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2024
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Invention
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Capillary supply module, capillary provision mechanism, and wire bonding device. This supply modu... |
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Invention
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Capillary replacement mechanism and wire bonding device. In the present invention, a capillary re... |
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Invention
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Bonding device. This bonding device comprises: a notch generation unit that moves a first blade a... |
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Invention
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Bonding device, method, and program. The present invention is provided with: a rail member that h... |
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Invention
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Capillary replacement mechanism and wire bonding device. According to the present invention, a ca... |
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Invention
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Capillary replacement method and wire bonding device. A capillary replacement method according to... |
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Invention
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Wire bonding device. This wire bonding device comprises: a horn unit that includes a horn in whic... |
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Invention
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Wire bonding device. This wire bonding device comprises: a capillary; an ultrasonic vibrator; a c... |
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Invention
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Wire bonding device and recovery method. A wire bonding device for performing wire bonding on a p... |
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Invention
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Flux supply device and flux supply method. This flux supply device comprises: a flux pot that ret... |
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Invention
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Production device for semiconductor device. A production device (10) is equipped with a base (12)... |
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Invention
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Mounting device and method for detecting displacement of bonding head provided to mounting device... |
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Invention
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Wire bonding device and method for calibrating same. Provided is a method for calibrating a wire ... |
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Invention
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Wire bonding device, wire bonding method, and wire bonding program. A wire bonding device (1) com... |
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Invention
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Method for manufacturing semiconductor device. This method for manufacturing a semiconductor devi... |
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2023
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Invention
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Clamp device, and control method and control program for same. A wire clamp device (70) comprises... |
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Invention
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Mounting device, mounting method, and mounting control program. Provided is a mounting device equ... |
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Invention
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Mounting device, mounting method, and mounting control program. Provided is a mounting device com... |
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Invention
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Device for manufacturing semiconductor device and method for suctioning member. This device for m... |
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Invention
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Horn unit, ultrasonic horn and jig. A horn unit equipped with an ultrasonic horn (10) and a jig (... |
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Invention
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Manufacturing apparatus for semiconductor device and manufacturing method. A manufacturing appara... |
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Invention
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Semiconductor device manufacturing device and manufacturing method. A semiconductor device manufa... |
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Invention
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Three-phase coil structure and linear motor.
A three-phase coil structure (30) having a two-phas... |
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2022
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Invention
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Bonding apparatus, bonding method, and recording medium.
A bonding apparatus 1 comprises: a bond... |
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Invention
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Bonding apparatus, bonding method, and bonding control program. A bonding apparatus 1 comprises: ... |
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Invention
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Inspection device, mounting apparatus, inspection method, and non-transitory computer readable re... |
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2021
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Invention
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Manufacturing apparatus of semiconductor device. A manufacturing apparatus (10) for manufacturing... |
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Invention
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Mounting apparatus, mounting method, and recording medium.
A mounting apparatus includes a mount... |
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Invention
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Mounting apparatus, mounting method, and recording medium.
A mounting apparatus obtains calibrat... |
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Invention
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Wire tension adjustment method and wire tension adjuster. f) of a bonding arm (14) is detected, a... |
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Invention
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Pin wire forming method, wire bonding apparatus, and bonding tool.
The present invention include... |
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Invention
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Bonding apparatus and alignment method. A bonding apparatus includes: a clamper able to clamp a w... |
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Invention
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Flux transfer apparatus, flux transfer method, and mounting apparatus.
A flux transfer apparatus... |
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Invention
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Resistance wire abnormality detection device. An electric circuit abnormality detection device in... |
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Invention
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Flux transfer apparatus. A flux transfer apparatus (100) includes: a stage (12), having a concave... |
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Invention
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Manufacturing apparatus and manufacturing method of semiconductor device.
A wire bonding apparat... |
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Invention
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Bump-forming device, bump-forming method, and non-transitory computer-readable medium.
A bump-fo... |
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Invention
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Ultrasonic composite vibration device and manufacturing apparatus of semiconductor device.
An ul... |
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Invention
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Wire bonding system, inspection device, wire bonding method, and recording medium.
A wire bondin... |
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Invention
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Wire bonding device, maintenance method and non-transitory computer-readable recording medium rec... |
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Invention
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Manufacturing apparatus of semiconductor device and manufacturing method of semiconductor device.... |
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Invention
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Conveyance device, conveyance method, and non-transitory computer readable medium.
This conveyan... |
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Invention
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Suction device, suction unit, suction method, and computer-readable recording medium.
A suction ... |
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Invention
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Mounting device, and method for detecting degree of parallelism of mounting device.
In this meth... |
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Invention
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Bonding apparatus and bonding method.
A bonding apparatus includes: a movable bonding head part ... |
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Invention
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Bonding apparatus, bonding method, and computer readable storage medium.
A bonding apparatus inc... |
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2020
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Invention
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Mounting head.
A mounting head for bonding a chip to a bonding target includes: a mounting tool ... |
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Invention
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Semiconductor device manufacturing method and manufacturing apparatus.
The semiconductor device ... |
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Invention
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Measurement device, measurement method, and bonding system.
The present invention can provide a ... |
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Invention
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Substrate holder and bonding system.
A bonding system (90) is provided with a bonding device (80... |
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2017
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G/S
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Semiconductor manufacturing machines and systems. Repair or maintenance of integrated circuits ma... |
