- All sections
- C - Chemistrymetallurgy
- C25D - Processes for the electrolytic or electrophoretic production of coatingselectroformingjoining workpieces by electrolysisapparatus therefor
- C25D 3/58 - ElectroplatingBaths therefor from solutions of alloys containing more than 50% by weight of copper
Patent holdings for IPC class C25D 3/58
Total number of patents in this class: 198
10-year publication summary
29
|
15
|
19
|
9
|
12
|
6
|
7
|
7
|
5
|
0
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
JX Nippon Mining & Metals Corporation | 1510 |
17 |
DuPont Electronic Materials International, LLC | 413 |
16 |
Atotech Deutschland GmbH | 565 |
15 |
BASF SE | 20570 |
11 |
Umicore Galvanotechnik GmbH | 57 |
9 |
Bridgestone Corporation | 7202 |
5 |
DIPSOL Chemicals Co., Ltd. | 63 |
5 |
Rohm and Haas Electronic Materials LLC | 168 |
5 |
The Swatch Group Research and Development Ltd | 815 |
5 |
The Royal Mint Limited | 21 |
4 |
Dow Global Technologies LLC | 10226 |
3 |
Colorado State University Research Foundation | 696 |
3 |
G. Aliprandini | 4 |
3 |
Ishihara Chemical Co., Ltd. | 64 |
3 |
3m Innovative Properties Company | 17860 |
2 |
The Furukawa Electric Co., Ltd. | 3611 |
2 |
Changzhou University | 176 |
2 |
China Banknote Printing and Minting Corporation | 95 |
2 |
Daiwa Fine Chemicals Co., Ltd. (laboratory) | 5 |
2 |
Electricite de France | 717 |
2 |
Other owners | 82 |