 19550500 POWER RAIL AND SIGNAL LINE ARRANGEMENT IN INTEGRATED CIRCUITS HAVING STACKED TRANSISTORS
73 19012950 SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
74 19181891 WORK FUNCTION METAL DIFFUSION BARRIER INTEGRATION IN VERTICALLY-STACKED TRANSISTORS AND STRUCTURES RESULTING THEREFROM
75 19009599 LITHOGRAPHY METHOD
76 19554227 COMPOSITIONS FOR REDUCING RESIST CONSUMPTION OF EXTREME ULTRAVIOLET METALLIC TYPE RESIST
77 19011239 INTERCONNECTION STRUCTURE, AND METHOD FOR FABRICATING THE SAME
78 19011680 BACK-SIDE POWER RAIL DEVICE AND METHOD OF MAKING SAME