at & S Austria Technologie & Systemtechnik Aktiengesellschaft

Autriche


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Quantité totale PI 515
Quantité totale incluant filiales 515 (+ 0 pour les filiales)
Rang # Quantité totale PI 2 589
Note d'activité PI 3,3/5.0    386
Rang # Activité PI 1 820
Symbole boursier
ISIN AT0000969985
Capitalisation 2.0B  (EUR)
Classe Nice dominante Appareils et instruments scienti...

Brevets

Marques

286 3
0 0
212 6
8
 
Dernier brevet 2025 - Component carrier with stamped d...
Premier brevet 2004 - Method for coating blanks for th...
Dernière marque 2025 - AT&S ADVANCED TECHNOLOGIES & SOL...
Première marque 2009 - AT&S

Filiales

1 subsidiaries with IP (0 patents, 0 trademarks)

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Industrie (Classification de Nice)

Derniers inventions, produits et services

2025 Invention Component carrier with photoimageable dielectric layer and structured conductive layer being used...
P/S Providing information relating to material treatment; Rental of air conditioning apparatus; air p...
P/S Apparatus, instruments and cables for electricity; electrical and electronic components; electri...
Invention Method for embedding a component in a printed circuit board. A printed circuit board or a printe...
Invention A component carrier assembly and method for manufacturing a component carrier assembly. The inven...
Invention Metal structure for a component carrier and manufacturing method. A metal structure for a compon...
Invention Component carrier, method for manufacturing a component carrier and a package comprising a compon...
Invention Component carrier and manufacturing method. A component carrier includes a stack having at least...
Invention Component carrier assembly and method for manufacturing a component carrier assembly. A componen...
Invention Antenna assembly with stack and antenna structure. An antenna assembly includes a stack and an a...
Invention Component carrier and method of manufacturing the same. A component carrier includes a stack hav...
Invention Component carrier, method for manufacturing thereof and package comprising a component carrier. ...
Invention Component carrier with resin-embedded component, and manufacturing method. There is described a c...
Invention Component carrier with cavity and laser protection structure. A component carrier with a stack i...
Invention Component carrier and method of manufacturing the component carrier. Component carrier and method...
Invention Component carrier with constricted through hole and electrically insulating coating. A component...
Invention Shielded multicomponent high-frequency package and manufacturing method thereof. The present inve...
Invention Component carrier and method for manufacturing the component carrier. There is described a compon...
2024 Invention Component carrier and method for manufacturing a component carrier. A component carrier includes...
Invention Component carrier with embedded interposer laterally between electrically conductive structures o...
Invention Component carrier with stacks connected by intermediate layer, and manufacturing method. There is...
Invention Component carrier and cluster to be embedded in component carrier. A cluster (100) configured to ...
P/S Apparatus, instruments and cables for electricity; Electrical and electronic components; Electric...
Invention Component carrier with embedded component and gap filled with fiber-free resins. A component carr...
Invention Component carrier with fillers at an interface, and manufacture method. There is described a comp...
Invention Component carrier with distinct resin flowed portions, and manufacturing method. There is describ...
Invention A method for fabricating at least one conductive structure layer on or in a component carrier. Th...
Invention Component carrier with hydrophobic protection film, and manufacturing method. There is described ...
Invention Component carrier. A component carrier having: a stack comprising a plurality of electrically co...
Invention Component carrier with ultra-thin insulation film and manufacturing method. A component carrier ...
Invention Component carrier with flexible portions and manufacturing method. A component carrier having a ...
Invention Electronic device with electronic component connected to two organic-type component carriers bein...
Invention Component carrier having a multi-layer structure of different electrically conductive materials a...
Invention Electronic device with electrically functional component providing electric functions and connect...
2023 Invention Component carrier with shielded cavity, antenna and non-conductive low loss high frequency struct...
Invention Component carrier with migration-preventing metal on dielectric, and manufacturing method. There ...
Invention Component carrier with migration-preventing structure, and manufacturing method. There is describ...
Invention Component carrier and method of producing the same. The invention concerns a component carrier co...
Invention Component carrier with shielded cavity and antenna. Component carrier (100) which comprises a sta...
Invention Component carrier with stamped design layer structure and embedded component. A component carrie...
Invention Package and manufacturing method. A package and its manufacturing method are presented. The pack...
Invention Package with component carrier, interposer and component and method of manufacturing the same. A...
Invention Component carrier with embedded electronic switch components and a capacitor device. A component...
Invention Package and method of manufacturing a package. A package includes an inorganic core having at le...
Invention Component carrier with protruding dielectric signal element and manufacture method. A component ...
Invention Ic substrate having central section with vertically stacked functional volume sections. An integ...
Invention Package with ic substrate and electronic component connected with direct physical contact. A pac...
Invention Component carrier with rough surface and smooth surface metal traces and manufacturing method. A...
Invention Cavity formation using depth routing, component carrier and component carrier assembly. A compon...
Invention Direct resin embedding. A method of manufacturing a component carrier includes providing a core s...
2022 P/S Apparatus and instruments for conducting, switching, transforming, accumulating, regulating or co...
Invention Stamping surface profile in design layer and using patterned electroplating protection structure ...
2021 Invention Stamping surface profile in design layer and filling an indentation with metallic base structure ...
2018 P/S Electrical circuits and circuit boards; Parts for circuit boards; Circuit boards for connecting a...
P/S Electrical circuits and circuit boards; Parts of integrated circuit cards; Apparatus and instrume...
2017 P/S Substrates as carriers of semiconductors. Printing apparatus for circuit boards; Photolithographi...
2013 P/S Machines and machine tools, in particular gas-operated soldering apparatus, soldering irons and ...
2010 P/S Printed circuits, chips (integrated circuits), circuit boards, multi-layered circuit boards, fle...
P/S Printed circuits, chips (integrated circuits), circuit boards, multi-layered circuit boards, flex...
P/S Printed circuits, Circuit boards,Multi-layered printed circuit boards, Flexible circuit boards,Se...
2009 P/S Machines and machine tools, especially gas operated soldering apparatus, soldering irons and sol...