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2025
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Invention
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Packaging structure and manufacturing method thereof.
In a manufacturing method for a packaging ... |
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Invention
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Conductive substrate and carrier plate wiring structure with filtering function, and manufacturin... |
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Invention
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Multi-device graded embedding package substrate and manufacturing method thereof.
A multi-device... |
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2024
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Invention
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Fan-out panel level packaging structure and manufacturing method.
A method for manufacturing a f... |
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Invention
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Embedded magnetic device integrated structure and manufacturing method thereof.
An embedded magn... |
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Invention
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Embedded magnet frame, integrated structure and manufacturing method.
An embedded magnet frame, ... |
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Invention
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Organic interposer structure, manufacturing method and package structure thereof.
A manufacturin... |
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Invention
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Metal frame chip embedded packaging substrate and manufacturing method thereof.
A manufacturing ... |
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2023
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Invention
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Package carrier plate with embedded efficient heat dissipation module and manufacturing method th... |
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Invention
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Embedded and packaged heat dissipation structure and manufacturing method therefor, and semicondu... |
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Invention
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Embedded chip package and manufacturing method thereof. Disclosed is an embedded chip package, co... |
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Invention
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Embedded device package substrate and manufacturing method therefor.
An embedded device package ... |
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Invention
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Component package substrate structure and manufacturing method thereof.
A method for manufacturi... |
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Invention
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Package substrate and manufacturing method therefor.
A package substrate includes a first dielec... |
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Invention
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Packaged cavity structure and manufacturing method thereof.
A packaged cavity structure includes... |
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Invention
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Semiconductor package structure and manufacturing method therefor.
A semiconductor package struc... |
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Invention
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Method for manufacturing embedded device packaging substrate, packaging substrate, and semiconduc... |
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Invention
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Substrate manufacturing method, embedded substrate and semiconductor.
A substrate manufacturing ... |
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Invention
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Method for manufacturing high-heat-dissipation mixed substrate, and semiconductor structure.
A m... |
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Invention
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Package substrate with embedded device, and manufacturing method therefor.
A package substrate w... |
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Invention
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Chip high-density interconnection package structure and manufacturing method thereof.
A chip hig... |
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Invention
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Embedded flip chip package substrate and manufacturing method thereof.
A manufacturing method fo... |
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Invention
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Manufacturing method for device embedded packaging structure.
A method for manufacturing a devic... |
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Invention
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Light-emitting photosensitive sensor structure and manufacturing method thereof.
A method for ma... |
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Invention
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Liquid circulating cooling package substrate and manufacturing method thereof.
A liquid circulat... |
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Invention
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Connector for implementing multi-faceted interconnection. In a method of manufacturing a connecto... |
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Invention
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Carrier plate for preparing package substrate, package substrate structure and manufacturing meth... |
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Invention
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Substrate embedded with integrated inductor and manufacturing method thereof. A manufacturing met... |
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Invention
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Package substrate and manufacturing method thereof.
A package substrate and a manufacturing meth... |
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Invention
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Support frame structure and manufacturing method thereof. Disclosed are a method for manufacturin... |
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Invention
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Cavity substrate having directional optoelectronic transmission channel and manufacturing method ... |
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2022
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Invention
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Method for manufacturing a packaging substrate, and packaging substrate.
A method for manufactur... |
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Invention
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Package substrate. A package substrate includes: a glass frame having a through hole and a chip e... |
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Invention
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Two-sided interconnected embedded chip packaging structure and manufacturing method therefor.
A ... |
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Invention
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Packaging structure and manufacturing method thereof.
A packaging structure includes multiple pa... |
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Invention
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Structure for embedding and packaging multiple devices by layer and method for manufacturing same... |
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Invention
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Package substrate based on molding process and manufacturing method thereof.
A package substrate... |
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Invention
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Signal-heat separated tmv packaging structure and manufacturing method thereof.
A signal-heat se... |
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Invention
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Embedded packaging structure and manufacturing method thereof.
An embedded packaging structure a... |
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Invention
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Hybrid embedded packaging structure and manufacturing method thereof. A hybrid embedded packaging... |
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Invention
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Cyclic cooling embedded packaging substrate and manufacturing method thereof. A cyclic cooling em... |
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Invention
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Package structure with wettable side surface and manufacturing method thereof, and vertical packa... |
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Invention
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Multi-device graded embedding package substrate and manufacturing method thereof. A multi-device ... |
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2021
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Invention
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Package substrate manufacturing method. A package substrate manufacturing method includes: provid... |
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2020
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Invention
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Capacitor and inductor embedded structure and manufacturing method therefor, and substrate. A cap... |
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Invention
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Multilayer substrate and manufacturing method therefor.
A multilayer substrate and a manufacturi... |
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Invention
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Heat dissipation-electromagnetic shielding embedded packaging structure, manufacturing method the... |
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Invention
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Embedded chip package and manufacturing method thereof. An embedded chip package according to an ... |
