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2025
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Invention
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High-bandwidth memory stack with side edge interconnection and liquid cooling structure.
A semic... |
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Invention
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3d integrated circuit package.
A 3D integrated circuit package is provided. The 3D integrated ci... |
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Invention
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High bandwidth memory stack with side edge interconnection and 3d ic structure with the same.
An... |
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Invention
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Composite substrate, semiconductor device using the same and manufacturing method thereof.
A com... |
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Invention
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Semiconductor package and semiconductor package assembly with edge side interconnection and metho... |
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Invention
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Panel-level semiconductor package structure and method for manufacturing thereof.
A panel-level ... |
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Invention
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Semiconductor device package with sidewall-coupled thermal element and method of manufacturing th... |
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Invention
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Cowos ic structure with edge-pad semiconductor die.
An IC structure includes a memory stack, whi... |
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Invention
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Semiconductor device and manufacturing method thereof.
A semiconductor device includes a cage, a... |
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Invention
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High bandwidth memory stack with side edge interconnection and 3d ic structure with the same. An ... |
|
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Invention
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Semiconductor package and semiconductor package assembly with edge interconnection and method of ... |
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Invention
|
Semiconductor device and manufacturing method thereof.
A semiconductor device includes a first s... |
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2024
|
Invention
|
3d integrated circuit package and substrate structure thereof.
A 3D integrated circuit package i... |
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Invention
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Semiconductor package structure for enhanced cooling.
A semiconductor package includes a process... |
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Invention
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Semiconductor device.
A semiconductor device includes a substrate, a memory component and a heat... |
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Invention
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Semiconductor device package and method of manufacturing the same.
A semiconductor device packag... |
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Invention
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Semiconductor package for liquid immersion cooling and method of forming the same.
A semiconduct... |
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2023
|
Invention
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Semiconductor package and method for manufacturing the same.
A semiconductor package is provided... |
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Invention
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Semiconductor package for enhanced cooling.
The present application discloses a semiconductor pa... |
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|
Invention
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Semiconductor package structure for enhanced cooling.
A semiconductor package is provided, which... |
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Invention
|
Semiconductor structure.
A semiconductor structure includes a substrate and a first circuit cont... |
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Invention
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Manufacturing method of diamond composite wafer.
A method to process a diamond composite wafer i... |
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Invention
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Probe card system, method of manufacturing probe card system, method of using probe card system. ... |
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Invention
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Semiconductor package.
A semiconductor package is provided. The semiconductor package includes a... |
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Invention
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Semiconductor device and manufacturing method thereof.
A semiconductor device is provided. The s... |
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Invention
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Semiconductor device and manufacturing method thereof.
A semiconductor device includes a substra... |
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2022
|
Invention
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Semiconductor device, semiconductor substrate and manufacturing method thereof.
A semiconductor ... |
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|
Invention
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Manufacturing method of diamond composite wafer. A method to form a first diamond composite wafer... |
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|
Invention
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Die package, ic package and manufacturing process thereof.
A die package includes a semiconducto... |
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Invention
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Composite semiconductor wafer/chip for advanced ics and advanced ic packages and the manufacture ... |
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Invention
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High-yielding and ultrafine pitch packages for large-scale ic or advanced ic.
This invention pro... |
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Invention
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Diamond enhanced advanced ics and advanced ic packages. This invention provides opportunity for d... |
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2021
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P/S
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Packaging design services; Packaging design consultation services; System-in-a-package (SiP) serv... |
