|
2026
|
P/S
|
Computer memories; Computer memory devices; Computer memory cassette; random access memory; RAM (... |
|
|
P/S
|
Capacitors; Silicon Capacitor; Computer memories; Computer memory devices; Computer memory casset... |
|
|
Invention
|
Capacitor wafer and method for manufacturing the same.
A capacitor wafer is provided. The capaci... |
|
2025
|
Invention
|
Memory device having segmented data line structure.
A memory device includes sets of bitlines, a... |
|
|
Invention
|
Device package.
A device package includes a first tier, a second tier stacked upon the first tie... |
|
|
Invention
|
Dram-based one time programming memory.
A programming method of a DRAM (dynamic random-access me... |
|
|
Invention
|
Dram-based one time programming memory.
A dynamic random-access memory (DRAM)-based one time pro... |
|
|
Invention
|
Capacitor device and manufacturing method therefor.
A capacitor device includes: a substrate; a ... |
|
2024
|
Invention
|
Semiconductor device with backside power delivery.
A semiconductor device and a semiconductor pa... |
|
|
Invention
|
Memory device.
A memory device includes a first bit line set, a first column selection circuit, ... |
|
|
Invention
|
Semiconductor structure and method of manufacturing thereof.
A semiconductor device includes a f... |
|
|
Invention
|
Semiconductor device, testing system, and method for testing device under test on semiconductor w... |
|
|
Invention
|
Semiconductor device and method of manufacturing thereof.
The present application discloses a se... |
|
|
Invention
|
Circuit assembly.
A circuit assembly includes an IC die and a stack of capacitor dies. The IC di... |
|
|
Invention
|
Semiconductor package and method for identifying integrated circuit layers in stack.
A semicondu... |
|
|
Invention
|
Semiconductor package structure and method for forming the same.
A semiconductor package structu... |
|
|
Invention
|
High performance computing device and method of manufacturing the same.
A semiconductor device i... |
|
|
Invention
|
Semiconductor package structure.
Provided is a semiconductor package structure including a carri... |
|
|
Invention
|
Semiconductor structure and manufacturing method thereof.
A semiconductor structure including a ... |
|
|
Invention
|
Capacitor structure.
A capacitor structure is provided. The capacitor structure includes a subst... |
|
|
Invention
|
Vertical semiconductor rfid structure, rfid tag device, and manufacturing method thereof.
The pr... |
|
|
Invention
|
Semiconductor structure and method for manufacturing a semiconductor structure.
The present appl... |
|
|
Invention
|
Package substrate, semiconductor device, and method for forming package substrate.
A package sub... |
|
2023
|
Invention
|
Interface of a memory circuit. An interface of a memory circuit includes a chip enable terminal, ... |
|
|
Invention
|
Stitching method for exposure process.
A stitching method for an exposure process includes follo... |
|
|
Invention
|
Memory device having segmented data line structure. A memory device includes a plurality of sets ... |
|
|
Invention
|
Capacitor device and method for manufacturing the same. A capacitor device is provided. The capac... |
|
|
Invention
|
Semiconductor structure having conductive bridge structure.
A semiconductor structure is provide... |
|
|
Invention
|
Semiconductor package structure.
A semiconductor package structure is provided. The semiconducto... |
|
|
Invention
|
Memory device having merged banks on substrate, and method for operating memory device. A memory ... |
|
|
Invention
|
Methods for manufacturing a plurality of semiconductor structures and system in package. A method... |
|
2022
|
Invention
|
Circuit assembly. A circuit assembly includes an integrated circuit (IC) die and a capacitor die.... |
|
|
Invention
|
Semiconductor device with identification structure, method for manufacturing and tracing producti... |
|
|
Invention
|
Capacitor structure, semiconductor structure, and method for manufacturing thereof.
A capacitor ... |
|
|
Invention
|
Semiconductor structure and methods for bonding tested wafers and testing pre-bonded wafers. A me... |
|
|
Invention
|
Method of operating microelectronic package. A method of operating a microelectronic package incl... |
|
2021
|
P/S
|
Memory, namely, semiconductor memory chips; RAM (Random Access Memory) cards; Read-only memory in... |
|
|
P/S
|
Information technology consultancy services in the field of design of semiconductor chips and des... |
|
|
Invention
|
Interface of a memory circuit and memory system thereof. An interface of a memory circuit include... |
|
|
Invention
|
Interposer structure and method for manufacturing thereof.
An interposer structure is provided. ... |
|
|
Invention
|
Display controller having a surge protection unit and display system thereof. A display controlle... |
|
|
Invention
|
Semiconductor device, memory system and method of controlling semiconductor device thereof. A mem... |
|
|
Invention
|
Method to manufacture semiconductor device. A method to manufacture a semiconductor device includ... |
|
|
Invention
|
Dram chiplet structure and method for manufacturing the same. A DRAM chiplet structure is provide... |
|
2020
|
Invention
|
Capacitor device and manufacturing method therefor. A capacitor device includes: a substrate; an ... |
|
|
Invention
|
Method of assembling microelectronic package and method of operating the same. A method of assemb... |
|
|
Invention
|
Circuit assembly. A circuit assembly includes an integrated circuit (IC) die and a first capacito... |
|
|
Invention
|
Method for manufacturing semiconductor structure. A method for manufacturing a semiconductor stru... |
|
|
Invention
|
Semiconductor structure and method for manufacturing a plurality thereof. A semiconductor structu... |
|
|
Invention
|
Semiconductor device and method to manufacture the same. A semiconductor device includes a first ... |
|
|
Invention
|
Memory cell, memory device, and related identification tag. A memory cell includes: a latch, powe... |
|
|
Invention
|
Chip including neural network processors and methods for manufacturing the same.
The present dis... |
|
2019
|
Invention
|
Circuit system having compact decoupling structure. A circuit system having compact decoupling st... |
|
2018
|
Invention
|
Memory device and microelectronic package having the same. The invention provides a memory device... |