Disco Corporation

Japon


Commandez votre montre hebdomadaire Disco Corporation
Quantité totale PI 1 920
Quantité totale incluant filiales 1 934 (+ 14 pour les filiales)
Rang # Quantité totale PI 704
Note d'activité PI 3,8/5.0    1 187
Rang # Activité PI 605
Activité incl filiales 3,5/5.0    1 191
Symbole boursier
ISIN JP3548600000
Capitalisation 1225431055450.0  (JPY)
Industrie Semiconductor Equipment & Materials
Secteur Technology
Classe Nice dominante Machines et machines-outils

Brevets

Marques

1 826 37
1 3
25 22
6
 
Dernier brevet 2026 - Chip production method
Premier brevet 1997 - Cutting wheel
Dernière marque 2025 - ORIMIRROR
Première marque 1988 - DISCO

Filiales

1 subsidiaries with IP (4 patents, 10 trademarks)

1 subsidiaries without IP

 S'inscrire grtuitement pour accéder à la liste des filiales

Industrie (Classification de Nice)

Derniers inventions, produits et services

2025 Invention Chip production method. A chip production method in which a workpiece having a plurality of plan...
Invention Wafer production method. A wafer production method for producing, from a workpiece being a nitri...
Invention Wafer grinding apparatus and wafer grinding method. A grinding apparatus for grinding a wafer in...
Invention Manufacturing method. A method is of manufacturing a plurality of devices by dividing a device w...
Invention Thinned substrate manufacturing method. A manufacturing method of manufacturing a second substra...
Invention Thinned substrate manufacturing method. A manufacturing method of a second substrate by separati...
Invention Polishing surface dressing method and method of manufacturing substrate. A polishing surface dre...
Invention Tape mounter, processing apparatus, and method for processing workpieces. A tape mounter configu...
Invention Grinding apparatus, grinding method, and diamond substrate generation method. A grinding apparat...
Invention Bonding apparatus and bonding method. A bonding apparatus includes: a first holder configured to...
Invention Method of manufacturing laminated wafer with processed outer circumference, method of manufacturi...
Invention Vitrified bond grindstone. A vitrified bond grindstone includes abrasive grains and a bonding ma...
Invention Wafer production method. A wafer production method for producing a wafer from a workpiece having...
Invention Wafer manufacturing method, laser processing apparatus, and wafer manufacturing apparatus. A met...
Invention Separation method for object, treatment method for object, and treatment apparatus. There is pro...
Invention Method of processing workpiece. A method of thinning down a workpiece having a first region and ...
Invention Processing apparatus, microscope, three-dimensional image generating method, and workpiece proces...
Invention Manufacturing method for dividing processing products and processing apparatus. There is provide...
Invention Method of separating carrier and method of manufacturing packaged devices. A method of separatin...
Invention Device chip production method and laser processing apparatus. A method includes: a first process...
Invention Method of processing wafer. A wafer processing method including applying a laser beam to the waf...
Invention Protective member forming device, protective member forming method, workpiece manufacturing metho...
Invention Method for manufacturing chips. A chip manufacturing method for manufacturing a plurality of chi...
Invention Chip manufacturing method. A chip manufacturing method includes: preparing a wafer unit having a...
Invention Ultraviolet irradiation system, ultraviolet irradiation method, and method of manufacturing chips...
Invention Laser intensity measuring device, laser processing apparatus having the laser intensity measuring...
Invention Grinding apparatus, workpiece grinding method, and chip manufacturing method. A grinding apparat...
Invention Optical processing apparatus, optical system, and laser processing method. An optical processing...
Invention Dressing apparatus, dressing method, and method of manufacturing device chips. A dressing appara...
Invention Method for processing a wafer and method for manufacturing device chips. A processing method for...
Invention Transfer apparatus, frame unit transfer method, and chip manufacturing method. A transfer appara...
Invention Method for processing workpieces, processing apparatus, and method for manufacturing a wafer. A ...
Invention Laser processing apparatus and laser processing method. A laser beam processing apparatus, that ...
Invention Laser processing apparatus and laser beam applying method. A laser processing apparatus includes...
Invention Method for processing a wafer and method for manufacturing chips. A method for processing a wafe...
Invention Laser processing apparatus, irradiated facet specifying method, and laser beam applying method. ...
Invention Bonding machine of tape, bonding method of tape, and manufacturing method of chips. A bonding ma...
Invention Workpiece processing method. A novel technology is proposed for a technology of configuring a la...
Invention Expansion method and expansion apparatus. Disclosed is an expansion method for expanding an expa...
Invention Laser processing apparatus. A laser processing apparatus includes a holding unit, a laser beam i...
Invention Workpiece processing preparation method and processing method. A processing method of thinning a...
Invention Method for processing substrate. A method for processing a substrate includes forming, in a stat...
Invention Method for reusing a supporting wafer and method for manufacturing chips. A method for reusing a...
Invention Wafer processing method, ingot processing method, and wafer. A wafer processing method for a waf...
Invention Grinding apparatus. A grinding apparatus including a chuck table whose holding surface is polygo...
Invention Treatment method for sheet, manufacturing method for chip, and manufacturing method for substrate...
Invention Method of processing wafer. A method of processing a wafer that does not leave residue from remo...
Invention Method of manufacturing grindstone, grindstone, method of manufacturing dresser board, and dresse...
Invention Semiconductor wafer, method for processing semiconductor wafer, and processing apparatus. A semi...
Invention Processing apparatus and processing method. A processing apparatus is for processing a semicondu...
P/S Metalworking machines and tools; loading-unloading machines and apparatus; semiconductor manufact...
P/S Semiconductor testing apparatus; apparatus for testing semiconductor wafers​​​​​​​; apparatus for...
P/S Metalworking machines and tools; semiconductor manufacturing machines; semiconductor wafer proces...
P/S Metalworking machines and tools; loading-unloading machines and apparatus; semiconductor manufac...
P/S Semiconductor testing apparatus; apparatus for testing semiconductor wafers; apparatus for testi...
P/S Metalworking machines and tools; semiconductor manufacturing machines; semiconductor wafer proce...
2024 P/S Semiconductor manufacturing machines; metalworking machines and metalworking machine tools Proces...
P/S Semiconductor manufacturing machines; metalworking machines and tools. Processing of wafers; gri...
P/S Semiconductor manufacturing machines; metalworking machines and tools. Processing of wafers.
P/S Semiconductor manufacturing machines; metalworking machines and metalworking machine tools Polish...
P/S Semiconductor manufacturing machines; metalworking machines and metalworking machine tools Dividi...
P/S Semiconductor manufacturing machines Apparatus for checking semiconductors, namely, technical che...
P/S Semiconductor manufacturing machines. Apparatus for checking semiconductors; semiconductor testin...
2023 P/S Metalworking machines and metalworking machine tools; semiconductor manufacturing machines
P/S Metalworking machines and tools; semiconductor manufacturing machines.
P/S Semi-conductor wafers; semi-conductor substrates, namely, the supporting material upon which or w...
P/S Cemented carbide cutting tools; metalworking machines and tools, namely, cutting machines for met...
P/S Cemented carbide cutting tools; other metalworking machines and tools.
P/S Metalworking machines and tools; semiconductor manufacturing machines. Processing of semiconduct...
P/S Semi-conductor wafers; semi-conductor substrates; compound semi-conductor substrates.
P/S Metalworking machines and metalworking machine tools; semiconductor manufacturing machines and sy...
P/S Metalworking machines and tools; semiconductor manufacturing machines and systems. Software for ...
P/S Auxiliary chemical fluids containing organic acid and oxidizing agent for use in cutting; indust...
2022 P/S Chemical agents, namely, water-soluble chemical additives for reducing contamination during dicin...
P/S Chemical agents; industrial chemicals.
P/S Dressing tools for diamond blades.
2021 P/S Machine part, namely, dressing apparatus for diamond blades
P/S Dressing apparatus for diamond blades.
P/S Metalworking machines, namely, cutting machines, grinding machines, polishing machines; metalwork...
P/S Power-operated semiconductor grinder
2020 P/S Semiconductor manufacturing machines and systems comprised of semiconductor wafer dicing machines...
P/S Semiconductor manufacturing machines and systems; metalworking machines and tools; loading-unloa...
P/S Metalworking machines and tools; semiconductor manufacturing machines and systems comprised of se...
P/S Liquid chemical agents for forming protective films on surfaces of semiconductor wafers
P/S Liquid chemical agents for forming protective films on surfaces of semiconductor wafers; other c...
P/S Liquid chemical agents for use as a protective film on surfaces of semiconductor wafers; other ch...
2019 P/S Metalworking machines and tools; semiconductor manufacturing machines and systems. Semiconductor ...
2018 P/S Sheets applicable to surfaces of semiconductor wafers to protect an applied-to surface while anot...