|
2025
|
Invention
|
Microled based time of flight system.
A time of flight system may include one or more microLEDs ... |
|
|
Invention
|
Coherent fiber bundle parallel optical links.
A coherent fiber bundle may be used to optically c... |
|
|
Invention
|
Circular microleds for links. A circular microLED with a p portion and an n portion both having c... |
|
|
Invention
|
Optical interconnects using microleds.
MicroLEDs may be used in providing intra-chip optical com... |
|
|
Invention
|
Memory relocation. Processors may interface with memory using microLED-based optical connections.... |
|
|
Invention
|
Memory relocation.
Processors may interface with memory using microLED-based optical connections... |
|
|
Invention
|
Optical interconnects using 3d stacked optoelectronic interfaces. An optical interconnect may inc... |
|
|
Invention
|
Vertical optical io for multi-chip packages. A multi-chip package may include a system-on-chip (S... |
|
|
Invention
|
Optical interconnects using 3d stacked optoelectronic interfaces.
An optical interconnect may in... |
|
|
Invention
|
Vertical optical io for multi-chip packages.
A multi-chip package may include a system-on-chip (... |
|
|
Invention
|
Multi-layer planar waveguide interconnects.
A multi-layer planar waveguide may be used in provid... |
|
|
Invention
|
Interconnect networks using microled-based optical links.
Integrated circuit chips may be optica... |
|
|
Invention
|
Avalanche photodetectors for parallel optical interconnects. A lateral photodetector may include ... |
|
|
Invention
|
Bit-wise inverse multiplexing for optical channels utilizing microleds.
An optical communication... |
|
|
Invention
|
Optical interconnects using 3d stacked optoelectronic interfaces.
Optoelectronic subassemblies m... |
|
2024
|
Invention
|
High speed and multi-contact leds for data communication.
An LED may have structures optimized f... |
|
|
Invention
|
Imaging couplers for microled links.
A microLED-based optical interconnect may include an optica... |
|
|
Invention
|
Imaging couplers for microled links. A microLED-based optical interconnect may include an optical... |
|
|
Invention
|
Integration of oe devices with ics.
Optical interconnects for IC chips may include optical sourc... |
|
|
Invention
|
P-type doping in gan leds for high speed operation at low current densities.
A GaN based LED, wi... |
|
|
Invention
|
Optically interconnected processor and memory modules. Optically interconnected modules may inclu... |
|
|
Invention
|
Optically interconnected processor and memory modules.
Optically interconnected modules may incl... |
|
|
Invention
|
Led chip-to-chip vertically launched optical communications with optical fiber.
Multi-chip modul... |
|
|
Invention
|
Chip-scale optical interconnect using microleds.
In package intra-chip and/or inter-chip optical... |
|
|
Invention
|
Fiber-optic bundles for parallel optical interconnects. A connector assembly for a fiber-optic bu... |
|
|
Invention
|
Fiber-optic bundles for parallel optical interconnects.
A connector assembly for a fiber-optic b... |
|
|
Invention
|
Enhanced micro-optical structures for parallel microled links.
Structures to isolate optical cou... |
|
|
Invention
|
Enhanced micro-optical structures for parallel microled links. Structures to isolate optical coup... |
|
|
Invention
|
Optically interconnected high bandwidth memory architectures.
A System-on-Chip (SoC) may be opti... |
|
|
Invention
|
Optically interconnected high bandwidth memory architectures. A System-on-Chip (SoC) may be optic... |
|
|
Invention
|
Coherent fiber bundle parallel optical links. A coherent fiber bundle may be used to optically co... |
|
|
Invention
|
Bit-wise inverse multiplexing for optical channels utilizing microleds. An optical communication ... |
|
|
Invention
|
Systems using microled-based interconnects. Optical interconnect topologies may be provided using... |
|
|
Invention
|
Led interconnect with breakout for memory applications. Processors may be coupled to memory using... |
|
|
Invention
|
Led interconnect with breakout for memory applications.
Processors may be coupled to memory usin... |
|
2023
|
Invention
|
Packaging for microleds for chip to chip communication. A microLED based optical chip-to-chip int... |
|
|
Invention
|
Interconnect networks using microled-based optical links. Integrated circuit chips may be optical... |
|
|
Invention
|
Integration of oe devices with ics. Optical interconnects for IC chips may include optical source... |
|
|
Invention
|
Multi-array parallel optical links. An optical interconnect may provide for optical communication... |
|
|
Invention
|
Multi-layer planar waveguide interconnects. A multi-layer planar waveguide may be used in providi... |
|
|
Invention
|
P-type doping in gan leds for high speed operation at low current densities. A GaN based LED, wit... |
|
|
Invention
|
Coupling microleds to optical communication channels.
Light from one or more microLEDs may be co... |
|
|
Invention
|
High speed and multi-contact leds for data communication. An LED may have structures optimized fo... |
|
|
Invention
|
Led chip-to-chip vertically launched optical communications with optical fiber. Multi-chip module... |
|
|
Invention
|
Optically-enhanced multichip packaging. Optical chip-to-chip interconnects may use microLEDs as l... |
|
|
Invention
|
Hybrid integration of microled interconnects with ics. For optical communications between semicon... |
|
|
Invention
|
Embedding leds with waveguides. A microLED may be used to generate light for intra-chip or inter-... |
|
|
Invention
|
Optical interconnects using microleds. MicroLEDs may be used in providing intra-chip optical comm... |
|
|
Invention
|
Parallel microled-based free space optical interconnects. Optically coupling two or more optical ... |
