Taiwan Semiconductor Manufacturing Company, Ltd.

Taiwan, Province of China


Create a watch for Taiwan Semiconductor Manufacturing Company, Ltd.
Total IP 45,023
Total IP incl. subs 45,122 (+ 286 for subs)
Total IP Rank # 10
IP Activity Score 4.9/5.0    35,374
IP Activity Rank # 6
IP AS incl. subs 4.9/5.0    35,444
Stock Symbol
ISIN TW0002330008
Market Cap. 27.6T  (TWD)
Industry Semiconductors
Sector Technology
Dominant Nice Class Treatment of materials; recyclin...

Patents

Trademarks

44,876 49
8 19
17 0
54
 
Last Patent 2025 - Semiconductor structure and manu...
First Patent 1985 - Amplitude enhanced sampled clipp...
Last Trademark 2025 - TSMC-COPOS
First Trademark 1994 - TSMC

Subsidiaries

3 subsidiaries with IP (283 patents, 3 trademarks)

1 subsidiaries without IP

 Register for free to unlock the subsidiary list

Industry (Nice Classification)

Latest Inventions, Goods, Services

2025 G/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; a...
G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Semiconductors...
Invention Semiconductor structure with contact rail and method for forming the same. A method includes for...
Invention Memory circuit and method of operating same. A memory circuit includes a bit line driver circuit...
Invention High performance memory device. A semiconductor structure according to the present disclosure in...
Invention Semiconductor devices and methods of manufacturing thereof. A semiconductor device includes a pl...
Invention Optical devices and methods of manufacture. Optical devices and methods of manufacture are prese...
Invention Manufacturing method of semiconductor structure and semiconductor structure thereof. A semicondu...
Invention Phase and amplitude tuning in a silicon photonics circuit. A silicon photonics integrated circui...
Invention Hybrid integrated circuit dies. In an embodiment, a device includes: a gallium nitride device on...
Invention Heat sink structure and methods thereof. One aspect of the present disclosure pertains to an int...
Invention Stacked image sensors and methods of manufacturing thereof. A semiconductor device includes a fi...
Invention One-time-programmable memory array having different device characteristics and methods of manufac...
Invention Method and structure for a bridge interconnect. Embodiments utilize a bridge die that directly b...
Invention Phase change material switch circuit for enhanced signal isolation and methods of forming the sam...
Invention Transistor including a hydrogen-diffusion barrier and methods for forming the same. A thin film ...
Invention Conductive via with improved gap filling performance. A dielectric structure is formed over a la...
Invention Heat dissipation for field effect transistors. Semiconductor devices and methods of forming the ...
Invention Novel protection diode structure for stacked image sensor devices. A first side of a sensor wafe...
Invention Contact features of semiconductor device and method of forming same. A method includes forming a...
Invention Semiconductor gate structure and methods of forming the same. A method includes depositing a gat...
Invention Semiconductor device packages and methods of forming the same. Semiconductor device packages and...
Invention Semiconductor package and method. A semiconductor package includes a redistribution structure, f...
Invention Multi-port sram cell with dual side power rails. A semiconductor devices include first and secon...
Invention Semiconductor package and manufacturing method thereof. A semiconductor package and a manufactur...
Invention Dielectric layer on semiconductor device and method of forming the same. A method of forming a s...
Invention Semiconductor memory device and method of forming the same. Some embodiments relate to a semicon...
Invention Method of manufacturing semiconductor structure. A method of manufacturing a semiconductor struc...
Invention Integrated circuit packages and methods. An integrated circuit package and the method of forming...
Invention Waveguide structure. An optical phase-shifting device includes a ribbed waveguide portion on an ...
G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Product resear...
2024 G/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; i...
Invention Asymmetric multi-ring resonator. A photonic integrated circuit has an asymmetric dual ring reson...
Invention Semiconductor device structure and methods of forming the same. Embodiments of the present discl...
Invention Controllable oxide recess profile through various wet oxidation processes. A method includes for...
Invention Semiconductor structure and manufacturing method thereof. A method includes forming an interconn...
Invention Semiconductor structure, package structure and manufacturing method of semiconductor structure. ...
Invention Semiconductor structure and method for forming the same. Semiconductor structures and methods fo...
Invention Semiconductor module including a corner die over a side of a semiconductor die, package structure...
Invention Semiconductor device and method for forming the same. A semiconductor device includes a substrat...
Invention Package structure and method for fabricating the same. A package structure is provided. The pack...
Invention Pick-and-place alignment marks for semiconductor package structures and methods of making the sam...
Invention Semiconductor package with heat spreading lid. A semiconductor package includes an interposer ha...
Invention Transistor produced using improved metal oxide process. A method of fabricating a device include...
Invention Package and manufacturing method thereof. The present disclosure provides a method. In some embo...
Invention Semiconductor structure and method for manufacturing the same. A method for manufacturing a semi...
Invention Structure and formation method of package with heat-spreading lid. A package structure and a for...
Invention Monitoring system for data center maintenance. One or more sensors are integrated into a process...
Invention Dynamic liquid cooling for integrated device. Some embodiments relate to an integrated circuit c...
Invention Semiconductor devices and methods of formation. A semiconductor device is formed such that isola...
Invention Package structure and method for forming the same. Embodiments of the present disclosure provide...
Invention Package assembly and method of forming the same. A method of forming a package assembly includes...
Invention Semiconductor die packages and methods of formation. An elongated conductive structure is includ...
2023 G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits.
G/S Custom manufacture of semiconductors, computer memory chips, multiprocessor memory chips, semicon...
G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits
2022 G/S Semiconductors; computer memory chips, multiprocessor memory chips, semiconductor memory chips, s...
G/S Semiconductors; memory chips; semiconductor wafers; integrated circuits; telecommunication device...