STATS ChipPAC Pte. Lte.

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Quantité totale PI 1 552
Rang # Quantité totale PI 864
Note d'activité PI 3,3/5.0    337
Rang # Activité PI 2 085
Parent JCET-SC (Singapore) Pte. Ltd

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Dernier brevet 2025 - Semiconductor device and method ...
Premier brevet 1998 - Method of forming extended lead ...

Derniers inventions, produits et services

2025 Invention Semiconductor device and method for selective emi shielding using a mask. A semiconductor device...
Invention Semiconductor device and method of forming multi-layer shielding structure over the semiconductor...
Invention Molded laser package with electromagnetic interference shield and method of making. A semiconduc...
Invention Semiconductor device and method for advanced thermal dissipation. A semiconductor device has a s...
Invention Selective emi shielding using preformed mask with fang design. A semiconductor device has a semi...
Invention Partially shielded semiconductor device and method for forming the same. A partially shielded se...
Invention Laser assisted bonding device and method for bonding a semiconductor die onto a substrate. A las...
Invention Electronic device and a method for forming the same. An electronic device and a method for formi...
Invention Semiconductor package and method for making the same. A semiconductor package and a method for m...
Invention Omnidirectional sensor package and a method for making the same. A sensor package comprises a fi...
Invention Semiconductor package assembly with an interlayer cooling pathway. A semiconductor package assem...
2024 Invention Semiconductor package and method for making the same. A method for making a semiconductor device...
Invention Semiconductor device and a method for making a semiconductor device. A method for making a semic...
Invention Semiconductor package and method of manufacturing the same. A semiconductor package and a method...
Invention Method for attaching a heat spreader to a semiconductor package and semiconductor package assembl...
Invention Electronic package assembly and a method for forming the same. An electronic package assembly an...
Invention Antenna-in-package devices and methods of making. A semiconductor device has a PCB with an anten...
Invention Semiconductor package. A semiconductor package that includes an upper package including a first ...
Invention Integrated package and method for making the same. An integrated package and a method for making...
Invention Thermally enhanced fcbga package. A semiconductor device has a heat spreader with an opening for...
Invention Semiconductor devices and methods for forming the same. A semiconductor device comprises: an int...
Invention Methods for forming conductive structures between two substrates. A method for forming conductiv...
Invention Semiconductor package including a stiffener. A semiconductor package including a first redistrib...
Invention Semiconductor pacakge and method for forming the same. A semiconductor package is provided, comp...
Invention Two-way optical sensor package and a method for forming the same. An optical sensor package comp...
Invention Sensor package and a method for forming the same. A method for forming a sensor package is discl...
Invention Semiconductor device and method of forming encapsulated vertical interconnect structure. A semic...
Invention Semiconductor device and method of making an interconnect bridge with integrated passive devices....
Invention Semiconductor device and method of forming aip package structure from separate assemblies with bo...
Invention Semiconductor device and method of making a molded ipd-cow. A semiconductor device has an integr...
Invention Semiconductor device and method of stacking and interconnecting semiconductor assemblies using co...
Invention Semiconductor device and method of making a chip-on-wafer underfill barrier. A semiconductor dev...
Invention Semiconductor device and method of forming selective shielding using uv curable ink. A semicondu...
2023 Invention Semiconductor device and methods of making and using pre-molded bridge die. A semiconductor devi...
Invention Semiconductor device and method of forming fan-out package structure with embedded overhanging ba...
Invention Semiconductor device and method of making a dual-sided bridge die package structure. A semicondu...
Invention Semiconductor device and method of inhibiting creep of underfill material on back surface of semi...
Invention Semiconductor device and method of detecting semiconductor wafer centered on tape. A semiconducto...
Invention Semiconductor device and methods of making and using dummy vias to reduce short-circuits between ...
Invention Semiconductor device and method of making a fine pitch organic interposer with dual function capp...
Invention Semiconductor device and method of forming fowlp with pre-molded embedded discrete electrical com...
Invention Semiconductor device and method of making face-up wafer-level package using intensive pulsed ligh...
Invention Semiconductor device and method of forming dummy sop within saw street. A semiconductor device h...
Invention Semiconductor device and method using lead frame interposer in bump continuity test. A semicondu...
Invention Semiconductor device and method of integrating ewlb with e-bar structures and rf antenna interpos...
Invention Semiconductor device and method of making redistribution layers with intensive pulsed light irrad...
Invention Semiconductor device and method of making an emi shield using intensive pulsed light irradiation....
Invention Semiconductor device and method of forming channels in encapsulant to reduce warpage in reconstit...