Disco Corporation

Japon


 
Quantité totale PI 1 816
Quantité totale incluant filiales 1 830 (+ 14 pour les filiales)
Rang # Quantité totale PI 714
Note d'activité PI 3,8/5.0    1 309
Rang # Activité PI 557
Activité incl filiales 3,4/5.0    1 313
Symbole boursier
ISIN JP3548600000
Capitalisation 1225431055450.0  (JPY)
Industrie Semiconductor Equipment & Materials
Secteur Technology
Classe Nice dominante Machines et machines-outils

Brevets

Marques

1 729 34
1 3
24 19
6
 
Dernier brevet 2025 - Processing method for workpiece
Premier brevet 1997 - Cutting wheel
Dernière marque 2024 - SCANPOLISH
Première marque 1988 - DISCO

Filiales

1 subsidiaries with IP (4 patents, 10 trademarks)

1 subsidiaries without IP

 S'inscrire grtuitement pour accéder à la liste des filiales

Industrie (Classification de Nice)

Derniers inventions, produits et services

2024 Invention Manufacturing method of substrate with protective member. There is provided a manufacturing meth...
Invention Processing method for workpiece. There is provided a processing method for a workpiece to be app...
Invention Laser processing apparatus. A laser processing apparatus includes a laser oscillator that genera...
Invention Method of processing wafer. A method of processing a wafer includes holding the wafer on a chuck...
Invention Beta gallium oxide substrate manufacturing method. A β gallium oxide substrate manufacturing met...
Invention Method of processing workpiece. A method of processing a workpiece having a beveled edge on its ...
Invention Grinding method of wafer. A grinding method of a wafer having a circular disc shape includes a f...
Invention Processing method for workpiece. A processing method for a workpiece is provided. The method inc...
Invention Workpiece grinding method. A workpiece grinding method includes a holding step of holding the ot...
Invention Processing method of wafer. A wafer processing method includes forming a bonded wafer by bonding...
Invention Information transmission method. An information transmission method to be implemented in an info...
Invention Method of manufacturing wafer and separating apparatus. After ultrasonic waves have been applied...
Invention Processing method of wafer. A wafer processing method includes a step of forming a bonded wafer ...
Invention Wafer grinding method. In a holding surface correction processing step, a shape of a holding sur...
Invention Test apparatus. A test apparatus includes a support base that supports an undersurface of a chip...
Invention Wafer processing apparatus. A wafer processing apparatus includes a cutting unit that supports, ...
Invention Transport carriage. A transport carriage for transporting a workpiece by traveling on a transpor...
Invention Wafer processing method. A wafer processing method includes a modified layer forming step of for...
P/S Semiconductor manufacturing machines; metalworking machines and metalworking machine tools. Proce...
P/S Semiconductor manufacturing machines; metalworking machines and tools. Processing of wafers; gri...
P/S Semiconductor manufacturing machines; metalworking machines and tools. Processing of wafers.
P/S Semiconductor manufacturing machines; metalworking machines and metalworking machine tools Polish...
Invention Chuck table and edge trimming apparatus. A chuck table in an edge trimming apparatus includes a ...
Invention Method of processing workpiece. A method of processing a workpiece includes a first processing s...
Invention Chip manufacturing method. A chip manufacturing method for manufacturing a plurality of chips by...
Invention Wafer manufacturing method and processing apparatus. In a flattening step included in a series o...
Invention Wafer processing method and chamfer removing apparatus. A wafer processing method for processing...
Invention Forming method of water-soluble protective film, and processing method of plate-shaped object. A...
Invention Method of manufacturing wafer. A method of manufacturing a wafer includes a peel-off layer formi...
Invention Pickup method and pickup apparatus. A pickup method for picking up a chip affixed to a tape from...
Invention Wafer processing method. A wafer processing method for processing a wafer includes a reverse sid...
Invention Constant-temperature liquid supply system. Disclosed is a constant-temperature liquid supply sys...
Invention Method of manufacturing laminated assembly. A method of manufacturing a laminated assembly inclu...
Invention Wafer processing apparatus and wafer processing method. A wafer processing apparatus includes a ...
Invention Processing tool. A processing tool for removing a chamfer of a wafer that is formed on its front...
Invention Method of grinding wafer. A method of grinding a wafer includes a grinding step of grinding, by ...
Invention Laser beam astigmatism evaluating method. A evaluating method includes forming a plurality of pr...
Invention Wafer processing method. A wafer processing method for processing a wafer which has one side in ...
P/S Semiconductor manufacturing machines; metalworking machines and metalworking machine tools Dividi...
Invention Constant-temperature liquid supply apparatus. A constant-temperature liquid supply apparatus inc...
Invention Method of processing sic wafer. A method of processing an SiC wafer includes a laser processing ...
Invention Laser processing machine and laser processing method. A laser processing machine for forming gro...
Invention Processing method and processing apparatus for workpiece. A processing method for a workpiece in...
Invention Wafer grinding method. A wafer grinding method for grinding, by a grindstone, a reverse side of ...
Invention Method for manufacturing chips. Disclosed is a method for manufacturing chips by removing, from ...
Invention Method of and apparatus for processing workpiece. A method of processing a workpiece to divide t...
Invention Wafer thinning method. A wafer thinning method for a wafer includes bonding a first support subs...
Invention Laser processing apparatus. A laser processing apparatus includes a holding table for holding a ...
Invention Workpiece processing method. A workpiece processing method includes a desired shape division sta...
Invention Water refining apparatus and method of manufacturing wafer. A water refining apparatus for refin...
Invention Processing machine and unloading method of workpiece. A processing machine has a holding unit, w...
Invention Polishing pad and polishing method. A polishing pad including a disc-shaped base to be mounted t...
Invention Dressing member. A dressing member to be used in adjusting a grindstone tool in which abrasive g...
Invention Processing method of wafer. Disclosed is a processing method of a wafer having a first surface a...
P/S Semiconductor manufacturing machines Apparatus for checking semiconductors, namely, technical che...
P/S Semiconductor manufacturing machines. Apparatus for checking semiconductors; semiconductor testin...
2023 P/S Metalworking machines and metalworking machine tools; semiconductor manufacturing machines
P/S Metalworking machines and tools; semiconductor manufacturing machines.
P/S Semi-conductor wafers; semi-conductor substrates, namely, the supporting material upon which or w...
P/S Cemented carbide cutting tools; metalworking machines and tools, namely, cutting machines for met...
P/S Cemented carbide cutting tools; other metalworking machines and tools.
P/S Metalworking machines and tools; semiconductor manufacturing machines. Processing of semiconduct...
P/S Semi-conductor wafers; semi-conductor substrates; compound semi-conductor substrates.
P/S Metalworking machines and metalworking machine tools; semiconductor manufacturing machines and sy...
P/S Metalworking machines and tools; semiconductor manufacturing machines and systems. Software for ...
P/S Auxiliary chemical fluids containing organic acid and oxidizing agent for use in cutting; indust...
2022 P/S Chemical agents, namely, water-soluble chemical additives for reducing contamination during dicin...
P/S Chemical agents; industrial chemicals.
Invention Method for producing single crystal diamond and single crystal diamond. Provided are a method fo...
P/S Dressing tools for diamond blades.
2021 P/S Machine part, namely, dressing apparatus for diamond blades
P/S Dressing apparatus for diamond blades.
P/S Metalworking machines, namely, cutting machines, grinding machines, polishing machines; metalwork...
P/S Power-operated semiconductor grinder
2020 P/S Semiconductor manufacturing machines and systems comprised of semiconductor wafer dicing machines...
P/S Semiconductor manufacturing machines and systems; metalworking machines and tools; loading-unloa...
P/S Metalworking machines and tools; semiconductor manufacturing machines and systems comprised of se...
P/S Liquid chemical agents for forming protective films on surfaces of semiconductor wafers
P/S Liquid chemical agents for forming protective films on surfaces of semiconductor wafers; other c...
P/S Liquid chemical agents for use as a protective film on surfaces of semiconductor wafers; other ch...
2019 P/S Metalworking machines and tools; semiconductor manufacturing machines and systems. Semiconductor ...
2018 P/S Sheets applicable to surfaces of semiconductor wafers to protect an applied-to surface while anot...
2017 P/S Metalworking machines in the nature of cutting machines, grinding machines, and drilling machines...
P/S Semiconductor wafer processing machines, namely, machines for stretching a plastic film to which ...
2016 P/S Metalworking machines and tools, namely, cutting machines, grinding machines, polishing machines ...
P/S Metalworking machines and tools; semiconductor manufacturing machines and systems; laser processi...
P/S Metalworking machines and tools, namely, cutting machines, grinding machines, polishing machines,...
2015 P/S Cartridges including ion-exchange resins for deionizing water so as to produce purified water.