- All sections
- H - Electricity
- H01B - Cablesconductorsinsulatorsselection of materials for their conductive, insulating or dielectric properties
- H01B 17/66 - Joining insulating bodies together, e.g. by bonding
Patent holdings for IPC class H01B 17/66
Total number of patents in this class: 38
10-year publication summary
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0
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1
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4
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6
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6
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7
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5
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4
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1
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0
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| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Aptiv Technologies AG | 2389 |
4 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 46069 |
2 |
| Jiangsu Shemar Electric Co., Ltd | 76 |
2 |
| Quanta Computer Inc. | 1378 |
2 |
| TE Connectivity Solutions GmbH | 2884 |
2 |
| Hitachi Energy Ltd. | 2320 |
2 |
| Siemens AG | 24337 |
1 |
| Sumitomo Electric Industries, Ltd. | 15750 |
1 |
| Yazaki Corporation | 6775 |
1 |
| Black & Decker, Inc. | 2403 |
1 |
| Sumitomo Wiring Systems, Ltd. | 10555 |
1 |
| Mitsui Chemicals, Inc. | 3229 |
1 |
| American Future Technology Corp. | 35 |
1 |
| AutoNetworks Technologies, Ltd. | 6739 |
1 |
| BAE SYSTEMS plc | 2386 |
1 |
| Cantega Technologies Inc. | 53 |
1 |
| HSP Hochspannungsgeräte GmbH | 138 |
1 |
| Power Feed-Thru Systems and Connectors,LLC | 18 |
1 |
| Schneider Electric Industries SAS | 1517 |
1 |
| University of Pittsburgh - Of the Commonwealth System of Higher Education | 3207 |
1 |
| Other owners | 10 |