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2024
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Invention
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Semiconductor device.
A semiconductor device includes a semiconductor element, a first organic s... |
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Invention
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Optical waveguide device.
An optical waveguide device has a first optical waveguide, a second op... |
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Invention
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Interconnect substrate.
An interconnect substrate includes n insulating layers (n≥2), two opposi... |
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Invention
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Ceramic substrate, electrostatic chuck and substrate fixing device.
A ceramic substrate includes... |
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Invention
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Adhesive sheet and heat dissipation member. This adhesive sheet has a pair of adhesive layers and... |
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Invention
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Electrostatic chuck and substrate fixing device.
An electrostatic chuck includes a base body hav... |
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Invention
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Electronic component-incorporating substrate.
An electronic component-incorporating substrate in... |
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Invention
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Optical waveguide device.
An optical waveguide device includes a substrate and an optical wavegu... |
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Invention
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Optical waveguide device and optical waveguide-mounted substrate.
An optical waveguide device in... |
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Invention
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Interconnect substrate and method of making the same.
An interconnect substrate includes a first... |
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Invention
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Wiring board.
A wiring board includes a layered structure and a waveguide. The layered structure... |
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Invention
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Lead frame and semiconductor device.
A lead frame has inner leads arranged in a first direction,... |
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Invention
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Substrate fixing device.
A substrate fixing device includes a ceramic base plate, a ceramic elec... |
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Invention
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Wiring board and semiconductor device.
A wiring board includes a first interconnect structure in... |
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Invention
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Wiring board, semiconductor device, and method of manufacturing wiring board.
A wiring board inc... |
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Invention
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Interconnect substrate and method of making interconnect substrate.
An interconnect substrate in... |
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Invention
|
Optical waveguide device.
An optical waveguide device includes a substrate, a first waveguide di... |
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Invention
|
Semiconductor device.
A semiconductor device includes a first substrate, a second substrate spac... |
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Invention
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Wiring board.
A wiring board includes a first insulating layer, a first interconnect layer forme... |
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Invention
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Semiconductor device.
A semiconductor device includes a wiring substrate and a semiconductor ele... |
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Invention
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Wiring substrate and semiconductor device.
A wiring substrate includes an insulating layer and a... |
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Invention
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Wiring board and laminated wiring board.
A wiring board includes a first wiring structure and a ... |
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Invention
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Stacked wiring substrate and semiconductor device.
A stacked wiring substrate includes a first w... |
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Invention
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Heat storage device, power generator, and heat generator.
A heat storage device includes a ceram... |
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Invention
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Semiconductor apparatus.
A semiconductor apparatus includes three or more semiconductor devices ... |
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Invention
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Wiring board and semiconductor device.
A wiring board includes an insulating layer and a connect... |
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Invention
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Wiring substrate.
A wiring substrate includes a first wiring layer, a first insulating layer, an... |
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Invention
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Lead frame, semiconductor device, and lead frame manufacturing method.
A lead frame includes a l... |
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Invention
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Wiring substrate and semiconductor device.
A wiring substrate includes a first wiring layer, a f... |
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Invention
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Latent heat storage unit.
A latent heat storage unit includes a ceramic part made of a polycryst... |
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Invention
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Substrate fixing device.
A substrate fixing device includes a base plate, an adhesive layer prov... |
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Invention
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Electrostatic chuck and substrate fixing device.
An electrostatic chuck includes a first base bo... |
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Invention
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Optical module.
An optical module includes a first cladding layer formed on a substrate, a first... |
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Invention
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Wiring substrate, electronic device, and method of manufacturing the wiring substrate.
A wiring ... |
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Invention
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Wiring board.
A wiring board includes a first insulating layer provided on an interconnect layer... |
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Invention
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Ceramic substrate, method of manufacturing the same, electrostatic chuck, substrate fixing device... |
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Invention
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Leadframe and semiconductor device.
A leadframe includes a die pad having a surface that include... |
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Invention
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Terminal structure and wiring substrate.
A terminal structure includes a first wiring layer, an ... |
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Invention
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Optical waveguide device.
An optical waveguide device includes a first cladding layer, a core la... |
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Invention
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Wiring board, semiconductor device, and wiring board manufacturing method.
A wiring board includ... |
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Invention
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Optical waveguide device.
An optical waveguide device includes an interconnect substrate, a firs... |
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Invention
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Optical waveguide device.
An optical waveguide device includes an optical waveguide substrate, a... |
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Invention
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Optical waveguide device and method of making the same.
An optical waveguide device includes an ... |
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Invention
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Optical waveguide mounted substrate and method of making the same.
An optical waveguide mounted ... |
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Invention
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Lead frame and semiconductor device.
A lead frame includes a die pad having an upper surface and... |
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2023
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Invention
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Semiconductor device.
A semiconductor device includes a semiconductor element provided on a wiri... |
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Invention
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Wiring board.
A wiring board has a built-in post wall waveguide having a region surrounded by tw... |
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2013
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P/S
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multi-layer circuit boards for mounting electronic parts; multi-layer circuit boards using build-... |
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2007
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P/S
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Circuit boards; Packages for integrated circuits; Circuit board with electronic device embedded; ... |
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P/S
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Packages for integrated circuit assemblies; circuit board; circuit board with integrated circuit |
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2004
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P/S
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Computer program for the purpose of determining exposing conditions, and determining the pattern ... |
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P/S
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Computer program for the purpose of determining exposing conditions, pattern data of mask less ex... |
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2000
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P/S
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Lead frames for semiconductor devices |
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1997
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P/S
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Compact discs pre-recorded computer programs for data conversion and/or verification of IC layout... |
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1992
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P/S
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[ lamps for electronic equipment ] components for semiconductor and electronic devices; namely, c... |
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P/S
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components for semiconductor and electronic devices; namely, caps [ lamps for liquid crystal disp... |
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P/S
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components for the manufacture of semiconductors and electronic devices;, namely, glass to metal ... |
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P/S
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components for the manufacture of semiconductors and electronic devices; namely, glass to metal s... |
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1985
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P/S
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ELECTRICAL AND ELECTRONIC MACHINERY, APPARATUS AND MATERIALS, NAMELY, HERMETIC SEAL HEADERS, CAPS... |
