- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/36 - Removing material
Patent holdings for IPC class B23K 26/36
Total number of patents in this class: 1387
10-year publication summary
|
65
|
60
|
76
|
81
|
92
|
70
|
91
|
76
|
94
|
75
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 20625 |
42 |
| Seurat Technologies, Inc. | 177 |
34 |
| Disco Corporation | 1965 |
24 |
| Electro Scientific Industries, Inc. | 346 |
23 |
| Tokyo Electron Limited | 13987 |
17 |
| Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6119 |
17 |
| Hamamatsu Photonics K.K. | 4730 |
16 |
| Alltec angewandte Laserlicht Technologie GmbH | 103 |
16 |
| Corning Incorporated | 10558 |
15 |
| Samsung Display Co., Ltd. | 39229 |
11 |
| Nikon Corporation | 7226 |
11 |
| Robert Bosch GmbH | 44398 |
10 |
| TOYOKOH, Co., Ltd. | 28 |
10 |
| General Electric Company | 14010 |
9 |
| The Boeing Company | 20217 |
9 |
| FANUC Corporation | 7421 |
9 |
| Nippon Telegraph and Telephone Corporation | 15901 |
8 |
| ArcelorMittal | 2754 |
8 |
| The University of Tokyo | 4403 |
8 |
| Samsung Electronics Co., Ltd. | 159473 |
7 |
| Other owners | 1083 |