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2022
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Invention
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Protective semiconductor elements for bonded structures. A bonded structure with protective semic... |
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Invention
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Optically occlusive protective element for bonded structures.
An optically occlusive protective ... |
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Invention
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Optically obstructive protective element for bonded structures. An optically occlusive protective... |
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Invention
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Element with routing structure in bonding layer. A bonded structure is disclosed. The bonded stru... |
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Invention
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Direct bonding and debonding of carrier. A method of processing a semiconductor element is disclo... |
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Invention
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Direct bonding and debonding of carrier. A bonding method is disclosed. The method can include di... |
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Invention
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Direct bonding methods and structures. Disclosed herein are methods for direct bonding. In some e... |
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Invention
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Contact structures for direct bonding. A bonded structure is disclosed. The bonded structure can ... |
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2021
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Invention
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Structure with conductive feature and method of forming same. An element is disclosed. The elemen... |
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Invention
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Directly bonded structures. Embodiments of methods for producing direct bonded structures and met... |
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Invention
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Structures with through-substrate vias and methods for forming the same. A microelectronic struct... |
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Invention
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Direct bonding methods and structures. A bonding method can include activating a first bonding la... |
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Invention
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Direct bonding methods and structures. A bonding method can include polishing a first bonding lay... |
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Invention
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Bonded structure with interconnect structure. A bonded structure is disclosed. The bonded structu... |
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Invention
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Integrated device packages. In one embodiment, an integrated device package is disclosed. The int... |
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Invention
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3d ic method and device. A method of three-dimensionally integrating elements such as singulated ... |
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Invention
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Laterally unconfined structure. Techniques are employed to mitigate the anchoring effects of cavi... |
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Invention
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Reliable hybrid bonded apparatus. Reliable hybrid bonded apparatuses are provided. An example pro... |
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Invention
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Dimension compensation control for directly bonded structures. A method of direct hybrid bonding ... |
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Invention
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Selective alteration of interconnect pads for direct bonding. A bonded structure and a method of ... |
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2020
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Invention
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Electrical redundancy for bonded structures. An element that is configured to bond to another ele... |
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Invention
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Circuitry for electrical redundancy in bonded structures. A bonded structure is disclosed. The bo... |
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Invention
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Bonded optical devices. A bonded optical device is disclosed. The bonded optical device can inclu... |
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Invention
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Processing stacked substrates. Representative implementations provide techniques for processing i... |
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Invention
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Direct bonded stack structures for increased reliability and improved yield in microelectronics. ... |
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Invention
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Die processing. Representative implementations provide techniques and systems for processing inte... |
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Invention
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Sealed bonded structures and methods for forming the same. A bonded structure is disclosed. The b... |
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Invention
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Mitigating surface damage of probe pads in preparation for direct bonding of a substrate. Mitigat... |
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Invention
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Protective elements for bonded structures. A bonded structure is disclosed. The bonded structure ... |
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Invention
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Wafer-level bonding of obstructive elements. A bonded structure is disclosed. The bonded structur... |
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Invention
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Bonded structures. A bonded structure can include a first reconstituted element comprising a firs... |
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Invention
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Bonded structures without intervening adhesive. A bonded structure can include a first reconstitu... |
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2019
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Invention
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Bonded structures. A bonded structure can include a first element having a first interface featur... |
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Invention
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Bonded structures. A bonded structure can include a first element having a first conductive inter... |
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Invention
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Method and structures for low temperature device bonding. Dies and/or wafers including conductive... |
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Invention
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Probe methodology for ultrafine pitch interconnects. Representative implementations of devices an... |
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Invention
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Multi-metal contact structure in microelectronic component. A first conductive material having a ... |
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Invention
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Seal for microelectronic assembly. Representative implementations of techniques and devices provi... |
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Invention
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Interconnect structures. Representative techniques and devices, including process steps may be em... |
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Invention
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Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding pr... |
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Invention
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Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics. ... |
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2006
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P/S
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Design for others of semiconductor devices; advisory and consulting services in the field of desi... |
