- All sections
- C - Chemistry; metallurgy
- C23F - Non-mechanical removal of metallic material from surfaces; inhibiting corrosion of metallic material; inhibiting incrustation in general; multi-step processes for surface treatment of metallic material involving at least one process provided for in class and at least one process covered by subclass or or class
- C23F 1/40 - Alkaline compositions for etching other metallic material
Patent holdings for IPC class C23F 1/40
Total number of patents in this class: 76
10-year publication summary
|
8
|
5
|
7
|
5
|
6
|
7
|
9
|
4
|
3
|
0
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Tokuyama Corporation | 1342 |
9 |
| FUJIFILM Corporation | 28555 |
7 |
| Atotech Deutschland GmbH | 566 |
4 |
| Shenzhen Candortech Incorporated Company | 6 |
4 |
| Hyundai Motor Company | 20442 |
3 |
| E. I. du Pont de Nemours and Company | 4251 |
2 |
| Kia Motors Corporation | 7777 |
2 |
| EKC Technology, Inc. | 67 |
2 |
| Entegris, Inc. | 1809 |
2 |
| Kanto Kagaku Kabushiki Kaisha | 86 |
2 |
| Toppan Printing Co., Ltd. | 2159 |
2 |
| Versum Materials US, LLC | 622 |
2 |
| Tech Met, Inc. | 16 |
2 |
| Kioxia Corporation | 10120 |
2 |
| Samsung Electronics Co., Ltd. | 138729 |
1 |
| The Boeing Company | 19909 |
1 |
| Sumitomo Electric Industries, Ltd. | 14956 |
1 |
| Tokyo Electron Limited | 12111 |
1 |
| Shin-Etsu Chemical Co., Ltd. | 5444 |
1 |
| Sumitomo Wiring Systems, Ltd. | 10011 |
1 |
| Other owners | 25 |