|
2023
|
Invention
|
Method and apparatus for plasma dicing a semi-conductor wafer.
The present invention provides a ... |
|
|
Invention
|
Protective coating for plasma dicing. The present invention provides a method for an improved pro... |
|
2021
|
Invention
|
Plasma source configuration. The present invention provides an improved plasma source configurati... |
|
2020
|
Invention
|
Plasma source configuration.
The present invention provides an improved plasma source configurat... |
|
|
Invention
|
Method and apparatus for plasma dicing a semi-conductor wafer. The present invention provides a m... |
|
|
Invention
|
Ion filter using aperture plate with plurality of zones. The present invention provides a method ... |
|
2019
|
Invention
|
Method for dicing die attach film. The present invention provides a method for dicing a substrate... |
|
|
Invention
|
Method for dicing die attach film.
The present invention provides a method for dicing a substrat... |
|
2018
|
Invention
|
Device for treating an object with plasma. A system for treating an object with plasma includes a... |
|
2017
|
Invention
|
Ion filtering methods and associated ion filtering system. The present invention provides a metho... |
|
|
Invention
|
Ion filter.
The present invention provides a method for using ion filtering to adjust the number... |
|
|
Invention
|
Method for removing a metal deposit arranged on a surface in a chamber. The invention relates to ... |
|
2016
|
Invention
|
Method for dicing a substrate with back metal. The present invention provides a method for dicing... |
|
2014
|
Invention
|
Apparatus and method for carrying substrates.
The present invention provides a method and an app... |
|
2013
|
Invention
|
Device for treating an object with plasma.
A system for treating an object with plasma includes ... |
|
|
Invention
|
Method to determine the thickness of a thin film during plasma deposition. The present invention ... |
|
|
P/S
|
Plasma etching machines; semiconductor manufacturing machines; semiconductor wafer processing equ... |
|
2012
|
P/S
|
Machine modules for manufacturing semiconductors, by means of cathode sputtering, evaporation, ch... |
|
|
Invention
|
Method to determine the thickness of a thin film during plasma deposition.
The present invention... |
|
2010
|
P/S
|
Software for controlling plasma etching and plasma
deposition machines used in the fabrication o... |
|
|
P/S
|
Software for controlling plasma etching and plasma deposition machines used in the fabrication of... |
|
|
P/S
|
Plasma etching and plasma deposition machines used in the
fabrication of semiconductor devices a... |
|
|
P/S
|
Plasma etching machines; semiconductor manufacturing
machines; semiconductor substrates manufact... |
|
|
P/S
|
Plasma etching machines; semiconductor manufacturing
machines; semiconductor wafer processing eq... |
|
2008
|
P/S
|
Plasma etching machines; Semiconductor manufacturing machines; Semiconductor wafer processing equ... |
|
|
P/S
|
Plasma etching machines; Semiconductor manufacturing machines; Semiconductor substrates manufactu... |
|
2006
|
P/S
|
plasma etching and plasma deposition machines used in the fabrication of semiconductor devices an... |
|
2003
|
P/S
|
Machine modules for manufacturing semiconductors by means of
cathode sputtering, evaporation, ch... |
|
|
P/S
|
Machine modules for manufacturing semiconductors, by means
of cathode sputtering, evaporation, c... |
|
2002
|
P/S
|
Process modules, namely plasma reactors, wafer processing modules, semiconductor wafer process mo... |
|
1990
|
P/S
|
machines for etching semiconductors |
