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2024
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P/S
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Machines for electronics assembly, particularly in the semiconductor assembly field, and specific... |
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Invention
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Methods of calibrating an ultrasonic characteristic on a wire bonding system.
A method of calibr... |
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Invention
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Ultrasonic welding systems, methods of using the same, and related workpieces including welded co... |
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Invention
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Bonding systems, and methods of providing a reducing gas on a bonding system.
A bonding system i... |
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Invention
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Methods of detecting a crack in a semiconductor element, and related wire bonding systems.
A met... |
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Invention
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Methods of forming wire interconnect structures and related wire bonding tools.
A method of form... |
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Invention
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Methods of detecting a crack in a semiconductor element, and related wire bonding systems. A wire... |
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P/S
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Electronics assembly equipment and consummables and component parts for such equipment, material ... |
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Invention
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Ultrasonic welding systems for conductive pins, and related methods.
An ultrasonic welding syste... |
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Invention
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Ultrasonic welding systems for conductive pins, and related methods. An ultrasonic welding system... |
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Invention
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Methods of cutting a wire on a wire bonding system, and related cutting blades and wire bonding s... |
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Invention
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Bonding systems for bonding a semiconductor element to a substrate, and related methods.
A bondi... |
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Invention
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Ultrasonic welding systems, sonotrodes and conductive pins for such systems, and related methods ... |
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Invention
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Methods of processing a substrate on a bonding system, and related bonding systems. A method of p... |
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Invention
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Methods of processing a substrate on a bonding system, and related bonding systems.
A method of ... |
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P/S
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Wire bonding machines for the electronics industry |
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Invention
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Methods of automatic recovery for process errors in operating wire bonding machines. A method of ... |
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Invention
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Methods of automatic recovery for process errors in operating wire bonding machines.
A method of... |
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2023
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P/S
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Wire bonding machines. |
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Invention
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Setting up ultra-small or ultra-thin discrete components for easy assembly.
Among other things a... |
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Invention
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Bonding systems for bonding a semiconductor element to a substrate, and related methods. A bondin... |
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Invention
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Methods of testing bonded wires on wire bonding machines.
A method of testing a bonded wire on a... |
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Invention
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Methods of improving wire bonding operations.
A method of determining a new search height for a ... |
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Invention
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Methods of improving wire bonding operations. A method of determining a new search height for a w... |
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Invention
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Wire bonding tools, and related methods of providing the same.
A wire bonding tool is provided. ... |
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Invention
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Wire bonding tools, and related methods of providing the same. A wire bonding tool is provided. T... |
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Invention
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Methods of adjusting a tilt between a bonding tool assembly and a support structure assembly of a... |
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Invention
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Methods of determining a height, and a height profile, of a wire loop on a wire bonding machine. ... |
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Invention
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Bonding systems, and methods of providing a reducing gas on a bonding system. A bonding system is... |
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Invention
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Methods of determining an effect of electronic component placement accuracy on wire loops in a se... |
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Invention
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Methods of determining suitability of a wire bonding tool for a wire bonding application, and rel... |
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Invention
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Methods of determining a sequence for creating a plurality of wire loops in connection with a wor... |
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Invention
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Methods of monitoring gas byproducts of a bonding system, and related monitoring systems and bond... |
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Invention
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Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond ... |
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Invention
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Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding mach... |
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2022
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P/S
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Machines for electronics assembly, particularly in the semiconductor assembly field, specifically... |
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P/S
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Machines for electronics assembly, particularly wire bonding machines |
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Invention
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Die bonding systems, and methods of using the same.
A die bonding system including a bond head a... |
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Invention
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Die bonding systems, and methods of using the same. A die bonding system including a bond head as... |
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Invention
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Methods of calibrating an ultrasonic characteristic on a wire bonding system. A method of calibra... |
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Invention
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Bonding systems for bonding of semiconductor elements to substrates, and related methods.
A bond... |
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Invention
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Methods of optimizing clamping of a semiconductor element against a support structure on a wire b... |
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Invention
|
Ultrasonic welding systems and methods of using the same. An ultrasonic welding system is provide... |
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Invention
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Methods of installing wire bonding tools on wire bonding systems, and related installation tools ... |
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P/S
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Semiconductor assembly machines comprising die attach equipment, clip bonding equipment, and refl... |
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Invention
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Glue dispensing system and glue supplying method thereof. A glue dispensing system and the glue s... |
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Invention
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Electronic component bonding machines, and methods of measuring a distance on such machines. An e... |
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Invention
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Electronic component bonding machines, and methods of measuring a distance on such machines.
An ... |
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P/S
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Machines for semiconductor processing and packaging, including semiconductor wafers; specifically... |
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P/S
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Flip chip bonding machines, flip chip placement machines, and die attach machines |
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2021
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P/S
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Machine parts, namely, dicing blades for dicing or singulation of semiconductor wafers and substr... |
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P/S
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Machine parts, namely, dicing blades for dicing and singulation of semiconductor wafers, LED subs... |
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P/S
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Machine parts, namely, wire bonding tools for wire bonding on wire bonding machines |
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2020
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P/S
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Downloadable software for use in connection with monitoring
and control of, and data acquisition... |
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P/S
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Downloadable software for use in connection with monitoring and control of, and data acquisition ... |
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P/S
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Wire bonding tools, such as capillary tools, for wire bonding on wire bonding machines |
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2019
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P/S
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Semiconductor manufacturing machines, namely, semiconductor assembly and semiconductor packaging ... |
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2018
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P/S
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Wire bonding tools; wire bonding tools, namely wedge bonding tools for wire bonding machines. |
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P/S
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Wire bonding tools, namely, wedge bonding tools for wire bonding machines |
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P/S
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Machine parts in the nature of wire bonding tools, namely, wedge bonding tools for use in wire bo... |
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2017
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P/S
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Automated wire bonders |
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P/S
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Semiconductor wafer processing machines, namely, stud bumping machines |
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P/S
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machine parts, namely, wire bonding machine tools for use in wire bonding machines for semiconduc... |
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2016
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P/S
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Machine parts, namely, wire bonding tools for use in wire bonding machines in semiconductor packa... |
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2015
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P/S
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Packaging machines, namely, automated wire bonders;
semiconductor packaging machines, namely, st... |
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P/S
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Automated wire and ribbon bonders. |
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P/S
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Automated wire bonders; Semiconductor packaging machines, namely, stud bumping machines |
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P/S
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Packaging machines, namely, automated wire bonders and
ribbon bonders. |
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P/S
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Automated wire and ribbon bonders |
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2014
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P/S
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Packaging machines, namely, automated wire bonders and ribbon bonders |
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P/S
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Semiconductor packaging equipment, namely, thermocompression
bonding machines and flip chip bond... |
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P/S
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Semiconductor packaging equipment, namely, thermocompression bonding machines and flip chip bondi... |
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2001
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P/S
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Dicing blades, namely, power-operated blades attached within dicing equipment to cut semiconducto... |
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P/S
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Apparatus, equipment and tools for assembling, manufacturing, treating and producing electrical a... |
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P/S
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Providing on-line electronic commerce services, namely, on-line catalog for selection, [ ordering... |
