|
2025
|
G/S
|
Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; a... |
|
|
G/S
|
Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Semiconductors... |
|
|
Invention
|
Semiconductor structure with contact rail and method for forming the same.
A method includes for... |
|
|
Invention
|
Memory circuit and method of operating same.
A memory circuit includes a bit line driver circuit... |
|
|
Invention
|
High performance memory device.
A semiconductor structure according to the present disclosure in... |
|
|
Invention
|
Semiconductor devices and methods of manufacturing thereof.
A semiconductor device includes a pl... |
|
|
Invention
|
Optical devices and methods of manufacture.
Optical devices and methods of manufacture are prese... |
|
|
Invention
|
Manufacturing method of semiconductor structure and semiconductor structure thereof.
A semicondu... |
|
|
Invention
|
Phase and amplitude tuning in a silicon photonics circuit.
A silicon photonics integrated circui... |
|
|
Invention
|
Hybrid integrated circuit dies.
In an embodiment, a device includes: a gallium nitride device on... |
|
|
Invention
|
Heat sink structure and methods thereof.
One aspect of the present disclosure pertains to an int... |
|
|
Invention
|
Stacked image sensors and methods of manufacturing thereof.
A semiconductor device includes a fi... |
|
|
Invention
|
One-time-programmable memory array having different device characteristics and methods of manufac... |
|
|
Invention
|
Method and structure for a bridge interconnect.
Embodiments utilize a bridge die that directly b... |
|
|
Invention
|
Phase change material switch circuit for enhanced signal isolation and methods of forming the sam... |
|
|
Invention
|
Transistor including a hydrogen-diffusion barrier and methods for forming the same.
A thin film ... |
|
|
Invention
|
Conductive via with improved gap filling performance.
A dielectric structure is formed over a la... |
|
|
Invention
|
Heat dissipation for field effect transistors.
Semiconductor devices and methods of forming the ... |
|
|
Invention
|
Novel protection diode structure for stacked image sensor devices.
A first side of a sensor wafe... |
|
|
Invention
|
Contact features of semiconductor device and method of forming same.
A method includes forming a... |
|
|
Invention
|
Semiconductor gate structure and methods of forming the same.
A method includes depositing a gat... |
|
|
Invention
|
Semiconductor device packages and methods of forming the same.
Semiconductor device packages and... |
|
|
Invention
|
Semiconductor package and method.
A semiconductor package includes a redistribution structure, f... |
|
|
Invention
|
Multi-port sram cell with dual side power rails.
A semiconductor devices include first and secon... |
|
|
Invention
|
Semiconductor package and manufacturing method thereof.
A semiconductor package and a manufactur... |
|
|
Invention
|
Dielectric layer on semiconductor device and method of forming the same.
A method of forming a s... |
|
|
Invention
|
Semiconductor memory device and method of forming the same.
Some embodiments relate to a semicon... |
|
|
Invention
|
Method of manufacturing semiconductor structure.
A method of manufacturing a semiconductor struc... |
|
|
Invention
|
Integrated circuit packages and methods.
An integrated circuit package and the method of forming... |
|
|
Invention
|
Waveguide structure.
An optical phase-shifting device includes a ribbed waveguide portion on an ... |
|
|
G/S
|
Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Product resear... |
|
2024
|
G/S
|
Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; i... |
|
|
Invention
|
Asymmetric multi-ring resonator.
A photonic integrated circuit has an asymmetric dual ring reson... |
|
|
Invention
|
Semiconductor device structure and methods of forming the same.
Embodiments of the present discl... |
|
|
Invention
|
Controllable oxide recess profile through various wet oxidation processes.
A method includes for... |
|
|
Invention
|
Semiconductor structure and manufacturing method thereof.
A method includes forming an interconn... |
|
|
Invention
|
Semiconductor structure, package structure and manufacturing method of semiconductor structure.
... |
|
|
Invention
|
Semiconductor structure and method for forming the same.
Semiconductor structures and methods fo... |
|
|
Invention
|
Semiconductor module including a corner die over a side of a semiconductor die, package structure... |
|
|
Invention
|
Semiconductor device and method for forming the same.
A semiconductor device includes a substrat... |
|
|
Invention
|
Package structure and method for fabricating the same.
A package structure is provided. The pack... |
|
|
Invention
|
Pick-and-place alignment marks for semiconductor package structures and methods of making the sam... |
|
|
Invention
|
Semiconductor package with heat spreading lid.
A semiconductor package includes an interposer ha... |
|
|
Invention
|
Transistor produced using improved metal oxide process.
A method of fabricating a device include... |
|
|
Invention
|
Package and manufacturing method thereof.
The present disclosure provides a method. In some embo... |
|
|
Invention
|
Semiconductor structure and method for manufacturing the same.
A method for manufacturing a semi... |
|
|
Invention
|
Structure and formation method of package with heat-spreading lid.
A package structure and a for... |
|
|
Invention
|
Monitoring system for data center maintenance.
One or more sensors are integrated into a process... |
|
|
Invention
|
Dynamic liquid cooling for integrated device.
Some embodiments relate to an integrated circuit c... |
|
|
Invention
|
Semiconductor devices and methods of formation.
A semiconductor device is formed such that isola... |
|
|
Invention
|
Package structure and method for forming the same.
Embodiments of the present disclosure provide... |
|
|
Invention
|
Package assembly and method of forming the same.
A method of forming a package assembly includes... |
|
|
Invention
|
Semiconductor die packages and methods of formation.
An elongated conductive structure is includ... |
|
2023
|
G/S
|
Custom manufacture of semiconductors, memory chips, wafers and integrated circuits. |
|
|
G/S
|
Custom manufacture of semiconductors, computer memory chips, multiprocessor memory chips, semicon... |
|
|
G/S
|
Custom manufacture of semiconductors, memory chips, wafers and integrated circuits |
|
2022
|
G/S
|
Semiconductors; computer memory chips, multiprocessor memory chips, semiconductor memory chips, s... |
|
|
G/S
|
Semiconductors; memory chips; semiconductor wafers; integrated circuits; telecommunication device... |