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2025
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Invention
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Electroconductive paste and stretchable conductor base material. This electroconductive paste con... |
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Invention
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Polymerizable composition, adhesive, sealing material, cured product, semiconductor device, and e... |
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Invention
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Curable resin composition, adhesive composition, cured product, semiconductor device, and electro... |
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Invention
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Conductive paste and solar cell. The present invention provides a conductive paste capable of for... |
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Invention
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Resin composition, adhesive agent, sealing material, cured product, semiconductor device, and ele... |
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Invention
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Insulating composition. R120R120 obtained by measuring solid content in the insulating compositio... |
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Invention
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Resin composition, adhesive, sealing material, cured product, semiconductor device, and electroni... |
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Invention
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Resin composition, thermosetting film using same, cured product of thermosetting film, and semico... |
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Invention
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Epoxy resin composition, cured product, semiconductor device, and method for producing semiconduc... |
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Invention
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Thermal latent polymerization initiator, resin composition containing same, adhesive, sealing mat... |
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Invention
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Film for adhesive layer, wiring board, multilayer wiring board, and semiconductor device. Provide... |
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Invention
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Thermosetting insulating film and multilayer insulating sheet. The present invention provides: a ... |
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Invention
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Conductive paste, conductor, contact sensor, and electronic component. 11) of a shape when an ele... |
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2024
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Invention
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Conductive paste, conductive film, ceramic circuit substrate, and electronic component. Provided ... |
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Invention
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Curable resin composition and method for producing same, adhesive, sealing material, cured produc... |
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Invention
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Epoxy resin composition, cured product, and semiconductor device. The present invention provides ... |
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Invention
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Copper member. A copper member, comprising a copper material and a protrusion formed on the surfa... |
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Invention
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Conductive paste and multilayer ceramic electronic component comprising external electrode formed... |
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Invention
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Method for manufacturing semiconductor device, and sealed body. CSCSCSS: the radius of the suppor... |
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Invention
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Resin composition, cured product, adhesive composition, and optical fiber array. The present inve... |
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Invention
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Resin composition, cured product, and optical fiber array. Provided is a resin composition for an... |
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Invention
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Resin composition, cured product, and optical fiber array. This invention provides a resin compos... |
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Invention
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Optical fiber array, optical waveguide module, method for reducing refractive index of adhesive l... |
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Invention
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Multilayer sheet and method for producing laminate. This invention prevents the occurrence of pee... |
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Invention
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Adhesive film, semiconductor device, and method for manufacturing semiconductor device. This inve... |
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Invention
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Method for producing hybrid quantum dot, hybrid quantum dot, energy storage device, energy genera... |
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Invention
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Liquid compression molding material, electronic component, semiconductor device, and method for m... |
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Invention
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Photocurable resin composition, adhesive, sealing material, coating agent, cured product, semicon... |
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Invention
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Liquid epoxy resin composition for use as mold underfill material for tsv.
An object of the pres... |
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Invention
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Epoxy resin composition, adhesive agent, sealing material, cured article, semiconductor device, a... |
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Invention
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Epoxy resin composition, adhesive, sealing material, cured product, semiconductor device, and ele... |
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Invention
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Electrically conductive paste, use of electrically conductive paste, solar cell, and method for p... |
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Invention
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Novel acrylamide, composition containing same, curable composition, adhesive, sealing material, c... |
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Invention
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Metal member. The purpose of the present invention is to provide a novel metal member. A metal me... |
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Invention
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Metal member. The objective of the present invention is to provide a novel metal member. A metal ... |
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Invention
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Liquid compression molding material, electronic component, and semiconductor device. The present ... |
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Invention
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Semiconductor device and resin composition. Provided are: a semiconductor device comprising an in... |
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Invention
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Resin composition, and inter-layer insulating adhesive film, laminated circuit board, electronic ... |
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2023
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Invention
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Epoxy resin composition, electronic component, semiconductor device, and semiconductor device man... |
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Invention
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Curable resin composition, adhesive, sealing material, cured product, semiconductor apparatus, an... |
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Invention
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Curable resin composition, adhesive, sealing material, cured product, semiconductor device, and e... |
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Invention
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Resin composition and curable resin composition using the same.
A resin composition includes (A)... |
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2022
|
Invention
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Resin composition, semiconductor device, and method for producing semiconductor device.
Provided... |
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|
Invention
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Epoxy resin composition, liquid compression mold material, glob-top material, and semiconductor d... |
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|
Invention
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Liquid compression molding material, electronic component, semiconductor device and method for pr... |
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Invention
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Resin composition, electrically conductive adhesive, cured object, and semiconductor device.
The... |
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2021
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G/S
|
Chemicals; industrial chemicals; soldering pastes
(chemicals); chemicals in paste form used in m... |
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G/S
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Industrial chemicals; chemicals in paste form used in manufacturing electronic circuits; chemical... |
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2012
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G/S
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Chemicals for use in the copper industry, namely, surface preparation agents for copper foil [us... |
|
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G/S
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Surface preparation agents for copper foil used for
manufacturing copper clad laminates; surface... |
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G/S
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Chemicals; chemicals (industrial); adhesives for industrial
purposes; conductive adhesives for i... |
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2011
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G/S
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Electric conductors, namely, conductive pastes for industrial purposes; electric conductors, name... |
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|
G/S
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Chemicals for use in industry; industrial chemicals; adhesives for industrial purposes; industria... |
|
|
G/S
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Insulating liquid sealants, namely underfill sealants, encapsulant sealants, chip resistor protec... |
|
|
G/S
|
Chemicals; chemicals (industrial); adhesives for industrial purposes; conductive pastes for indus... |
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2005
|
G/S
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Adhesives for semiconductors; adhesives, other than for stationery or household purposes Electric... |
|
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G/S
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Adhesives for semiconductors; adhesives (not for stationery
or household purposes). Conductive t... |
|
|
G/S
|
Conductive pastes for use with electronic components.
Conductive paste for use with electronic co... |
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|
G/S
|
Conductive pastes for use with electronic components.
Conductive films, tapes and sheets, namely,... |
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G/S
|
Conductive pastes for use in the manufacture of electronic components, namely, chip resisters, ch... |
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|
G/S
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Conductive pastes. |
|
|
G/S
|
Conductive pastes for use in the electrodes and circuits of various electronic parts and the inte... |
|
|
G/S
|
Conductive substances (chemicals); conductive materials (chemicals); chemical preparations having... |
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2004
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G/S
|
Paints for use in protecting the surfaces of electric and electronic parts |
|
|
G/S
|
Paints [ Precious metals ] |
|
|
G/S
|
Paints. Electrical insulating materials. |
|
|
G/S
|
Electrical insulating materials |
|
|
G/S
|
Paints Electrical insulating materials |
|
|
G/S
|
Paints. Precious metals. |
|
2001
|
G/S
|
Insulating paints for use in the manufacture of electrical components; insulating and protective ... |
|
|
G/S
|
Insulating paints; insulating and protective coating for semi-conductor; wire insulating tube; el... |
|
2000
|
G/S
|
EPOXY COMPOUNDS FOR UNDERFILLING AND/OR PROTECTIVE COATING OF ELECTRICAL COMPONENTS; EPOXY [ AND ... |
|
|
G/S
|
Electric insulating materials. |
|
1998
|
G/S
|
ADHESIVES AND CONDUCTIVE PASTES AND POWDERS FOR USE IN THE MANUFACTURE OF ELECTRONIC PARTS, DEVIC... |
|
|
G/S
|
Paints, pastes and powders for industrial purposes, especially epoxy/phenolic resin coating mater... |
