- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/36 - Removing material
Patent holdings for IPC class B23K 26/36
Total number of patents in this class: 1339
10-year publication summary
|
63
|
57
|
72
|
79
|
87
|
65
|
85
|
73
|
89
|
8
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Applied Materials, Inc. | 19531 |
40 |
| Seurat Technologies, Inc. | 164 |
34 |
| Disco Corporation | 1919 |
24 |
| Electro Scientific Industries, Inc. | 365 |
24 |
| Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6117 |
17 |
| Tokyo Electron Limited | 13324 |
15 |
| Corning Incorporated | 10350 |
15 |
| Alltec angewandte Laserlicht Technologie GmbH | 97 |
12 |
| Hamamatsu Photonics K.K. | 4554 |
11 |
| Robert Bosch GmbH | 43213 |
10 |
| TOYOKOH, Co., Ltd. | 27 |
10 |
| General Electric Company | 13798 |
9 |
| The Boeing Company | 20085 |
9 |
| Nikon Corporation | 7269 |
9 |
| Samsung Display Co., Ltd. | 37068 |
8 |
| Nippon Telegraph and Telephone Corporation | 16263 |
8 |
| Samsung Electronics Co., Ltd. | 150751 |
7 |
| Amada Holdings Co., Ltd. | 277 |
7 |
| IPG Photonics Corporation | 565 |
7 |
| TRUMPF Laser- und Systemtechnik GmbH | 532 |
7 |
| Other owners | 1056 |