- All sections
- H - Electricity
- H01B - Cablesconductorsinsulatorsselection of materials for their conductive, insulating or dielectric properties
- H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
Patent holdings for IPC class H01B 1/22
Total number of patents in this class: 3992
10-year publication summary
|
324
|
336
|
317
|
254
|
207
|
198
|
187
|
155
|
165
|
84
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Sekisui Chemical Co., Ltd. | 3603 |
160 |
| Dowa Electronics Materials Co., Ltd. | 635 |
131 |
| E. I. du Pont de Nemours and Company | 3553 |
119 |
| Dexerials Corporation | 2002 |
117 |
| Murata Manufacturing Co., Ltd. | 25708 |
97 |
| Hitachi Chemical Company, Ltd. | 2247 |
93 |
| Namics Corporation | 481 |
78 |
| Sumitomo Metal Mining Co., Ltd. | 1968 |
77 |
| Solar Paste, LLC | 120 |
71 |
| Tatsuta Electric Wire & Cable Co., Ltd. | 425 |
64 |
| FUJIFILM Corporation | 30479 |
59 |
| LG Chem, Ltd. | 17926 |
49 |
| Henkel AG & Co. KGaA | 10766 |
48 |
| Tanaka Kikinzoku Kogyo K.K. | 575 |
45 |
| Shoei Chemical Inc. | 332 |
42 |
| Changzhou Fusion New Material Co., Ltd. | 56 |
39 |
| Mitsui Mining & Smelting Co., Ltd. | 1342 |
38 |
| Toyobo Co., Ltd. | 2531 |
38 |
| Resonac Corporation | 3503 |
36 |
| Daicel Corporation | 2506 |
33 |
| Other owners | 2558 |