- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/386 - Removing material by boring or cutting by boring of blind holes
Patent holdings for IPC class B23K 26/386
Total number of patents in this class: 65
10-year publication summary
|
16
|
10
|
4
|
8
|
5
|
6
|
6
|
6
|
2
|
6
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Omron Corporation | 7263 |
10 |
| Corning Incorporated | 10263 |
6 |
| Skyworks Solutions, Inc. | 3727 |
5 |
| Applied Materials, Inc. | 18658 |
3 |
| Rtx Corporation | 9385 |
3 |
| Disco Corporation | 1860 |
2 |
| Eissmann Automotive Deutschland GmbH | 30 |
2 |
| Electro Scientific Industries, Inc. | 372 |
2 |
| Mitsui Mining & Smelting Co., Ltd. | 1486 |
2 |
| SCHOTT AG | 1712 |
2 |
| Samsung Electronics Co., Ltd. | 146346 |
1 |
| Samsung Display Co., Ltd. | 34798 |
1 |
| The Boeing Company | 20053 |
1 |
| Infineon Technologies AG | 8225 |
1 |
| Mitsubishi Electric Corporation | 46127 |
1 |
| Boston Scientific Scimed, Inc. | 10280 |
1 |
| Murata Manufacturing Co., Ltd. | 24542 |
1 |
| Kyocera Corporation | 13831 |
1 |
| Schaeffler Technologies AG & Co. KG | 9882 |
1 |
| IPG Photonics Corporation | 529 |
1 |
| Other owners | 18 |