- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/386 - Removing material by boring or cutting by boring of blind holes
Patent holdings for IPC class B23K 26/386
Total number of patents in this class: 66
10-year publication summary
|
10
|
4
|
8
|
5
|
6
|
6
|
6
|
2
|
7
|
1
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Omron Corporation | 7332 |
10 |
| Corning Incorporated | 10390 |
6 |
| Skyworks Solutions, Inc. | 3854 |
5 |
| Applied Materials, Inc. | 19683 |
4 |
| Rtx Corporation | 9761 |
3 |
| Disco Corporation | 1916 |
2 |
| Eissmann Automotive Deutschland GmbH | 29 |
2 |
| Electro Scientific Industries, Inc. | 365 |
2 |
| Mitsui Mining & Smelting Co., Ltd. | 1398 |
2 |
| SCHOTT AG | 1715 |
2 |
| Samsung Electronics Co., Ltd. | 151485 |
1 |
| Samsung Display Co., Ltd. | 37252 |
1 |
| The Boeing Company | 20106 |
1 |
| Infineon Technologies AG | 8319 |
1 |
| Mitsubishi Electric Corporation | 47352 |
1 |
| Boston Scientific Scimed, Inc. | 10763 |
1 |
| Murata Manufacturing Co., Ltd. | 25252 |
1 |
| Kyocera Corporation | 14186 |
1 |
| Schaeffler Technologies AG & Co. KG | 10539 |
1 |
| Qualicaps Co., Ltd. | 136 |
1 |
| Other owners | 18 |