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2025
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Invention
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Mid temperature alloys for solder hierarchy. A lead-free solder alloy comprising: from 0.5 to 4 w... |
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Invention
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Mid temperature ultra-high reliability solder alloys. A lead-free solder alloy comprising: from 2... |
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Invention
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Reinforcement structure without signal interruption. An electronic structure comprising: a printe... |
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Invention
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Flux formulations and joining method. Flux formulations and joining method A solder flux comprisi... |
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Invention
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Dual-curing adhesive. Provided is a dual-curing adhesive for manufacturing an electronic device, ... |
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Invention
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Trivalent chromium plating bath and method of electroplating an article. A trivalent chromium pla... |
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Invention
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Low leakage current dielectric. A composition for use in the manufacture of an in-mould electroni... |
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Invention
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Sintering composition based on copper particles. A sintering composition, the sintering compositi... |
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2024
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Invention
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Solder joint comprising a tin alloy and an encapsulant comprising silica particles in an epoxy re... |
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Invention
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Method of forming a sintering powder comprising copper particles. A method of forming a sintering... |
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Invention
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A method of treating regenerated cellulose fiber for textile and non-woven applications. There is... |
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2023
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Invention
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Soldering method, solder paste, solder flux and solder joint. A soldering method comprising: prov... |
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Invention
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Formable and flexible haptics materials and structures. A composition comprising: a piezoelectric... |
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Invention
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Method of joining electrical and mechanical components using laminated modular preforms. A method... |
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2022
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Invention
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Method of manufacturing a solar module. A method of manufacturing a solar module, the method comp... |
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Invention
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A method of recycling textile waste cellulose. The present invention provides a method of recycli... |
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Invention
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Engineered materials for electronics assembly. A solder material for use in electronic assembly, ... |
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2021
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Invention
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Composition for use in the manufacture of an in-mould electronic (ime) component. A composition f... |
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2019
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Invention
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Lead-free solder compositions. A lead-free solder alloy comprising: from 1 to 9 wt.% copper, at l... |
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2015
|
Invention
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Low temperature high reliability tin alloy for soldering. A lead-free, antimony-free solder alloy... |
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Invention
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Stretchable interconnects for flexible electronic surfaces. A conductive paste comprising conduct... |
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Invention
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Multilayered metal nano and micron particles. A sintering powder, wherein a least a portion of th... |
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Invention
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Engineered residue solder paste technology. A method of forming a solder joint, the method compri... |
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Invention
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Low pressure sintering powder. A sintering powder comprising: a first type of metal particles hav... |
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2014
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Invention
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Select schiff base compounds for chemical agent detoxification. A Schiff base compound configured... |
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Invention
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Joining to aluminium. A flux comprising one or more amines. |
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Invention
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Treatment of gases. The present invention relates to the treatment of gases. In particular, it re... |
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Invention
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Metal recovery. A method for recovering tin and/or tin alloy from a substrate comprising: providi... |
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Invention
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Controlled microwave assisted synthesis of functionalized silica nanoparticles. A method of synth... |
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Invention
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Microwave driven diffusion of dielectric nano- and micro-particles into organic polymers. A metho... |
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2013
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Invention
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Cooling process. A process for cooling a heated coolant, said process comprising : (a) passing a ... |
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2010
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Invention
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Method for attachment of silicon-containing compounds to a surface and for synthesis of hypervale... |
