- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/18 - Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
Patent holdings for IPC class B23K 26/18
Total number of patents in this class: 305
10-year publication summary
|
31
|
24
|
21
|
22
|
23
|
22
|
18
|
10
|
12
|
12
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1965 |
12 |
| Corning Incorporated | 10572 |
10 |
| Hamamatsu Photonics K.K. | 4739 |
7 |
| Electro Scientific Industries, Inc. | 346 |
7 |
| Samsung Display Co., Ltd. | 39369 |
6 |
| Siemens AG | 23948 |
6 |
| Robert Bosch GmbH | 44445 |
6 |
| Tokyo Electron Limited | 14049 |
6 |
| Panduit Corp. | 1013 |
6 |
| Nitto Denko Corporation | 8645 |
5 |
| ArcelorMittal | 2766 |
5 |
| Ferro Corporation | 136 |
5 |
| Bayer AG | 3587 |
4 |
| Applied Materials, Inc. | 20694 |
4 |
| 4JET Microtech GmbH | 55 |
4 |
| Rtx Corporation | 10264 |
4 |
| Aledia | 369 |
3 |
| EO Technics Co., Ltd. | 116 |
3 |
| Corning Research & Development Corporation | 1348 |
3 |
| Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6109 |
3 |
| Other owners | 196 |