- All sections
- H - Electricity
- H01B - Cablesconductorsinsulatorsselection of materials for their conductive, insulating or dielectric properties
- H01B 17/66 - Joining insulating bodies together, e.g. by bonding
Patent holdings for IPC class H01B 17/66
Total number of patents in this class: 39
10-year publication summary
|
1
|
4
|
6
|
6
|
7
|
5
|
4
|
1
|
1
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Aptiv Technologies AG | 2416 |
4 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46813 |
2 |
| Jiangsu Shemar Electric Co., Ltd | 79 |
2 |
| Quanta Computer Inc. | 1409 |
2 |
| TE Connectivity Solutions GmbH | 2929 |
2 |
| Hitachi Energy Ltd. | 2418 |
2 |
| Siemens AG | 24329 |
1 |
| Sumitomo Electric Industries, Ltd. | 16000 |
1 |
| Yazaki Corporation | 6904 |
1 |
| Black & Decker, Inc. | 2419 |
1 |
| Sumitomo Wiring Systems, Ltd. | 10714 |
1 |
| Mitsui Chemicals, Inc. | 3224 |
1 |
| American Future Technology Corp. | 31 |
1 |
| AutoNetworks Technologies, Ltd. | 6883 |
1 |
| BAE SYSTEMS plc | 2440 |
1 |
| Cantega Technologies Inc. | 53 |
1 |
| HSP Hochspannungsgeräte GmbH | 142 |
1 |
| Power Feed-Thru Systems and Connectors,LLC | 19 |
1 |
| Schneider Electric Industries SAS | 1548 |
1 |
| University of Pittsburgh - Of the Commonwealth System of Higher Education | 3260 |
1 |
| Other owners | 11 |