Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.

Chine


 
Quantité totale PI 196
Rang # Quantité totale PI 6 672
Note d'activité PI 3,1/5.0    211
Rang # Activité PI 3 301
Classe Nice dominante Appareils et instruments scienti...

Brevets

Marques

127 0
0 0
68 1
0
 
Dernier brevet 2025 - Bonding device having system err...
Premier brevet 2015 - Manufacturing method for nor fla...
Dernière marque 2017 - XMC
Première marque 2017 - XMC

Industrie (Classification de Nice)

Derniers inventions, produits et services

2025 Invention Backside-illuminated image sensor. The present invention provides a backside illuminated (BSI) i...
2024 Invention Semiconductor devices and operation methods thereof, and memory systems. The present disclosure ...
Invention Semiconductor device, operation method thereof, and storage system. A semiconductor device inclu...
Invention Storage chip and read operation method. The present disclosure provides a storage chip and a rea...
Invention Memory block and buried layer manufacturing method thereof. The present disclosure provides a me...
2023 Invention Dicing method, bonding method and die. A dicing method, a bonding method and a die are disclosed...
Invention Semiconductor structure with buried power rails and method of fabricating the same. A semiconduc...
Invention Bonding apparatus and bonding method. Provided in the present application are a bonding apparatus...
Invention Memory chips and operating methods thereof. An operation method of a memory chip includes: deter...
Invention Memory chips and operating methods thereof. This disclosure discloses a memory chip and an opera...
Invention C2w structure and method for making same. A chip-to-wafer (C2W) structure and a method for makin...
Invention Semiconductor device and method for making same. A semiconductor device and a method for making ...
Invention Bonding device having system error compensation function, and method. The present application dis...
Invention Chip bonding device and bonding method. A chip bonding device and a bonding method. The device co...
Invention Bonding apparatus and bonding method. A bonding apparatus and a bonding method. The bonding appar...
Invention Vertical charge transfer photoelectric sensor, manufacturing method therefor and operation method...
Invention Memory block and manufacture method thereof. The present disclosure provides a memory block and ...
Invention Soi substrate and method of manufacturing the same. A SOI substrate and a method of manufacturin...
Invention Manufacturing method for storage device, and storage device. Disclosed in the present invention a...
Invention Manufacturing method for storage device, and storage device. Disclosed are a manufacturing method...
Invention Manufacturing method for memory device, and memory device. Disclosed in the present invention are...
Invention Three-dimensional integrated device and forming method therefor. The present invention relates to...
Invention Semiconductor device and manufacturing method therefor. A semiconductor device and a manufacturin...
Invention Bonding method, wafer stack structure, and chip structure. Provided in the present application ar...
Invention Storage device and preparation method therefor. Provided in the present application are a storage...
Invention Vertical charge transfer imaging sensor and manufacturing method therefor. The present invention ...
2022 Invention Chip packaging method and chip packaging structure. The present disclosure provides a chip packa...
Invention Laser cutting apparatus and wafer cutting method. Provided in the present invention are a laser c...
Invention Chip packaging method and chip packaging structure. The present disclosure provides a chip packag...
Invention Memory block, memory-cell group and memory device. The memory block includes a memory array incl...
Invention Semiconductor device and method of fabricating the same. A semiconductor device and a method of ...
Invention Memory block and control method thereof. The present disclosure provides a memory block and its ...
Invention Image sensor structure and method of fabricating the same. An image sensor structure and a metho...
Invention Memory block and manufacturing method thereof. The present disclosure provides a memory block an...
Invention Semiconductor device and manufacturing process for the same. The present disclosure provides a s...
Invention Method for forming semiconductor device and semiconductor device fabricated thereby. A method fo...
Invention Memory chip. The present application discloses a memory chip. The memory chip includes a nonvola...
Invention Storage cell, storage block, and memory. The present disclosure discloses a storage cell, a stor...
Invention Memory block and manufacturing method therefor, and memory cell. Provided in the present applicat...
Invention Memory block, memory device, and memory cell. Provided in the present application are a memory bl...
Invention Storage block and manufacturing process method therefor, and storage unit. The present applicatio...
Invention Semiconductor device and manufacturing method therefor. Provided in the present invention are a s...
Invention Interposer structure and manufacturing method therefor. Provided in the present invention are an ...
Invention Three-dimensionally integrated structure and method for fabricating same. A 3D integrated struct...
Invention Memory chip, operating method thereof, and judging method. The present application discloses a me...
Invention Chip packaging method and semiconductor packaging structure. The present invention relates to a c...
Invention Single-photon detector and manufacturing method therefor. The present invention relates to a sing...
2021 Invention Semiconductor device and fabrication method therefor. A semiconductor device and a fabrication m...
Invention Active pixel circuit, image sensor, and electronic device. An active pixel circuit, an image sen...
2017 P/S Data processing apparatus; computer memory devices; computer programmes [programs], recorded; id...