- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 15/08 - Removing material, e.g. by cutting, by hole drilling
Patent holdings for IPC class B23K 15/08
Total number of patents in this class: 77
10-year publication summary
|
15
|
3
|
7
|
4
|
5
|
1
|
4
|
2
|
4
|
2
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| GE Infrastructure Technology, LLC | 6151 |
5 |
| Hybrid Manufacturing Technologies Limited | 10 |
4 |
| Siemens AG | 23934 |
3 |
| Element Six Technologies Limited | 207 |
3 |
| FEI Company | 1063 |
3 |
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 516 |
3 |
| KLA Corporation | 1891 |
3 |
| Carl Zeiss Microscopy GmbH | 1305 |
2 |
| IPG Photonics Corporation | 598 |
2 |
| MTU Aero Engines GmbH | 407 |
2 |
| Pro-Beam AG & Co. KGAA | 8 |
2 |
| Apple Inc. | 59414 |
1 |
| SNECMA S.A. | 1145 |
1 |
| International Business Machines Corporation | 62864 |
1 |
| Robert Bosch GmbH | 44398 |
1 |
| GM Global Technology Operations LLC | 16255 |
1 |
| Koninklijke Philips Electronics N.V. | 7082 |
1 |
| Mitsubishi Electric Corporation | 48460 |
1 |
| Nitto Denko Corporation | 8640 |
1 |
| Lockheed Martin Corporation | 3263 |
1 |
| Other owners | 36 |