- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 101/42 - Printed circuits
Patent holdings for IPC class B23K 101/42
Total number of patents in this class: 743
10-year publication summary
|
92
|
91
|
66
|
63
|
52
|
48
|
45
|
46
|
49
|
27
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Senju Metal Industry Co., Ltd. | 689 |
55 |
| Illinois Tool Works Inc. | 11858 |
38 |
| Jiaxing Super Lighting Electric Appliance Co., Ltd | 421 |
19 |
| International Business Machines Corporation | 62621 |
16 |
| Panasonic Intellectual Property Management Co., Ltd. | 33911 |
15 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 48248 |
14 |
| Murata Manufacturing Co., Ltd. | 25722 |
13 |
| Alpha Assembly Solutions Inc. | 211 |
12 |
| Fuji Corporation | 3635 |
12 |
| Kulicke and Soffa Industries, Inc. | 334 |
11 |
| ERSA GmbH | 67 |
10 |
| Tamura Corporation | 357 |
10 |
| Samsung Electronics Co., Ltd. | 157557 |
9 |
| Mitsubishi Materials Corporation | 2468 |
9 |
| PAC Tech - Packaging Technologies GmbH | 100 |
9 |
| Intel Corporation | 47102 |
8 |
| KEMET Electronics Corporation | 320 |
8 |
| Fujitsu Ten Limited | 438 |
6 |
| Denso Corporation | 25513 |
6 |
| Fuji Electric Co., Ltd. | 5469 |
6 |
| Other owners | 457 |