- All sections
- H - Electricity
- H01B - Cablesconductorsinsulatorsselection of materials for their conductive, insulating or dielectric properties
- H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
Patent holdings for IPC class H01B 1/22
Total number of patents in this class: 3886
10-year publication summary
|
321
|
331
|
313
|
253
|
204
|
196
|
186
|
153
|
163
|
31
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Sekisui Chemical Co., Ltd. | 3551 |
155 |
| Dowa Electronics Materials Co., Ltd. | 640 |
131 |
| E. I. du Pont de Nemours and Company | 3738 |
119 |
| Dexerials Corporation | 1983 |
115 |
| Hitachi Chemical Company, Ltd. | 2287 |
94 |
| Murata Manufacturing Co., Ltd. | 25398 |
94 |
| Namics Corporation | 472 |
77 |
| Sumitomo Metal Mining Co., Ltd. | 1922 |
76 |
| Solar Paste, LLC | 121 |
72 |
| Tatsuta Electric Wire & Cable Co., Ltd. | 417 |
62 |
| FUJIFILM Corporation | 30155 |
59 |
| LG Chem, Ltd. | 17786 |
49 |
| Tanaka Kikinzoku Kogyo K.K. | 573 |
46 |
| Henkel AG & Co. KGaA | 10710 |
45 |
| Shoei Chemical Inc. | 329 |
43 |
| Mitsui Mining & Smelting Co., Ltd. | 1388 |
39 |
| Changzhou Fusion New Material Co., Ltd. | 56 |
39 |
| Toyobo Co., Ltd. | 2504 |
38 |
| Resonac Corporation | 3148 |
35 |
| Daicel Corporation | 2450 |
33 |
| Other owners | 2465 |