Taiwan Semiconductor Manufacturing Company, Ltd.

Taiwan, Province of China


 
Total IP 41,068
Total IP incl. subs 41,155 (+ 243 for subs)
Total IP Rank # 13
IP Activity Score 4.9/5.0    32,936
IP Activity Rank # 7
IP AS incl. subs 4.9/5.0    32,996
Stock Symbol
ISIN TW0002330008
Market Cap. 27.6T  (TWD)
Industry Semiconductors
Sector Technology
Dominant Nice Class Treatment of materials; recyclin...

Patents

Trademarks

40,943 41
10 11
17 0
46
 
Last Patent 2025 - Multiple layer dual port memory ...
First Patent 1985 - Amplitude enhanced sampled clipp...
Last Trademark 2025 - NEXSYS
First Trademark 1994 - TSMC

Subsidiaries

3 subsidiaries with IP (240 patents, 3 trademarks)

1 subsidiaries without IP

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Industry (Nice Classification)

Latest Inventions, Goods, Services

2025 G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Product resear...
2024 Invention Stocker system for wafer cassette. A support member system is described for association with an ...
Invention Rf switch device with a sidewall spacer having a low dielectric constant. Various embodiments of...
Invention Semiconductor device structure and methods of forming the same. A semiconductor device structure...
Invention Method of manufacturing semiconductor devices and semiconductor devices. In a method of manufact...
Invention Metal hard masks for reducing line bending. A method includes forming a metal-containing hard ma...
Invention Semiconductor package and manufacturing method thereof. A semiconductor package is provided. The...
Invention Semiconductor devices and methods of manufacturing thereof. A semiconductor device includes an a...
Invention Multiple layer dual port memory cell manufacturing method. A method of manufacturing a memory ci...
Invention Process control for package formation. A method includes bonding a first and a second device die...
Invention Profile control of channel structures for semiconductor devices. The present disclosure describe...
Invention Method of forming bottom electrode via for memory device. The present disclosure relates to inte...
Invention High density semiconductor storage system. The present disclosure is directed to a stocker utili...
Invention Device and method for high pressure anneal. Embodiment methods for performing a high pressure an...
Invention Curved cantilever design to reduce stress in mems actuator. The present disclosure relates to an...
Invention Pellicle for euv lithography mask. A pellicle for an EUV photo mask includes a first capping lay...
Invention Memory device and operating method thereof. A memory device, comprising: a first driving circuit...
Invention Systems and methods for generating synthesizable netlists from register transfer level designs. ...
Invention Memory device. A memory device includes a memory array, a first latch and a first logic element....
Invention One time programmable (otp) magnetoresistive random-access memory (mram). A memory device includ...
Invention Semiconductor devices and methods of manufacturing thereof. A semiconductor device includes a ch...
Invention Method of manufacturing a semiconductor device. In a method of manufacturing a semiconductor dev...
Invention Complementary metal-oxide-semiconductor device and method of manufacturing the same. A manufactu...
G/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; i...
G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits Semiconductors...
Invention Semiconductor devices with epitaxial source/drain region with a bottom dielectric and methods of ...
Invention Memory device and operation method thereof. A memory device includes multiple first memory cells...
Invention Semiconductor device and method of manufacturing the same. A semiconductor device and method of ...
Invention Wafer retaining device. A wafer retaining device is provided. The wafer retaining device include...
Invention Semiconductor device and methods of fabrication thereof. A semiconductor device structure is pro...
Invention Epitaxial structures in semiconductor devices. A semiconductor device and a method of fabricatin...
Invention Adjustable voltage divider circuit and method. A circuit includes a first capacitive device coup...
2023 Invention Back-end active device. Semiconductor structures and formation processes thereof are provided. A...
Invention Semiconductor package and manufacturing method thereof. A semiconductor package includes a semic...
Invention Package structure and method of fabricating the same. A package structure includes a first semic...
Invention Interconnect structure including conductive feature with low contact resistivity. An interconnec...
Invention Semiconductor device and methods of formation. A continuous metal on diffusion edge (CMODE) may ...
Invention Semiconductor package with stiffener structure. A chip package structure is provided. The chip p...
Invention Interposer with planar sidewall surface for optical coupling and methods of forming the same. A ...
Invention Stress reduction structures for a semiconductor die in a composite package and methods of forming...
Invention Semiconductor device with conductive feature connecting transistors. A semiconductor device incl...
Invention Integrated circuit conductive structure for circuit probe testing. Some embodiments relate to a ...
Invention Wafer chuck including self-sealing vacuum seal assemblies and methods for operating the same. A ...
Invention Sram cell with write-assist transistors. An SRAM cell includes a first active region, a first ga...
Invention System of determining leakage of semiconductor manufacturing tool and usage method thereof. The ...
Invention Field effect transistor having segmented channel region. Field effect transistor (FET) devices h...
Invention Semiconductor package and method. Semiconductor package and method of manufacturing are presente...
Invention Gate dielectric features in high-voltage ic devices and methods of forming the same. Some embodi...
Invention Reinforcement structures for multi-die semiconductor packages and methods of forming the same. A...
Invention Semiconductor gap fill and planarization. The present disclosure describes a semiconductor struc...
Invention Contacts in semiconductor devices and methods of forming the same. A semiconductor die and the m...
Invention Alignment structures for die pick-and-placement and methods of using the same. A fan-out package...
G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits.
G/S Custom manufacture of semiconductors, computer memory chips, multiprocessor memory chips, semicon...
G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits
2022 G/S Semiconductors; computer memory chips, multiprocessor memory chips, semiconductor memory chips, s...
G/S Semiconductors; memory chips; semiconductor wafers; integrated circuits; telecommunication device...
G/S Semiconductors; semiconductor memory chips; semiconductor wafers; integrated circuits; electronic...
G/S Custom manufacture of semiconductors, memory chips, wafers and integrated circuits. Product resea...
G/S Custom manufacture and assembly of semiconductors, semiconductor devices, memory chips, semicondu...
2020 G/S Semiconductors, memory chips, wafers and integrated circuits. Custom manufacture of semiconductor...
G/S Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; a...