|
2025
|
Invention
|
Method for preparing a thin layer of ferroelectric material.
A method for preparing a monodomain... |
|
|
Invention
|
Method for the production of a single-crystal film, in particular piezoelectric.
A method of man... |
|
|
Invention
|
Semiconductor structure and manufacturing method for monolithic integration of functionalities. A... |
|
|
Invention
|
Method for treating a substrate having a surface made of a semiconductor material. The present in... |
|
|
Invention
|
Substrate having a graphene oxide layer, intended for transferring a layer by laser separation, a... |
|
|
Invention
|
Method for preparing a composite structure for producing a homoepitaxial silicon carbide layer, a... |
|
|
Invention
|
Silicon carbide-based composite structure having good vertical electrical conduction. The inventi... |
|
|
Invention
|
Method for producing a ferroelectric layer, transferred onto a substrate, with polarisation of im... |
|
|
Invention
|
Semiconductor substrate for laser separation and method for manufacturing three-dimensional semic... |
|
|
Invention
|
Method for fabricating a strained semiconductor-on-insulator substrate.
A method for fabricating... |
|
|
Invention
|
Method for preparing a support substrate made of polycrystalline material and method for manufact... |
|
|
Invention
|
Method for producing a stacked structure of the strained silicon-on-insulator type using a layer ... |
|
|
Invention
|
Multi-step chemical-mechanical polishing method for materials used in the semiconductor industry.... |
|
|
Invention
|
Method for manufacturing a substrate, and substrate. The invention relates to a method for manufa... |
|
|
Invention
|
Heterostructure comprising a rough exposed portion of a support substrate. The present invention ... |
|
|
Invention
|
Method for treating a substrate having a polycrystalline silicon carbide rear face. The present i... |
|
|
Invention
|
Method for manufacturing a tiled donor substrate, involving an additive manufacturing technique. ... |
|
|
Invention
|
Method for assembling two substrates by molecular adhesion. The invention relates to a method for... |
|
|
Invention
|
Method for assembling two substrates by molecular bonding. The invention relates to a method for ... |
|
2024
|
Invention
|
Elastic-wave device. The present invention relates to an elastic-wave device, in particular a she... |
|
|
Invention
|
Elastic wave device. The present invention relates to an elastic wave device, in particular a she... |
|
|
Invention
|
Elastic-wave device with partially buried interdigitated comb electrodes. The present invention r... |
|
|
Invention
|
Method for direct bonding between two substrates. The invention relates to a method for direct bo... |
|
|
Invention
|
Method for directly bonding two substrates. The invention relates to a method for directly bondin... |
|
|
Invention
|
Manufacturing of a donor substrate for the manufacture of a poi structure. The present invention ... |
|
|
Invention
|
Refreshing of a donor substrate for the manufacture of a poi structure. The present invention rel... |
|
|
Invention
|
Manufacturing of a poi structure with a highly uniform piezoelectric layer. The present invention... |
|
|
Invention
|
Method for manufacturing a substrate comprising a plurality of tiles. The invention relates to a ... |
|
|
Invention
|
Chip transfer method. The invention relates to a method for transferring chips onto a receiver su... |
|
|
Invention
|
Method for producing a substrate comprising a plurality of blocks. The invention relates to a met... |
|
|
Invention
|
Base structure for quantum devices and manufacturing method. The invention relates to a structure... |
|
|
Invention
|
Method for measuring the thickness of a superficial layer of an soi substrate. The invention rela... |
|
|
Invention
|
Carrier comprising a layer for trapping electrical charges for a composite substrate. The inventi... |
|
2023
|
Invention
|
Method for assembling two substrates by molecular adhesion and structure obtained by such a metho... |
|
|
Invention
|
Substrate for electronic device.
A substrate for a power or radiofrequency electronic device inc... |
|
|
Invention
|
Method for producing a structure comprising at least two chips on a substrate.
A method for manu... |
|
|
Invention
|
Piezoelectric-on-insulator (poi) substrate and method for producing a piezoelectric-on-insulator ... |
|
|
Invention
|
Substrate comprising vias and associated manufacturing methods.
A substrate is provided, includi... |
|
|
Invention
|
Surface acoustic wave device incorporating a thin layer of metal material.
A surface wave device... |
|
|
Invention
|
Method for transferring a thin film onto a support substrate.
A method for transferring a thin f... |
|
2022
|
Invention
|
Method for transferring a thin film onto a support substrate.
The invention relates to a method ... |
|
|
Invention
|
Method for manufacturing a 3d circuit with shared recrystallisation and dopant activation steps. ... |
|
|
P/S
|
Treatment of semiconductor materials, namely, mechanical, chemical, physical treatment, polishing... |
|
|
P/S
|
Multi-layer substrates consisting of semiconductors;
multi-layer substrates consisting of semico... |
|
2018
|
P/S
|
Semiconductor substrates for opto-electronics, micro-electronics, and micro-engineering, namely, ... |
|
2016
|
P/S
|
Treatment of materials by means of annealing, thermal annealing, rapid thermal annealing, laser a... |
|
|
P/S
|
Semiconductor substrates for opto-electronics, for
micro-electronics, micro-engineering and deri... |
|
2014
|
P/S
|
Magnetic, optical, digital and electronic recording media;
semi-conductor wafers; semi-conductor... |
|
2011
|
P/S
|
Semiconductor substrates for optoelectronics,
microelectronics, micromechanics and derived activ... |
|
|
P/S
|
Semiconductor substrates for optoelectronics, microelectronics, micromechanics and derived activi... |
|
2009
|
P/S
|
Components for microelectronic devices, flat screens,
integrated optical waveguides, sensors, im... |
|
|
P/S
|
[ Silicon chips, semi-conductors, integrated circuits and silicon wafers for micro-electronics, f... |
|
2007
|
P/S
|
Components for microelectronics, optoelectronics,
micro-engineering, for flat panel displays, fo... |
|
2005
|
P/S
|
Components for micro-electronics, for flat screens, for integrated optical guides, for sensors, f... |
|
2002
|
P/S
|
Silicon and semiconductor substrates for use in
microelectronics, micromechanics and derived act... |
|
|
P/S
|
Substrats de silicium et de semi-conducteurs pour la micro-électronique, pour la micro-mécanique ... |
|
|
P/S
|
[ NON-METALLIC SILICON SUBSTRATES SOLD IN INGOTS OR SLICES FOR THE MANUFACTURE OF SEMICONDUCTORS,... |
|
|
P/S
|
Silicon and semiconductor substrates for microelectronics, micromechanics, and activities derived... |
|
1999
|
P/S
|
SERVICES FOR THE TREATMENT OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS FOR THE MANUF... |
|
|
P/S
|
[ SCIENTIFIC, LABORATORY AND INDUSTRIAL RESEARCH SERVICES, CONSULTING SERVICES, ] ENGINEERING SER... |
|
1998
|
P/S
|
Composants pour la micro-électronique, pour les écrans
plats, pour les guides optiques intégrés,... |
|
1997
|
P/S
|
Devices and components for microelectronics, namely microelectronic semiconductor components, opt... |
|
|
P/S
|
Substrates of materials for microelectronics, flat screens,
integrated optical guides, sensors a... |
