Soitec

France


Commandez votre montre hebdomadaire Soitec
Quantité totale PI 1 053
Quantité totale incluant filiales 1 053 (+ 0 pour les filiales)
Rang # Quantité totale PI 1 303
Note d'activité PI 3,5/5.0    645
Rang # Activité PI 1 110
Symbole boursier
ISIN FR0013227113
Capitalisation 2.4B  (EUR)
Industrie Semiconductor Equipment & Materials
Secteur Technology
Classe Nice dominante Appareils et instruments scienti...

Brevets

Marques

566 7
2 4
462 9
3
 
Dernier brevet 2026 - Method for producing a silicon s...
Premier brevet 1995 - Semi-insulating wafer
Dernière marque 2022 - SMARTSIC
Première marque 1997 - SMARTCUT

Filiales

1 subsidiaries with IP (0 patents, 0 trademarks)

3 subsidiaries without IP

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Industrie (Classification de Nice)

Derniers inventions, produits et services

2025 Invention Semiconductor structure for digital and radiofrequency applications, and method for manufacturing...
Invention Membrane transfer method. A method for producing a device comprising a piezoelectric membrane ad...
Invention Method for producing a silicon substrate for quantum applications. CarDonDonCarDonDonDon) consist...
Invention Method for preparing a thin layer of single-domain ferroelectric material. The invention relates ...
Invention Method for preparing a thin layer of ferroelectric material. A method for preparing a monodomain...
Invention Method for preparing a substrate comprising a thin layer of piezoelectric material transferred to...
Invention Optimisation of the orientation of substrates passing, in batches, into chemical treatment baths....
Invention Method for manufacturing a photonic substrate. The invention relates to a photonic substrate (1) ...
Invention Method for the production of a single-crystal film, in particular piezoelectric. A method of man...
Invention Method for producing a composite structure including a stack of layers made of single-crystal iii...
Invention Method for manufacturing a donor wafer for transferring thin layers, and donor wafer. The inventi...
Invention Method for manufacturing a substrate comprising an electric charge trapping layer. The invention ...
Invention Multilayer structure for an elastic wave device. 32lLTOLTOSiO2SiO2SiO2 being the thickness of the...
Invention Elastic wave device. The invention relates to an elastic wave device in the field of elastic wave...
Invention Multilayer structure for an elastic-wave device. 32lLNOLNOSiO2SiO2LNOSiO2LNOSiO2SiO2 is equal to ...
Invention Semiconductor structure and manufacturing method for monolithic integration of functionalities. A...
Invention Method for treating a substrate having a surface made of a semiconductor material. The present in...
Invention Substrate having a graphene oxide layer, intended for transferring a layer by laser separation, a...
Invention Method for preparing a composite structure for producing a homoepitaxial silicon carbide layer, a...
Invention Silicon carbide-based composite structure having good vertical electrical conduction. The inventi...
Invention Method for producing a ferroelectric layer, transferred onto a substrate, with polarisation of im...
Invention Semiconductor substrate for laser separation and method for manufacturing three-dimensional semic...
Invention Method for fabricating a strained semiconductor-on-insulator substrate. A method for fabricating...
Invention Method for preparing a support substrate made of polycrystalline material and method for manufact...
Invention Method for producing a stacked structure of the strained silicon-on-insulator type using a layer ...
Invention Multi-step chemical-mechanical polishing method for materials used in the semiconductor industry....
Invention Method for manufacturing a substrate, and substrate. The invention relates to a method for manufa...
Invention Heterostructure comprising a rough exposed portion of a support substrate. The present invention ...
Invention Method for treating a substrate having a polycrystalline silicon carbide rear face. The present i...
Invention Method for manufacturing a tiled donor substrate, involving an additive manufacturing technique. ...
Invention Method for assembling two substrates by molecular adhesion. The invention relates to a method for...
Invention Method for assembling two substrates by molecular bonding. The invention relates to a method for ...
2024 Invention Method for direct bonding between two substrates. The invention relates to a method for direct bo...
Invention Method for directly bonding two substrates. The invention relates to a method for directly bondin...
Invention Method for measuring the thickness of a superficial layer of an soi substrate. The invention rela...
Invention Carrier comprising a layer for trapping electrical charges for a composite substrate. The inventi...
2023 Invention Method for manufacturing a support substrate for a radiofrequency application. A method for manu...
Invention Process for fabricating a piezoelectric or semiconductor structure. A process for fabricating a ...
Invention Process for fabricating a structure comprising a layer that acts as a barrier to diffusion of ato...
Invention Method for assembling two substrates by molecular adhesion and structure obtained by such a metho...
Invention Substrate for electronic device. A substrate for a power or radiofrequency electronic device inc...
Invention Method for producing a structure comprising at least two chips on a substrate. A method for manu...
Invention Piezoelectric-on-insulator (poi) substrate and method for producing a piezoelectric-on-insulator ...
Invention Substrate comprising vias and associated manufacturing methods. A substrate is provided, includi...
Invention Surface acoustic wave device incorporating a thin layer of metal material. A surface wave device...
2022 Invention Method for manufacturing a 3d circuit with shared recrystallisation and dopant activation steps. ...
P/S Treatment of semiconductor materials, namely, mechanical, chemical, physical treatment, polishing...
P/S Multi-layer substrates consisting of semiconductors; multi-layer substrates consisting of semico...
2018 P/S Semiconductor substrates for opto-electronics, micro-electronics, and micro-engineering, namely, ...
2016 P/S Semiconductor substrates for opto-electronics, for micro-electronics, micro-engineering and deri...
2014 P/S Magnetic, optical, digital and electronic recording media; semi-conductor wafers; semi-conductor...
2011 P/S Semiconductor substrates for optoelectronics, microelectronics, micromechanics and derived activ...
P/S Semiconductor substrates for optoelectronics, microelectronics, micromechanics and derived activi...
2009 P/S Components for microelectronic devices, flat screens, integrated optical waveguides, sensors, im...
P/S [ Silicon chips, semi-conductors, integrated circuits and silicon wafers for micro-electronics, f...
2007 P/S Components for microelectronics, optoelectronics, micro-engineering, for flat panel displays, fo...
2005 P/S Components for micro-electronics, for flat screens, for integrated optical guides, for sensors, f...
2002 P/S Silicon and semiconductor substrates for use in microelectronics, micromechanics and derived act...
P/S Substrats de silicium et de semi-conducteurs pour la micro-électronique, pour la micro-mécanique ...
P/S [ NON-METALLIC SILICON SUBSTRATES SOLD IN INGOTS OR SLICES FOR THE MANUFACTURE OF SEMICONDUCTORS,...
P/S Silicon and semiconductor substrates for microelectronics, micromechanics, and activities derived...
1999 P/S SERVICES FOR THE TREATMENT OF SEMICONDUCTOR MATERIALS SUBSTRATES AND SILICON WAFERS FOR THE MANUF...
P/S [ SCIENTIFIC, LABORATORY AND INDUSTRIAL RESEARCH SERVICES, CONSULTING SERVICES, ] ENGINEERING SER...
1998 P/S Composants pour la micro-électronique, pour les écrans plats, pour les guides optiques intégrés,...
1997 P/S Devices and components for microelectronics, namely microelectronic semiconductor components, opt...
P/S Substrates of materials for microelectronics, flat screens, integrated optical guides, sensors a...