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2024
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Invention
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Package comprising at least two contacts for microtechnology, method for handling a package, and ... |
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Invention
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Method for soldering an electronic component to a circuit board by jetting liquefied solder into ... |
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Invention
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Device for handling a test contact.
A device for handling a test contact in which the device inc... |
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2023
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Invention
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Method for producing a solder contact surface on a chip by producing a sinter paste interface.
A... |
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Invention
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Laser-assisted soldering apparatus.
A soldering apparatus includes an application device, a conv... |
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Invention
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Depositing station and device for generating contact metallizations.
The invention relates to a ... |
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Invention
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Method and device for separating a semiconductor component from a carrier. The invention relates ... |
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Invention
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Test contact, table device, test contact holding device, and method for receiving a test contact ... |
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Invention
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Device and method for establishing a contact connection. The invention relates to a device (01) f... |
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Invention
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Bonding head and bonding apparatus.
A bonding head for holding a substrate to be soldered includ... |
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Invention
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Device, system and method for repairing a test contact assembly. The invention relates to a devic... |
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P/S
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Soldering materials in the nature of soft solder, solder wire and solder balls for the contact me... |
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P/S
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Contact metallizations for micro compounds made from
soldering material, insofar as included in ... |
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P/S
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Automatic machines, namely automatic plating machines with respect to micro periphery; machines, ... |
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2022
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Invention
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Laser-assisted soldering apparatus and solder deposition machine.
A laser-assisted soldering app... |
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Invention
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Press-forming device for depositing solder and producing individual solder bodies.
A press-formi... |
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Invention
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Chip arrangement and method for forming a sintered contact connection.
A method for forming a co... |
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2021
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Invention
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Method for removing and repositioning electronic components connected to a circuit board. A devic... |
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Invention
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Method for electrolessly depositing a metal layer onto a substrate.
A method for electrolessly d... |
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Invention
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Method for electrolessly depositing a metal layer onto a substrate. The invention relates to a me... |
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Invention
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Method for monitoring a laser soldering process, and laser soldering system using a spectroscope ... |
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Invention
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Method for removing electronic components connected to a circuit board. A device for removing a d... |
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2020
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Invention
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Solder ball feeding device. The invention relates to a solder ball feeding device, comprising a s... |
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Invention
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Plating bath for the electroless plating of a substrate.
A plating bath for electroless plating ... |
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Invention
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Plating bath for the electroless plating of a substrate. The invention relates to a plating bath ... |
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2019
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Invention
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Method and device including laser heating of gripper for repairing a test contact arrangement. A ... |
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Invention
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Method and device for repairing a test contact arrangement. The invention relates to a method for... |
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2018
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P/S
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Common metals and their alloys, unwrought or semi-wrought; transportable buildings of metal; non-... |
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P/S
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Common metals and their alloys, metal materials for building
and construction; transportable bui... |
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Invention
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Semiconductor chip stack arrangement and semiconductor chip for producing such a semiconductor ch... |
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P/S
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Common metals and their alloys, Materials of metal for building and construction; Transportable b... |
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Invention
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Method and device for establishing a wire connection as well as a component arrangement having a ... |
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Invention
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Method and device for producing a wire connection, and component arrangement with wire connection... |
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Invention
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Method and laser arrangement for fusing a solder material deposit by means of laser energy. The i... |
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Invention
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Method and laser assembly for melting a solder material deposit by means of laser energy. The inv... |
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2017
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Invention
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Method for forming solder deposits. A method for forming solder deposits on elevated contact meta... |
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2016
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Invention
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Method for placing and contacting a test contact. The invention relates to a method for placing a... |
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Invention
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Method for placing and making contact with a test contact. The invention relates to a method for ... |
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Invention
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Device for removing a test contact of a test contact arrangement. A device for the placing and co... |
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Invention
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Device for removing a test contact of a test contact arrangement. The invention relates to a devi... |
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Invention
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Chip arrangement and method for forming a contact connection.
The invention relates to a chip ar... |
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Invention
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Chip assembly and method for forming a contact connection. The invention relates to a chip arrang... |
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2015
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Invention
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Solder ball feeding device.
The invention relates to a solder ball feeding device (40), comprisi... |
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Invention
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Device for the separate application of bonding material deposits. A device for the application of... |
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Invention
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Solder sphere feeding device with an ultrasonic system and a pressure line. The invention relates... |
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Invention
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Device for the individual application of connection material depots. The invention relates to a d... |
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Invention
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Arrangement for applying conductive nanoparticles onto a substrate. An arrangement for applying m... |
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2014
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Invention
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Method for producing a chip module. The invention concerns a method for producing a chip module h... |
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Invention
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Device for the separate application of solder material deposits. The invention relates to a devic... |
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Invention
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Arrangement and method for the reproducible application of small amounts of liquid. An arrangemen... |
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Invention
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Device for the separate application of connecting material deposits. The invention relates to a d... |
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P/S
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Contact metalizations for microconnections made from
soldering material, included in class 6. Me... |
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P/S
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Material treatment of substrates used in the field of microelectronics, in particular semiconduct... |
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Invention
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Semiconductor chip assembly and method for manufacturing the same. The invention relates to a chi... |
