Disco Corporation

Japon


Commandez votre montre hebdomadaire Disco Corporation
Quantité totale PI 1 958
Quantité totale incluant filiales 1 973 (+ 15 pour les filiales)
Rang # Quantité totale PI 705
Note d'activité PI 3,8/5.0    1 162
Rang # Activité PI 637
Activité incl filiales 3,4/5.0    1 168
Symbole boursier
ISIN JP3548600000
Capitalisation 1225431055450.0  (JPY)
Industrie Semiconductor Equipment & Materials
Secteur Technology
Classe Nice dominante Machines et machines-outils

Brevets

Marques

1 862 37
1 3
25 24
6
 
Dernier brevet 2026 - Method for manufacturing a wafer...
Premier brevet 1997 - Cutting wheel
Dernière marque 2026 - DualKey Resin
Première marque 1988 - DISCO

Filiales

1 subsidiaries with IP (5 patents, 10 trademarks)

1 subsidiaries without IP

 S'inscrire grtuitement pour accéder à la liste des filiales

Industrie (Classification de Nice)

Derniers inventions, produits et services

2026 P/S Liquid chemicals for forming protective films on the surface of semiconductor wafers; chemicals ...
Invention Method for manufacturing a wafer and method for manufacturing a bonded wafer. A method for manuf...
Invention Polishing apparatus and method for polishing a workpiece. A polishing apparatus includes a chuck...
Invention Method for processing workpiece and method for manufacturing semiconductor device. A method for ...
Invention Wafer production method. A wafer production method includes: holding the workpiece; forming a se...
Invention Pickup method, test method, pickup device, and test apparatus. There is provided a pickup method...
Invention Processing apparatus, chip manufacturing method, and processing method. A processing apparatus i...
Invention Substrate processing method, processed substrate manufacturing method, and chip manufacturing met...
2025 Invention Calculating method, detecting apparatus, and chip manufacturing method. A calculat...
Invention Chip production method and cutting device. A chip production method by dividing a substrate havi...
Invention Processing method for processing workpiece by processing tool. Provided is a processing method i...
Invention Wafer manufacturing apparatus. A wafer manufacturing apparatus includes an ingot grinding unit f...
Invention Wafer processing apparatus and wafer processing method. A wafer processing apparatus for perform...
Invention Substrate manufacturing method and laser processing method. A substrate manufacturing method inc...
Invention Method of manufacturing chip and dividing device. A method of manufacturing a chip by dividing a...
Invention Processing apparatus and method for manufacturing a wafer. A processing apparatus includes a chu...
Invention Processing method, processing device, and substrate manufacturing method. A processing method in...
Invention Laser processing apparatus and laser processing method. A laser processing apparatus configured ...
Invention Wafer processing apparatus and wafer processing method. A wafer processing apparatus includes a ...
Invention Wafer-processing sheet and method for manufacturing a semiconductor device. A wafer-processing s...
Invention Method for manufacturing wiring board, and wiring board. A novel technique is provided for reduc...
Invention Method for processing a workpiece. A method for processing a workpiece, in which a first workpie...
Invention Method for processing a bonded wafer. A method for processing a bonded wafer including a first w...
Invention Method for processing a wafer and method for dividing a wafer. A method for processing a wafer, ...
Invention Substrate manufacturing method and substrate. A substrate manufacturing method includes: chamfer...
Invention Wafer processing method. A wafer processing method for processing a bonded wafer in which a firs...
Invention Processing method, processing device, and wafer manufacturing method. A method includes: holding...
Invention Polishing apparatus and method of polishing workpiece. A polishing apparatus includes: a chuck t...
Invention Sheet fixing method. A sheet fixing method for fixing a sheet to one surface of an adher...
Invention Substrate manufacturing method. A method of manufacturing a substrate from an ingot having a cyl...
Invention Laser processing method and manufacturing method for chips. Provided is a laser processing metho...
Invention Semiconductor processing grindstone, semiconductor processing tool, processing method, and manufa...
Invention Transfer device, transfer method, and processing method. A transfer device includes: a cassette ...
Invention Laminated sheet, method for manufacturing laminated sheet, method for processing workpiece, and m...
Invention Method of manufacturing wafer and wafer manufacturing system. A method of manufacturing a wafer...
Invention Laser processing apparatus and laser processing method. A laser processing apparatus includes a ...
Invention Method of processing wafer and method of manufacturing processed wafer. A method of processing ...
Invention Processing method of chuck table, manufacturing method of processed chuck table, processing metho...
Invention Wafer processing method and grinding apparatus. A wafer processing method includes forming a rin...
Invention Chuck table and method for grinding wafer. A chuck table holds a wafer having an off-cut angle b...
Invention Chip production method. A chip production method in which a workpiece having a plurality of plan...
Invention Wafer processing method. A wafer processing method for removing a chamfered portion of a first w...
Invention Method and apparatus for cleaning wafer. Provided is a method for cleaning a wafer that enables ...
Invention Cutting method for workpiece. The cutting method for a workpiece includes cutting an outer circu...
Invention Grinding method and ground wafer manufacturing method. A method for grinding a workpiece with a ...
Invention Peeling method, wafer production method, and bonded wafer. A peeling method of the present inve...
Invention Processing method for wafer. A processing method for a bonded wafer in which a first wafer and a...
Invention Polishing surface dressing method and method of manufacturing substrate. A polishing surface dre...
Invention Processing method, chip manufacturing method, and dressing member. A processing method includes:...
Invention Processing method. A processing method is for a wafer including a first surface and a second sur...
Invention Laser processing machine and laser processing method. A laser processing machine for processing ...
P/S Metalworking machines and machine tools; loading-unloading machines and apparatus, namely, semico...
P/S Semiconductor testing apparatus; apparatus for testing semiconductor wafers​​​​​​​; apparatus for...
P/S Metalworking machines and tools; semiconductor manufacturing machines; semiconductor wafer proces...
P/S Metalworking machines and tools; loading-unloading machines and apparatus; semiconductor manufac...
P/S Semiconductor testing apparatus; apparatus for testing semiconductor wafers; apparatus for testi...
P/S Metalworking machines and tools; semiconductor manufacturing machines; semiconductor wafer proce...
2024 P/S Semiconductor manufacturing machines; metalworking machines and metalworking machine tools Proces...
P/S Semiconductor manufacturing machines; metalworking machines and tools. Processing of wafers; gri...
P/S Semiconductor manufacturing machines; metalworking machines and tools. Processing of wafers.
P/S Semiconductor manufacturing machines; metalworking machines and metalworking machine tools Polish...
P/S Semiconductor manufacturing machines; metalworking machines and metalworking machine tools Semi-c...
P/S Semiconductor manufacturing machines Apparatus for checking semiconductors, namely, technical che...
P/S Semiconductor manufacturing machines. Apparatus for checking semiconductors; semiconductor testin...
2023 P/S Metalworking machines and metalworking machine tools; semiconductor manufacturing machines
P/S Metalworking machines and tools; semiconductor manufacturing machines.
P/S Semi-conductor wafers; semi-conductor substrates, namely, the supporting material upon which or w...
P/S Cemented carbide cutting tools; metalworking machines and tools, namely, cutting machines for met...
P/S Cemented carbide cutting tools; other metalworking machines and tools.
P/S Metalworking machines and tools; semiconductor manufacturing machines. Processing of semiconduct...
P/S Semi-conductor wafers; semi-conductor substrates; compound semi-conductor substrates.
P/S Metalworking machines and metalworking machine tools; semiconductor manufacturing machines and sy...
P/S Metalworking machines and tools; semiconductor manufacturing machines and systems. Software for ...
P/S Auxiliary chemical fluids containing organic acid and oxidizing agent for use in cutting; indust...
2022 P/S Chemical agents, namely, water-soluble chemical additives for reducing contamination during dicin...
P/S Chemical agents; industrial chemicals.
P/S Dressing tools for diamond blades.
2021 P/S Machine part, namely, dressing apparatus for diamond blades
P/S Dressing apparatus for diamond blades.
P/S Metalworking machines, namely, cutting machines, grinding machines, polishing machines; metalwork...
P/S Power-operated semiconductor grinder
2020 P/S Semiconductor manufacturing machines and systems comprised of semiconductor wafer dicing machines...
P/S Semiconductor manufacturing machines and systems; metalworking machines and tools; loading-unloa...
P/S Metalworking machines and tools; semiconductor manufacturing machines and systems comprised of se...
P/S Liquid chemical agents for forming protective films on surfaces of semiconductor wafers
P/S Liquid chemical agents for forming protective films on surfaces of semiconductor wafers; other c...
P/S Liquid chemical agents for use as a protective film on surfaces of semiconductor wafers; other ch...
2019 P/S Metalworking machines and tools; semiconductor manufacturing machines and systems. Semiconductor ...