- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 1/00 - Soldering, e.g. brazing, or unsoldering
Patent holdings for IPC class B23K 1/00
Total number of patents in this class: 3537
10-year publication summary
382
|
379
|
334
|
293
|
274
|
231
|
258
|
197
|
179
|
130
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Senju Metal Industry Co., Ltd. | 684 |
90 |
GE Infrastructure Technology, LLC | 6248 |
73 |
UACJ Corporation | 701 |
61 |
Mitsubishi Electric Corporation | 46449 |
53 |
International Business Machines Corporation | 61471 |
52 |
Rtx Corporation | 9445 |
52 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 43400 |
47 |
LG Electronics Inc. | 73578 |
44 |
Denso Corporation | 24480 |
43 |
Illinois Tool Works Inc. | 11503 |
42 |
Siemens Energy, Inc. | 1708 |
42 |
Siemens AG | 24386 |
41 |
Murata Manufacturing Co., Ltd. | 24741 |
39 |
Daikin Industries, Ltd. | 10071 |
35 |
Mitsubishi Materials Corporation | 2458 |
35 |
Panasonic Intellectual Property Management Co., Ltd. | 31882 |
34 |
Samsung Electronics Co., Ltd. | 147622 |
31 |
Rolls-Royce Corporation | 1760 |
30 |
Fuji Electric Co., Ltd. | 5203 |
24 |
Alfa Laval Corporate AB | 1319 |
24 |
Other owners | 2645 |