Canon Machinery Inc.

Japon

 
Quantité totale PI 37
Rang # Quantité totale PI 38 211
Note d'activité PI 2,3/5.0    25
Rang # Activité PI 32 018
Parent Canon Inc.

Brevets

Marques

4 0
0 0
33 0
0
 
Dernier brevet 2024 - Press device, electronic compone...
Premier brevet 2002 - Substrate cutting method

Derniers inventions, produits et services

2023 Invention Press device, electronic component, press method, and method for manufacturing electronic compone...
2022 Invention Bonding apparatus and bonding method. A bonding apparatus for bonding a second object to a first...
Invention Position alignment device, position alignment method, bonding device, bonding method, and method ...
Invention Substrate conveying device, substrate conveying method, and bonding device. This substrate convey...
Invention Bonding device and bonding method. A bonding device 10 includes a delivery position Pc1 (Pc2) of ...
Invention Bonding apparatus and bonding method. This bonding apparatus 10 comprises a pickup position Pa of...
Invention Collet detection device, collet position correction device, bonding device, collet detection meth...
2021 Invention Bonding method and bonding device use method. In this bonding method, a substrate, which has a wi...
Invention Conveyance device, conveyance method, die bonder, and bonding method. A member to be supplied is ...
Invention Collet detection device, collet adjustment device, bonding device, collet detection method, and c...
Invention Transport device, transport method, die bonder, and bonding method. Provided is a transport devic...
Invention Crystal growth device and crystal growth method in which said device is used. The crystal growth ...
2020 Invention Implant. In the present invention, a fine periodic structure to which mesenchymal stem cells, ost...
Invention Pickup device and pickup method. Provided is a pickup device for releasing and separating a plura...
Invention Injection molding system with conveyor devices to insert or eject molds. An injection molding sys...
Invention Injection molding system with conveyor devices to insert or eject molds. A method for detachably ...
Invention Three-dimensional shape detection device, three-dimensional shape detection method, and three-dim...
2019 Invention Solder flattening device, die bonder, solder flattening method, and bonding method. Provided is a...
Invention Backup plate feed and recovery apparatus, die bonder, and bonding method. The present invention t...
Invention Bonding device, die bonder and bonding method. A bonding device which bonds a workpiece to a supp...
Invention System for assembling semiconductor device, method for assembling semiconductor device, and progr...
2018 Invention Defect detection device, defect detection method, wafer, semiconductor chip, die bonder, semicond...
2017 Invention Defect detection device, defect detection method, wafer, semiconductor chip, semiconductor device...
2014 Invention Method for brazing sheet material and heat exchanger. −10 Pa or less, and the sheet material is h...
2013 Invention Bonding apparatus and bonding method. Provided are a bonding apparatus and a bonding method which...
Invention Substrate conveyance method and substrate conveyance device. Provided are a substrate conveyance ...
Invention Coating device. Provided is a coating device (1) that can easily and with high precision adjust i...
2009 Invention Mechanical seal sliding member, and mechanical seal. Provided is a highly lubricant mechanical-se...
2008 Invention Chip peeling method, chip peeling apparatus and semiconductor device manufacturing method. Provid...
Invention Chip peeling method, semiconductor device manufacturing method and chip peeling apparatus. Provid...
2006 Invention Oxygen partial-pressure control unit and method of gas supply. −30 atm, and a tank for storing th...
Invention Oxygen partial-pressure control unit and method of gas supply. An oxygen partial-pressure control...
Invention Metal, process for producing metal, metal producing apparatus and use thereof. ⏧PROBLEMS] To...
Invention Method of pickup and pickup apparatus. A method of pickup and pickup apparatus that lower the pos...
Invention Method of pickup and pickup apparatus. A method of pickup, and pickup apparatus, with which pelle...
2004 Invention Method for enhancing adhesion of thin film. To provide a method for enhancing adhesion of a thin ...
Invention Method for enhancing adhesion of thin film. ⏧PROBLEMS] To provide a method for enhancing adh...
2003 Invention Method for measuring height of sphere or hemisphere. A method is provided that allows a simple an...
Invention Cyclic structure formation method and surface treatment method. A periodic structure is to be suc...
2002 Invention Machines having drive member and method for diagnosing the same. A method for diagnosing a fabric...
Invention Substrate cutting method. A substrate, such as a semiconductor wafer, is cut without using a dice...