Taiwan Semiconductor Manufacturing Company, Ltd.

Taiwan, Province of China


 
Total IP 41,799
Total IP incl. subs 41,885 (+ 252 for subs)
Total IP Rank # 13
IP Activity Score 4.9/5.0    33,249
IP Activity Rank # 7
IP AS incl. subs 4.9/5.0    33,309
Stock Symbol
ISIN TW0002330008
Market Cap. 27.6T  (TWD)
Industry Semiconductors
Sector Technology
Dominant Nice Class Treatment of materials; recyclin...

Patents

Trademarks

41,658 47
8 17
17 0
52
 
Last Patent 2025 - Heterostructure oxide semiconduc...
First Patent 1985 - Amplitude enhanced sampled clipp...
Last Trademark 2025 - TSMC COMPACT
First Trademark 1994 - TSMC

Subsidiaries

3 subsidiaries with IP (249 patents, 3 trademarks)

1 subsidiaries without IP

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Industry (Nice Classification)

Latest Inventions, Goods, Services

2025 G/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; a...
G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Semiconductors...
Invention Finfet gate structure and related methods. A semiconductor device includes a substrate having a ...
Invention Package structure with warpage-control element. A package structure is provided. The package str...
Invention Integrated circuit structure. An integrated circuit structure and method of forming is provided....
Invention Manufacturing method of three-dimensional stacking structure. A stacking structure including a f...
Invention Semiconductor device structure and manufacturing process thereof. A semiconductor device structu...
G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Product resear...
Invention Heterostructure oxide semiconductor vertical gate-all-around (vgaa) transistor and methods for ma...
Invention Method of forming ferroelectric memory device. A ferroelectric memory device, a manufacturing me...
Invention Sram cell word line structure with reduced rc effects. A device includes first and second gate e...
Invention Multiple transport carrier docking device. A multiple transport carrier docking device may be ca...
Invention Package structure. A package structure is provided. The package structure includes a semiconduct...
Invention Integrated circuit structure. An integrated circuit (IC) structure includes a first transistor a...
Invention Integrated circuit structure including multi-width fins. An IC structure a first circuit and a s...
Invention Package structures. In an embodiment, a device includes: a substrate having a first side and a s...
Invention Euv light source contamination monitoring system. A system for monitoring and controlling an EUV...
Invention Metal loss prevention in conductive structures. The present disclosure describes a method for fo...
Invention Novel 3d ram sl/bl contact modulation. A 3D memory array includes a row of stacks, each stack ha...
Invention Photolithography alignment process for bonded wafers. Various embodiments of the present disclos...
Invention Wafer level package with polymer layer delamination prevention design and method of forming the s...
Invention Method of forming semiconductor package. A method of forming a semiconductor package includes th...
Invention Method of manufacturing a semiconductor device including a plurality of circuit components and ar...
Invention Semiconductor wafer storage device. The present disclosure describes a method for substrate stor...
Invention Package structure for heat dissipation. A package structure and method of manufacturing is provi...
Invention Integrated circuit. An integrated circuit includes a metal/dielectric layer, a second dielectric...
Invention Device and method of forming the same. A device includes a first conductive feature, an etch sto...
Invention Memory device, memory cell read circuit, and control method for mismatch compensation. A memory ...
Invention Memory device including a word line with portions with different sizes in different metal layers....
Invention Memory device and programming method thereof. A programming method of a memory device is introdu...
Invention Semiconductor device and method. A device includes a fin on a substrate; a first transistor, inc...
Invention Integrated circuit with mixed row heights. An integrated circuit structure includes: an integrat...
2024 Invention Method of making complementary metal-oxide-semiconductor image sensor. A method of making a pixe...
Invention Memory circuit and method of operating the same. A memory circuit includes a NAND logic gate con...
Invention Semiconductor device including a layer between a source/drain region and a substrate. Devices an...
Invention Sense amplifier for coupling effect reduction. A sense amplifier including a first input transis...
G/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; i...
Invention Dielectric materials for stacked transistor structures and related methods. Gate dielectric mate...
Invention Frontside and backside bit lines in a memory array. A semiconductor device according to the pres...
Invention Driving circuit, precharging circuitry for driving circuit, and method of operating driving circu...
Invention Forming multiple tsvs with different formation schemes. A method includes forming a first device...
2023 Invention Wafer acceptance test tool and test method using thereof. A method includes pressing probes agai...
Invention Semiconductor device and method for forming the same. A method includes forming a first stack of...
Invention Systems and methods for solving ir violations. A method for designing an integrated circuit comp...
Invention Semiconductor structure having tsv and manufacturing method thereof. A semiconductor device incl...
Invention Photoresist composition. A photoresist composition comprises a solvent and a polymer. The polyme...
Invention Fiber array unit integrated with light guiding elements and method for forming the same. A fiber...
Invention Low volume shrinkage, high etch resistance and high resolution photoresists. A method for formin...
Invention Low resistance signal transduction enabled by high efficiency copper feedthroughs. In fabricatin...
Invention Immersion cooling system and methods. A method includes: forming a cooled device by cooling a de...
Invention Semiconductor device and method of manufacture. A wafer on wafer on wafer and a chip on wafer on...
Invention Gate isolation features. Devices with isolated metal structures and methods of fabrication are p...
Invention Semiconductor device and method of fabricating thereof. Methods for forming a stacked transistor...
Invention Device performance diversification. Semiconductor structures and methods are provided. A semicon...
G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits.
G/S Custom manufacture of semiconductors, computer memory chips, multiprocessor memory chips, semicon...
G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits
2022 G/S Semiconductors; computer memory chips, multiprocessor memory chips, semiconductor memory chips, s...
G/S Semiconductors; memory chips; semiconductor wafers; integrated circuits; telecommunication device...
G/S Semiconductors; semiconductor memory chips; semiconductor wafers; integrated circuits; electronic...