Apic Yamada Corporation

Japon


 
Quantité totale PI 84
Rang # Quantité totale PI 15 738
Note d'activité PI 2,8/5.0    82
Rang # Activité PI 8 503
Classe Nice dominante Machines et machines-outils

Brevets

Marques

18 2
0 0
62 0
2
 
Dernier brevet 2024 - Resin-sealing method
Premier brevet 1993 - Method of transfer mold and appa...
Dernière marque 1999 - FAME
Première marque 1996 - Y

Industrie (Classification de Nice)

Derniers inventions, produits et services

2024 Invention Device and method for forming sealing resin used for compression molding, and compression molding...
Invention Compression molding apparatus and compression molding method. The present invention addresses the...
Invention Compression-molding device and compression-molding method. The problem addressed is to prevent th...
Invention Compression molding device and compression molding method. This invention addresses the problem o...
Invention Formation device for sealing resin that is used for compression molding. The present invention ad...
2023 Invention Apparatus and method for forming sealing resin to be used for compression molding. The present in...
Invention Sealing resin used for compression molding, and forming method and forming device for same. The p...
Invention Sealing resin used for compression molding, and forming method for same. The present invention ad...
Invention Compression-molding device and compression-molding method. The present invention addresses the pr...
Invention Resin sealing device and resin sealing method. A resin sealing device (1) is provided with: a res...
Invention Resin sealing device and resin sealing method. Provided are a resin sealing device and method wit...
Invention Resin sealing apparatus. The resin sealing apparatus according to the present invention includes...
Invention Resin sealing device. The present invention addresses the problem of realizing a resin sealing de...
Invention Resin sealing device and resin sealing method. A resin sealing device seals, with a resin, an ele...
2022 Invention Resin-sealing method. There is provided a resin-sealing apparatus that supplies an appropriate a...
Invention Resin sealing device and resin sealing method. The present invention addresses the problem of pro...
Invention Resin seal device and resin seal method. A resin seal device (1) is provided with a workpiece sup...
Invention Resin sealing device. The present invention address the problem of providing a resin sealing devi...
Invention Resin sealing device and sealing mold. The present invention is capable of absorbing thickness va...
Invention Resin sealing device and sealing mold. The present invention makes it possible to absorb variatio...
Invention Resin sealing apparatus and cleaning method. Provided are a resin sealing apparatus wherein more ...
Invention Compression molding device. The present invention addresses the problem of providing a compressio...
Invention Resin sealing device and resin sealing method. The present invention is characterized by providin...
Invention Resin sealing device and resin sealing method. A problem is to provide a resin sealing device and...
Invention Resin sealing device. A resin sealing device (1) equipped with a workpiece supply unit (10), a re...
Invention Resin sealing method and resin sealing device. Provided are a resin sealing device and a resin se...
Invention Compression molding device. A compression molding device compression-molds resin to a workpiece ...
Invention Compression molding device. A compression molding device (1) compression molds a resin (R) to a w...
Invention Compression molding device and compression molding method. The present invention addresses the p...
Invention Compression molding device and compression molding method. The present invention addresses the pr...
Invention Compression-molding apparatus, and compression-molding method. A compression molding device and c...
Invention Resin sealing device, sealing mold, and resin sealing method. The purpose of the present inventio...
Invention Resin sealing device and resin sealing method. The present invention provides a resin sealing dev...
2021 Invention Resin-sealing method. A resin-sealing method for resin-sealing an electronic component using a m...
Invention Mold clamping device. Provided is a mold clamping device capable of preventing in advance a movab...
Invention Mold-clamping device. The present invention provides a resin sealing method capable of producing ...
Invention Resin supply apparatus, resin sealing apparatus, and method for manufacturing resin-sealed produc...
Invention Resin-sealing apparatus and resin-sealing method. There is provided a resin-sealing apparatus th...
Invention Resin sealing device. The objective of the present invention is to provide a resin sealing device...
Invention Resin sealing device and resin sealing method. Provided are a resin sealing device and a resin se...
Invention Compression molding apparatus. This compression molding apparatus (1) carries out compression mol...
Invention Resin-sealing method and resin-sealing device. A resin-sealing method compression molds a resin ...
Invention Resin-sealing method and resin-sealing device. A resin-sealing method for producing a plurality o...
Invention Resin molding device. A resin molding device that is easy to handle until a thin and large-size ...
Invention Resin molding apparatus. To provide a resin molding apparatus capable of correcting the bending o...
Invention Resin molding apparatus. A resin molding apparatus that can prevent a workpiece from deflecting d...
Invention Resin molding device. A resin molding device that can hold a thin and large-size workpiece witho...
Invention Resin molding apparatus and cleaning method. A resin molding apparatus and a cleaning method of ...
2019 Invention Resin molding apparatus. The present invention addresses the problem of providing a resin molding...
2005 P/S Semi-conductor manufacturing apparatus, plastic processing machines; parts of these apparatus and...
1996 P/S semi-conductor packaging machines, namely, plastic molding machines, plastic processing machines,...
P/S semi-conductor packaging machines, namely, automolding machines, metal and plastic trimming and f...