- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/359 - Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
Patent holdings for IPC class B23K 26/359
Total number of patents in this class: 298
10-year publication summary
|
26
|
26
|
44
|
45
|
33
|
27
|
39
|
29
|
22
|
8
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1821 |
19 |
| Corning Incorporated | 10155 |
13 |
| View Operating Corporation | 493 |
10 |
| Samsung Electronics Co., Ltd. | 140622 |
8 |
| Siltectra GmbH | 88 |
8 |
| JENOPTIK Automatisierungstechnik GmbH | 50 |
7 |
| Nikon Corporation | 7119 |
6 |
| Trinity Industrial Corporation | 117 |
6 |
| Sumitomo Rubber Industries, Ltd. | 4420 |
5 |
| TRUMPF Laser- und Systemtechnik GmbH | 533 |
5 |
| Gentex Corporation | 1890 |
4 |
| IPG Photonics Corporation | 514 |
4 |
| POSCO Co., Ltd. | 1341 |
4 |
| The Procter & Gamble Company | 22121 |
3 |
| Samsung Display Co., Ltd. | 33218 |
3 |
| Ricoh Company, Ltd. | 13213 |
3 |
| Hamamatsu Photonics K.K. | 4344 |
3 |
| Nichia Corporation | 3573 |
3 |
| Rogers Germany GmbH | 138 |
3 |
| Laser Engineering Applications | 24 |
3 |
| Other owners | 178 |