- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/359 - Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
Patent holdings for IPC class B23K 26/359
Total number of patents in this class: 335
10-year publication summary
|
26
|
44
|
45
|
33
|
27
|
39
|
30
|
25
|
20
|
16
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1957 |
19 |
| View Operating Corporation | 566 |
11 |
| Corning Incorporated | 10532 |
10 |
| Samsung Electronics Co., Ltd. | 158842 |
8 |
| Husky Injection Molding Systems Ltd. | 972 |
8 |
| Siltectra GmbH | 90 |
8 |
| Nikon Corporation | 7231 |
7 |
| JENOPTIK Automatisierungstechnik GmbH | 49 |
7 |
| Trinity Industrial Corporation | 110 |
6 |
| Sumitomo Rubber Industries, Ltd. | 4737 |
5 |
| IPG Photonics Corporation | 593 |
5 |
| POSCO Co., Ltd. | 2028 |
5 |
| TRUMPF Laser- und Systemtechnik GmbH | 524 |
5 |
| LG Energy Solution, Ltd. | 19396 |
5 |
| Gentex Corporation | 1971 |
4 |
| The Procter & Gamble Company | 21880 |
3 |
| Samsung Display Co., Ltd. | 39012 |
3 |
| Ricoh Company, Ltd. | 13355 |
3 |
| Applied Materials, Inc. | 20552 |
3 |
| Hamamatsu Photonics K.K. | 4703 |
3 |
| Other owners | 207 |