|
2022
|
Invention
|
Solder ball application for singular die. A device is provided. The device includes one or more o... |
|
2020
|
Invention
|
Solder ball application for singular die. A method is provided. The method includes one or more o... |
|
|
Invention
|
Low profile integrated circuit. A device is provided. The device may include one or more of a pac... |
|
|
Invention
|
Chemical evaporation control system. An apparatus is provided. The apparatus may include one or m... |
|
|
Invention
|
Conductive diamond application system. A system is provided. The system includes a 3D printer, wh... |
|
2018
|
Invention
|
Hermetic lid seal printing method. A method is provided. The method includes one or more of secur... |
|
|
Invention
|
Repackaged reconditioned die method and assembly. A method is provided. The method includes one o... |
|
2017
|
Invention
|
Conductive diamond application method. A method is provided. The method includes preparing a surf... |
|
|
Invention
|
Counterfeit integrated circuit detection by comparing integrated circuit signature to reference s... |
|
|
Invention
|
Low profile electronic system method and apparatus.
A method is provided. The method includes on... |
|
|
Invention
|
Method for remapping a packaged extracted die. A method for remapping an extracted die is provide... |
|
|
Invention
|
3d printed hermetic package assembly and method. A method is provided. The method includes one or... |
|
|
Invention
|
Remapped packaged extracted die. A remapped extracted die is provided. The remapped extracted die... |
|
|
Invention
|
Method for remapping a packaged extracted die with 3d printed bond connections. A method is provi... |
|
|
Invention
|
Remapped packaged extracted die with 3d printed bond connections. An integrated circuit is provid... |
|
|
Invention
|
Repackaged integrated circuit assembly method. A method is provided. The method includes one or m... |
|
2016
|
Invention
|
Repackaged integrated circuit and assembly method. A packaged integrated circuit for operating re... |
|
2015
|
Invention
|
Environmental hardened packaged integrated circuit. A packaged integrated circuit for operating r... |
|
|
Invention
|
Integrated circuit with printed bond connections. A packaged integrated circuit is provided. The ... |
|
2013
|
Invention
|
Method and apparatus for printing integrated circuit bond connections. A method for assembling a ... |
|
|
Invention
|
Environmental hardening integrated circuit method and apparatus. A method for assembling a packag... |
