- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/36 - Removing material
Patent holdings for IPC class B23K 26/36
Total number of patents in this class: 1304
10-year publication summary
|
70
|
63
|
57
|
72
|
79
|
87
|
64
|
85
|
72
|
62
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 18861 |
40 |
| Seurat Technologies, Inc. | 160 |
33 |
| Disco Corporation | 1869 |
24 |
| Electro Scientific Industries, Inc. | 369 |
24 |
| Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6121 |
16 |
| Corning Incorporated | 10300 |
15 |
| Tokyo Electron Limited | 12877 |
13 |
| Alltec angewandte Laserlicht Technologie GmbH | 95 |
12 |
| Hamamatsu Photonics K.K. | 4446 |
11 |
| General Electric Company | 13845 |
10 |
| Robert Bosch GmbH | 42813 |
10 |
| The Boeing Company | 20117 |
9 |
| Samsung Display Co., Ltd. | 35171 |
8 |
| Nikon Corporation | 7213 |
8 |
| Nippon Telegraph and Telephone Corporation | 17371 |
8 |
| TOYOKOH, Co., Ltd. | 25 |
8 |
| Boe Technology Group Co., Ltd. | 41495 |
7 |
| Amada Holdings Co., Ltd. | 277 |
7 |
| IPG Photonics Corporation | 539 |
7 |
| TRUMPF Laser- und Systemtechnik GmbH | 533 |
7 |
| Other owners | 1027 |