NexPlanar Corporation

États‑Unis d’Amérique

 
Quantité totale PI 15
Rang # Quantité totale PI 100 624
Note d'activité PI 0/5.0    0
Rang # Activité PI 1 661 163

Brevets

Marques

0 0
0 0
15 0
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Dernier brevet 2016 - Coated compressive subpad for ch...
Premier brevet 2011 - Soft polishing pad for polishing...

Derniers inventions, produits et services

2015 Invention Coated compressive subpad for chemical mechanical polishing. Coated compressive subpads for polis...
Invention Polishing pad having porogens with liquid filler. Polishing pads having porogens with liquid fill...
2014 Invention Low density polishing pad. Low density polishing pads and methods of fabricating low density poli...
Invention Polishing pad having polishing surface with continuous protrusions having tapered sidewalls. Poli...
Invention Polishing pad having polishing surface with continuous protrusions. A polishing pad (200, 800, 10...
2013 Invention Polishing pad with polishing surface layer having an aperture or opening above a transparent foun...
2012 Invention Polishing pad with aperture. Polishing pads with apertures are described. Methods of fabricating ...
Invention Polishing pad with foundation layer and polishing surface layer. Polishing pads with foundation l...
Invention Polishing pad with homogeneous body having discrete protrusions thereon. Polishing pads with homo...
Invention Polishing pad with alignment feature. Polishing pads with alignment marks are described. Methods ...
Invention Polishing pad with concentric or approximately concentric polygon groove pattern. Polishing pads ...
2011 Invention Polishing pad with multi-modal distribution of pore diameters. Polishing pads with multi-modal di...
Invention Polishing pad for eddy current end-point detection. Polishing pads for polishing semiconductor su...
Invention Polishing pad with homogeneous body having discrete protrusions thereon. Polishing pads with hom...
Invention Soft polishing pad for polishing a semiconductor substrate. Soft polishing pads for polishing sem...
Invention Cmp pad with local area transparency. A CMP polishing pad comprising (a) a polishing layer having...