- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/36 - Removing material
Patent holdings for IPC class B23K 26/36
Total number of patents in this class: 1367
10-year publication summary
|
65
|
60
|
76
|
81
|
92
|
70
|
90
|
76
|
93
|
57
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 20375 |
40 |
| Seurat Technologies, Inc. | 175 |
35 |
| Disco Corporation | 1956 |
24 |
| Electro Scientific Industries, Inc. | 345 |
23 |
| Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6117 |
17 |
| Hamamatsu Photonics K.K. | 4681 |
16 |
| Alltec angewandte Laserlicht Technologie GmbH | 103 |
16 |
| Tokyo Electron Limited | 13807 |
15 |
| Corning Incorporated | 10504 |
15 |
| Samsung Display Co., Ltd. | 38627 |
10 |
| Robert Bosch GmbH | 44160 |
10 |
| Nikon Corporation | 7228 |
10 |
| TOYOKOH, Co., Ltd. | 28 |
10 |
| General Electric Company | 13899 |
9 |
| The Boeing Company | 20160 |
9 |
| FANUC Corporation | 7217 |
9 |
| Nippon Telegraph and Telephone Corporation | 15924 |
8 |
| ArcelorMittal | 2672 |
8 |
| The University of Tokyo | 4361 |
8 |
| Samsung Electronics Co., Ltd. | 157719 |
7 |
| Other owners | 1068 |