- All sections
- H - Electricity
- H01B - Cablesconductorsinsulatorsselection of materials for their conductive, insulating or dielectric properties
- H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
Patent holdings for IPC class H01B 1/22
Total number of patents in this class: 3818
10-year publication summary
|
359
|
324
|
336
|
317
|
254
|
207
|
197
|
184
|
147
|
105
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Sekisui Chemical Co., Ltd. | 3385 |
150 |
| Dowa Electronics Materials Co., Ltd. | 633 |
124 |
| E. I. du Pont de Nemours and Company | 4095 |
120 |
| Dexerials Corporation | 1962 |
110 |
| Hitachi Chemical Company, Ltd. | 2354 |
97 |
| Murata Manufacturing Co., Ltd. | 24465 |
86 |
| Solar Paste, LLC | 123 |
74 |
| Namics Corporation | 441 |
73 |
| Sumitomo Metal Mining Co., Ltd. | 1774 |
72 |
| Tatsuta Electric Wire & Cable Co., Ltd. | 406 |
61 |
| FUJIFILM Corporation | 29305 |
60 |
| LG Chem, Ltd. | 17598 |
49 |
| Tanaka Kikinzoku Kogyo K.K. | 584 |
46 |
| Henkel AG & Co. KGaA | 10535 |
44 |
| Shoei Chemical Inc. | 321 |
44 |
| Mitsui Mining & Smelting Co., Ltd. | 1479 |
42 |
| Changzhou Fusion New Material Co., Ltd. | 56 |
39 |
| Toyobo Co., Ltd. | 2488 |
38 |
| Resonac Corporation | 2769 |
34 |
| Celanese Mercury Holdings Inc. | 101 |
33 |
| Other owners | 2422 |