- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 3/00 - Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
Patent holdings for IPC class B23K 3/00
Total number of patents in this class: 362
10-year publication summary
|
16
|
17
|
37
|
49
|
32
|
31
|
35
|
27
|
18
|
8
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Senju Metal Industry Co., Ltd. | 689 |
17 |
| Illinois Tool Works Inc. | 11863 |
16 |
| ERSA GmbH | 59 |
12 |
| Fuji Corporation | 3647 |
12 |
| Samsung Electronics Co., Ltd. | 157719 |
11 |
| Hakko Corporation | 113 |
11 |
| OK International Inc. | 13 |
10 |
| Shinkawa Ltd. | 413 |
10 |
| Mitsubishi Electric Corporation | 48018 |
9 |
| Denso Corporation | 25534 |
7 |
| Panasonic Intellectual Property Management Co., Ltd. | 33997 |
7 |
| Shandong Caiju Electronic Technology Co., Ltd | 12 |
6 |
| International Business Machines Corporation | 62634 |
5 |
| Hubbell Incorporated | 3442 |
5 |
| Apex Brands, Inc. | 766 |
5 |
| FANUC Corporation | 7217 |
5 |
| Kulicke and Soffa Industries, Inc. | 337 |
5 |
| Daikin Industries, Ltd. | 10499 |
4 |
| Hitachi, Ltd. | 16094 |
3 |
| Tyco Electronics (shanghai) Co. Ltd. | 1063 |
3 |
| Other owners | 199 |