- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/073 - Shaping the laser spot
Patent holdings for IPC class B23K 26/073
Total number of patents in this class: 1107
10-year publication summary
|
71
|
102
|
95
|
101
|
113
|
108
|
97
|
75
|
73
|
14
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| TRUMPF Laser- und Systemtechnik GmbH | 532 |
76 |
| Hamamatsu Photonics K.K. | 4590 |
38 |
| Corning Incorporated | 10409 |
31 |
| Disco Corporation | 1920 |
23 |
| nLIGHT, Inc. | 412 |
20 |
| Samsung Display Co., Ltd. | 37602 |
18 |
| Panasonic Intellectual Property Management Co., Ltd. | 33375 |
17 |
| 4JET Microtech GmbH | 53 |
17 |
| Robert Bosch GmbH | 43504 |
16 |
| Coherent, Inc. | 300 |
16 |
| Corelase Oy | 33 |
16 |
| The Furukawa Electric Co., Ltd. | 3700 |
15 |
| General Electric Company | 13809 |
14 |
| Amada Company, Limited | 603 |
14 |
| Mitsubishi Electric Corporation | 47511 |
13 |
| Gigaphoton Inc. | 1296 |
11 |
| IPG Photonics Corporation | 570 |
11 |
| SCHOTT AG | 1727 |
10 |
| VulcanForms Inc. | 117 |
10 |
| TRUMPF Laser GmbH | 159 |
8 |
| Other owners | 713 |