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2025
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Invention
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Single crystal diamond dies packaged with ultrathin pocketed semiconductor wafer.
A reconstitute... |
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Invention
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Single crystal diamond dies packaged with ultrathin pocketed semiconductor wafer.
A low thermal ... |
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Invention
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Reconstituted wafer product with variable thickness dies containing diamond.
A reconstituted waf... |
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Invention
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Single crystal diamond dies packaged with ultrathin semiconductor wafer.
A reconstituted wafer p... |
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|
Invention
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Multi-chiplets packaging for jet-cooled, diamond-substrated chips.
A device package and heatsink... |
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|
Invention
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Electronic device component with improved thermal characteristics.
An integrated device componen... |
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Invention
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Direct diffusion bonding of materials with surface treatment.
A composition of matter includes a... |
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Invention
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Composite thermal hotspot management in die packaging.
A device package includes a diamond heat ... |
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2024
|
Invention
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Hotspot-free semiconductor device chips.
A method of making an integrated circuit device with a ... |
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Invention
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Composite thermal hotspot management in die packaging. A device package includes a diamond heat s... |
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2023
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Invention
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Hotspot-free semiconductor device chips. An integrated circuit (IC) may include a semiconductor m... |
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|
Invention
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Diamond wafer based electronic vehicle power electronics. A power device electronics system inclu... |
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|
Invention
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Electronic device component with improved thermal characteristics. An integrated device component... |
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2022
|
Invention
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Diamond wafer based electronic component and method of manufacture. An electronic component, inte... |
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2018
|
Invention
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Axisymmetric material deposition from plasma assisted by angled gas flow. A film deposition syste... |
