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2016
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Invention
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Adhesion promotion in printed circuit boards.
Compositions and methods for enhancing adhesion be... |
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Invention
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Compositions including a high molecular weight acid suitable for conductive polymer formation on ... |
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2014
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Invention
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Electrodeposition of copper. In electrolytic copper plating, an aqueous composition comprising a ... |
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Invention
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Aqueous electrolyte composition having a reduced airborne emission, method and use of this compos... |
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Invention
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Aqueous stripping composition for metal surfaces. The invention relates to an aqueous stripping c... |
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Invention
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Electrodeposition of silver with fluoropolymer nanoparticles. Electrolytic plating compositions a... |
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2013
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Invention
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Adhesion promotion in printed circuit boards. Compositions and methods for enhancing adhesion bet... |
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Invention
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Pre-etching composition and etching process for plastic substrates. The present invention relates... |
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2012
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Invention
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Aqueous activator solution and process for electroless copper deposition on laser-direct structur... |
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Invention
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Apparatus for electrochemical deposition of a metal. The invention as described in the following ... |
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Invention
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Electrolyte and process for depositing a matt metal layer.
An electrolytic composition for the d... |
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Invention
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Aqueous solution and method for the formation of a passivation layer. The present invention gener... |
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Invention
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Process for filling vias in the microelectronics. A process for metalizing a through silicon via ... |
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2011
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Invention
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Composition and method for the deposition of conductive polymers on dielectric substrates. The in... |
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Invention
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Solderability enhancement by silver immersion printed circuit board manufacture.
A process used ... |
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Invention
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Copper filling of through silicon vias. A method for metallizing a through silicon via feature in... |
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Invention
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Silver immersion plated printed circuit board.
A process used during manufacture of printed circ... |
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Invention
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Passivation treatment of zinc-based coatings. A method and composition is provided for depositing... |
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Invention
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Corrosion-protective wax composition containing polyaniline in a doped form and a liquid paraffin... |
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Invention
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Method for direct metallization of non-conductive substrates. The present invention relates to a ... |
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2010
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Invention
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Immersion tin silver plating in electronics manufacture. A method is provided for depositing a wh... |
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Invention
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Beta-amino acid and derivatives thereof comprising electrolyte and method for the deposition of a... |
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2009
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Invention
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Electrodeposition of copper in microelectronics with dipyridyl-based levelers. A method for metal... |
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Invention
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Method for the post-treatment of metal layers. A process for treating the surface of a metal subs... |
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Invention
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Method for galvanic deposition of hard chrome layers. The present invention concerns a method for... |
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Invention
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Cyanide free electrolyte composition for the galvanic deposition of a copper layer. A cyanide-fre... |
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Invention
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Electrolyte and method for deposition of matte metal layer. This invention relates to an electrol... |
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Invention
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Method for the post-treatment of metal layers. This invention relates to a method for the post-tr... |
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Invention
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Adhesion promotion of metal to laminate with multi-functional molecular system.
An adhesion prom... |
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Invention
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Adhesion promotion of metal to laminate with a multi-functional compound haftforderung von metall... |
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2008
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Invention
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Composite coatings for whisker reduction. There is provided a method and composition for applying... |
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Invention
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Electrolytic deposition of metal-based composite coatings comprising nano-particles. A method is ... |
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Invention
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Anti-tarnish coating. A method is disclosed for enhancing the corrosion resistance of a surface o... |
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Invention
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Self assembled molecules on immersion silver coatings. A method for enhancing the corrosion resis... |
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Invention
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Method for galvanotechnical coating of substrate surfaces. The present invention relates to a met... |
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Invention
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Galvanic deposition of metal layers on magnesium or magnesium alloy surfaces. The present inventi... |
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Invention
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Chromium-free pickle for plastic surfaces. A pickling solution for the surface pre-treatment of p... |
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Invention
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Copper metallization of through silicon via. A method for metallizing a through silicon via featu... |
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Invention
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Codeposition of copper nanoparticles in through silicon via filling. An electrolytic copper plati... |
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Invention
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Corrosion proteciton of bronzes. A method and composition for enhancing corrosion resistance, wea... |
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Invention
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Metallic surface enhancement. A method and composition for enhancing corrosion resistance, wear r... |
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Invention
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Self-initiated alkaline metal ion free electroless deposition composition for thin co-based and n... |
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Invention
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Cobalt capping surface preparation in microelectronics manufacture.
Cleaning compositions and me... |
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Invention
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Organic solderability preservative comprising high boiling temperature alcohol. An organic solder... |
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2007
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Invention
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Metrology in electroless cobalt plating.
Electrolessly depositing a cobalt-based alloy on a meta... |
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Invention
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Composite coatings for whisker reduction.
There is provided a method and composition for applyin... |
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Invention
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Copper deposition for filling features in manufacture of microelectronic devices. A method for pl... |
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Invention
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Method and composition for direct metallization of non-conductive substrates.
The present invent... |
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2005
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Invention
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Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components. ... |
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1997
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P/S
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Chemicals for use in plating processes. |
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1996
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P/S
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Dispersions and solutions of electrically conductive substances, namely electrically conductive p... |
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1981
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P/S
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Chemicals for use in metal finishing processes, particularly, processes for electroplating or ele... |
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1965
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P/S
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Chemicals for use in the electro deposition of metals.
Chemical plating solutions, and addition a... |
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P/S
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Chemical plating solutions and addition agents for use in the electrodeposition of metals. |
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P/S
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Salts and other reagents, used in the forming of electrolytes in the electrodeposition of preciou... |
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1930
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P/S
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Cadmium plating electrolytes, cadmium plating salts and addition materials for cadmium plating sa... |
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P/S
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Materials for cadmium, nickel, chromium, copper, zinc, brass, white brass, silver and tin electro... |
