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2026
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Invention
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Radio frequency device packages.
An integrated device package is disclosed to include an antenna... |
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Invention
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Multi-chip modules formed using wafer-level processing of a reconstituted wafer.
Apparatuses and... |
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Invention
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Connecting element for processor and memory. A structure is disclosed. The structure can include ... |
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2025
|
Invention
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Intelligent liquid cooling system. Disclosed are intelligent liquid cooling systems. The systems ... |
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Invention
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Methods for low temperature bonding using nanoparticles.
A method of making an assembly can incl... |
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Invention
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Wire bonding method and apparatus for electromagnetic interference shielding.
Apparatuses relati... |
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Invention
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Methods for bonding semiconductor elements.
Disclosed herein are methods for direct bonding. In ... |
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Invention
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Embedded organic interposer for high bandwidth.
Embedded organic interposers for high bandwidth ... |
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Invention
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Direct-bonded optoelectronic devices. Direct-bonded LED arrays and applications are provided. An ... |
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Invention
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Method of dynamically balancing voltage and frequency with performance in processing units and pr... |
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Invention
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Region shielding within a package of a microelectronic device.
A microelectronic device may incl... |
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Invention
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Monolithically unified logic-discrete memory cell array system architecture. Disclosed are archit... |
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Invention
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Image sensor device.
Methods of forming a back side image sensor device, as well as back side im... |
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Invention
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3d memory circuit.
Some embodiments provide a three-dimensional (3D) circuit that has data lines... |
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Invention
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Improved heat pipe cooling. Embodiments herein provide for an integrated cooling assembly compris... |
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Invention
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Apparatus for non-volatile random access memory stacks.
A memory structure is provided, includin... |
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Invention
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Symbiotic network on layers.
The technology relates to a system on chip (SoC). The SoC may inclu... |
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|
Invention
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Capacitive coupling in a direct-bonded interface for microelectronic devices.
Capacitive couplin... |
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|
Invention
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Connecting element for processor and memory.
A structure is disclosed. The structure can include... |
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Invention
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Wire bond wires for interference shielding.
Apparatuses relating generally to a microelectronic ... |
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Invention
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Scalable architecture for reduced cycles across soc.
A microelectronic assembly may include a se... |
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Invention
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Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same... |
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|
Invention
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Distributed neural network for aircraft.
Disclosed is a distributed neural network for aircraft ... |
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Invention
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Intelligent liquid cooling system for electric vehicle.
Disclosed are intelligent liquid cooling... |
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|
Invention
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Intelligent liquid cooling system for data center.
Disclosed are intelligent liquid cooling syst... |
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Invention
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Correction die for wafer/die stack.
Representative implementations of devices and techniques pro... |
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2024
|
Invention
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Artificial intelligence accelerator having computing units heterogeneously integrated with memory... |
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Invention
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Package-on-package assembly with wire bond vias.
A microelectronic package includes a substrate ... |
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|
Invention
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Direct-bonded led arrays and driver circuits.
Direct-bonded LED arrays and applications are prov... |
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Invention
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Nanowire bonding interconnect for fine-pitch microelectronics.
A nanowire bonding interconnect f... |
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|
Invention
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Direct-bonded optoelectronic devices.
Direct-bonded LED arrays and applications are provided. An... |
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|
Invention
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Embedded metal lines.
Techniques are disclosed herein for creating metal bitlines (BLs) in stack... |
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|
Invention
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Connecting multiple chips using an interconnect device.
Techniques are disclosed herein for conn... |
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|
Invention
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Non-volatile dynamic random access memory.
The present disclosure provides for a stacked memory ... |
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|
Invention
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Integrated circuit assemblies with rigid layers used for protection against mechanical thinning a... |
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Invention
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Through-dielectric-vias (tdvs) for 3d integrated circuits in silicon.
Through-dielectric-vias (T... |
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Invention
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Monolithically unified logic-discrete memory cell array system architecture.
Disclosed are archi... |
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Invention
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Through-dielectric-vias (tdvs) for 3d integrated circuits in silicon. Through-dielectric-vias (TD... |
|
|
Invention
|
Wire bonding method and apparatus for electromagnetic interference shielding. Apparatuses relatin... |
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|
Invention
|
Heat pipe cooling.
Embodiments herein provide for an integrated cooling assembly comprising a se... |
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|
Invention
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Fine pitch bva using reconstituted wafer with area array accessible for testing.
A microelectron... |
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Invention
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Advanced device assembly structures and methods.
A microelectronic assembly includes a first sub... |
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|
Invention
|
Flat metal features for microelectronics applications.
Advanced flat metals for microelectronics... |
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Invention
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3d-interconnect. A method of making a microelectronic package includes bonding a conductive struc... |
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2023
|
Invention
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Over and under interconnects.
Techniques are disclosed herein for creating over and under interc... |
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Invention
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System and method for providing 3d wafer assembly with known-good-dies. Systems and methods for p... |
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2021
|
Invention
|
Remote optical engine for virtual reality or augmented reality headsets. A virtual reality/augmen... |
