- All sections
- H - Electricity
- H01C - Resistors
- H01C 1/022 - HousingEnclosingEmbeddingFilling the housing or enclosure the housing or enclosure being openable or separable from the resistive element
Patent holdings for IPC class H01C 1/022
Total number of patents in this class: 40
10-year publication summary
|
1
|
3
|
5
|
5
|
0
|
3
|
4
|
4
|
5
|
1
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| TDK Electronics AG | 923 |
4 |
| Epcos AG | 711 |
2 |
| Hubbell Incorporated | 3218 |
2 |
| Pizzato Elettrica S.r.l. | 96 |
2 |
| Ripd IP Assets Ltd | 2 |
2 |
| Heine Resistors GmbH | 9 |
2 |
| Fujikura Ltd. | 2911 |
1 |
| API Technologies Corp. | 6 |
1 |
| DBK David + Baader GmbH | 45 |
1 |
| EBG Elektronische Bauelemente Ges.m.b.H. | 15 |
1 |
| EXSENSE Electronics Technology Co., Ltd. | 8 |
1 |
| FEI Company | 931 |
1 |
| KOA Corporation | 415 |
1 |
| NR Electric Co., Ltd. | 319 |
1 |
| NR Engineering Co., Ltd | 281 |
1 |
| Otowa Electric Co., Ltd. | 31 |
1 |
| Phoenix Contact GmbH & Co. KG | 2265 |
1 |
| Sensata Technologies, Inc. | 399 |
1 |
| Smart Electronics Inc. | 37 |
1 |
| Taiwan Alpha Electronic Co., Ltd. | 18 |
1 |
| Other owners | 12 |