CUSIC Inc.

Japon

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Quantité totale PI 16
Rang # Quantité totale PI 98 979
Note d'activité PI 1,1/5.0    3
Rang # Activité PI 358 339

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Dernier brevet 2023 - Sic multilayer body, production ...
Premier brevet 2003 - Three-dimensional measuring equi...

Derniers inventions, produits et services

2021 Invention Sic multilayer body, production method therefor, and semiconductor device. According to one embod...
Invention Sic multilayer body, production method therefor, and semiconductor device. The present invention ...
2020 Invention Sic composite substrate and method for manufacturing same. p) of the crystals of the polycrystall...
2018 Invention Silicon carbide substrate production method and silicon carbide substrate. b, from the support su...
Invention Silicon carbide substrate production method and silicon carbide substrate. This silicon carbide s...
Invention Compound semiconductor laminate substrate, method for manufacturing same, and semiconductor eleme...
2017 Invention Object-entire-periphery imaging device for generating 3d shape. [Problem] The present invention a...
2016 Invention Method for producing sic composite substrate. a on one area or all of the back surface of the hol...
Invention Manufacturing method of sic composite substrate. A manufacturing method of an SiC composite subst...
Invention Method for producing sic composite substrate. Provided is a method for producing a SiC composite ...
Invention Manufacturing method of sic composite substrate. Provided is a manufacturing method of an SiC com...
Invention Sic composite substrate and method for manufacturing same. Provided is an SiC composite substrate...
Invention Method for manufacturing sic composite substrate, and method for manufacturing semiconductor subs...
2003 Invention Three-dimensional measuring equipment. Three-dimensional measuring equipment for measuring the th...