Meyer Burger AG

Suisse

 
Quantité totale PI 34
Rang # Quantité totale PI 41 670
Note d'activité PI 0/5.0    0
Rang # Activité PI 1 661 095
Parent Meyer Burger Technology AG

Brevets

Marques

0 0
0 0
34 0
0
 
Dernier brevet 2017 - A method for forming a contactin...
Premier brevet 1985 - Measuring system in an annular s...

Derniers inventions, produits et services

2016 Invention A method for forming a contacting structure to a back contact solar cell. The present disclosure ...
Invention Method for cutting a workpiece. The invention relates to a method for cutting a workpiece (30) on...
Invention Method of disposing a cutting wire. The invention relates to a method of disposing a cutting wire...
2015 Invention Wafer processing method. The invention relates to a wafer aligning system (1), comprising a trans...
Invention Wafer processing method. The invention relates to a wafer processing method performed subsequent ...
Invention Transporting system and method. The invention relates to a system for transporting workpieces (3'...
2014 Invention Method and system for forming laminates. The invention relates to methods and systems for forming...
Invention Mounting system for solar panels. The invention relates to a mounting system for frameless solar...
Invention Mounting system for solar panels. The invention relates to a mounting system for frameless solar ...
Invention Wire saw with slotted pulleys. The invention relates to a wire saw with pulleys that have a longe...
Invention Wire saw. The invention relates to a wire saw (1), preferably a wafer cutting saw, comprising: a ...
Invention Monitoring device and method for wire web monitoring and wire saw. An improved and simplified sys...
2013 Invention Laminator for solar modules using a tube like pressing member. An improved and simplified system ...
Invention Wire management system. The invention relates to a wire management system (7) for a wire saw (8) ...
Invention Wafer handling system. The invention relates to a wafer handling system (1) for handling a plural...
Invention Method of making wafers. The invention relates to a method of making wafers (5) from an ingot (4)...
Invention Wafer cutting system. The invention relates to a wafer receiving box (3) for receiving wafers (5)...
Invention Thrust element and inner diameter saw for ingots with such a thrust element. A thrust element (1)...
Invention Holding device. The invention relates to a holding device (1) for holding and rocking a work piec...
2012 Invention Wafer cutting sacrificial substrate for use in wafer cutting. The invention relates to a sacrific...
Invention Apparatus for driving a wire or wire-like objects. The invention relates to an apparatus for driv...
Invention Method for fixing a single-crystal workpiece to be treated on a processing device. The invention ...
Invention Cutting fluid cleaning arrangement for a wire saw, wire saw arrangements and use of the wire saw ...
Invention Systems and methods for electrostatically handling atleast a member of atleast a lay-up of plural...
2011 Invention Device for clamping a fixture attachment to a wire saw cutting machine. The device (4) for clampi...
Invention Method and transfer appliance for loading and unloading a wire saw cutting machine. The invention...
Invention Wire saw having wire-break monitoring. The invention relates to a method for monitoring for wire ...
2010 Invention Wire saw comprising a wire web and cleaning nozzles. The present application relates to a wire sa...
Invention Mechanically working and cutting silicon in an alkaline milieu. The present invention relates to ...
Invention Wire saw. In a wire saw that serves for cutting polygonal, columnar bricks out of an ingot of a ...
Invention Wire saw. In a wire saw that serves for cutting polygonal, columnar bricks out of an ingot of a g...
2009 Invention Device for holding columnar workpieces and use of the device. A device (20) for holding a workpie...
Invention Multi-wire cutting device with a revolving workpiece mount. The present invention relates to a mu...
Invention Device for cleaning flat substrates. The present invention relates to a device and a method for c...
2008 Invention Use of a mixture of substantially one thixotropic dispersant and abrasive grains as abrasives. Th...
Invention Method and device for recovering a mixture of a thixotropic dispersant and abrasive grains as abr...
1987 Invention Method for severing a rod in slices, slicing machine for carrying out the method and use of the s...
1985 Invention Measuring system in an annular slicing machine. The slicing machine has a mounting table carrying...