- All sections
- C - Chemistrymetallurgy
- C23C - Coating metallic materialcoating material with metallic materialsurface treatment of metallic material by diffusion into the surface, by chemical conversion or substitutioncoating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general
- C23C 18/52 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups
Patent holdings for IPC class C23C 18/52
Total number of patents in this class: 142
10-year publication summary
13
|
16
|
7
|
14
|
15
|
9
|
8
|
6
|
7
|
2
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Atotech Deutschland GmbH | 565 |
10 |
Tokyo Electron Limited | 12300 |
6 |
Lam Research Corporation | 5102 |
6 |
Murata Manufacturing Co., Ltd. | 24102 |
5 |
Mitsubishi Electric Corporation | 45328 |
4 |
Showa Denko K.K. | 2299 |
4 |
Toyo Kohan Co., Ltd. | 413 |
4 |
Japan Pure Chemical Co.,Ltd. | 19 |
4 |
Fundacion Cidetec | 61 |
3 |
JX Nippon Mining & Metals Corporation | 1510 |
3 |
Nantong Memtech Technologies Co., Ltd. | 19 |
3 |
Omron Corporation | 7193 |
2 |
Daicel Corporation | 2281 |
2 |
Electroplating Engineers of Japan Limited | 13 |
2 |
IHI Corporation | 3375 |
2 |
Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | 2869 |
2 |
Kojima Chemicals Co., Ltd. | 21 |
2 |
MacDermid Enthone Inc. | 235 |
2 |
Mitsubishi Materials Electronic Chemicals Co., Ltd. | 131 |
2 |
Sekisui Chemical Co., Ltd. | 3347 |
2 |
Other owners | 72 |